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Part No. |
AN-9037
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OCR Text |
.../3.0au/0.5cu, commonly known as sac 305, is ??the lead free solder paste alloy of choice for the electronics industry?. type 3 no-clean paste, sac 305 alloy, was used for the construction of the boards studied to optimize the process. ... |
Description |
8x8 MLP DriverMOS Packaging
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File Size |
749.51K /
7 Page |
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Motorola Semiconductor Products
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Part No. |
MPL015A2
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OCR Text |
...e solder recommendations 1. use sac solder alloy (i.e., sn-ag-cu) with a meltin g point of about 217c. it is recommended to use sac305 (i.e., sn-3.0 wt.% ag-0.5 wt.% cu). 2. reflow ? ramp up rate: 2 to 3 c/s. ? preheat flat (soak): 110 to... |
Description |
Digital Barometer
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File Size |
134.54K /
8 Page |
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SAMSUNG SEMICONDUCTOR CO. LTD. Samsung Semiconductor Co., Ltd.
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Part No. |
K3S7V2000M-TC15 K3S7V2000M-TC12 K3S7V2000M-TC10 K3S7V2000M-TC20 K3S7V2000M-TC30
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OCR Text |
...s latency=2, cas latency=5) t sac : 6ns default mode by user requirement mrs cycle with address key programs -. ras latency(1 & 2) -. cas latency(3 ~ 6) -. burst length : 4, 8 -. burst type : sequential & interlea... |
Description |
64M-Bit (4Mx16 /2Mx32) Synchronous MASKROM 6400位(4Mx16 / 2Mx32)同步MASKROM 2M X 32 MASK PROM, 6 ns, PDSO86
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File Size |
1,083.95K /
27 Page |
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