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KEMET[Kemet Corporation]
KEMET, Corp.
Mini-Circuits
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| Part No. |
CDR32BX129BDWR CDR01BP101ABSM CDR01BP101ABSP CDR01BP101ABSR CDR01BP101ABUM CDR01BP101ABUP CDR01BP101ABUR CDR01BP101ABWM CDR01BP101ABWP CDR01BP101ABWR CDR01BP101ACSM CDR01BP101ACSP CDR01BP101ACSR CDR01BP101ACUM CDR01BP101ACUP CDR01BP101ACUR CDR01BP101ACWM CDR01BP101ACWP CDR01BP101ACWR CDR01BP101ADSM CDR01BP101ADSP CDR01BP101ADSR CDR01BP101ADUM CDR01BP101ADUP CDR01BP101ADUR CDR01BP101ADWM CDR01BP101ADWP CDR01BP101ADWR CDR01BP101BBSM CDR01BP101BBSP CDR01BP101BBSR CDR01BP101BBUM CDR01BP101BBUP CDR01BP101BBUR CDR01BP101BBWM CDR01BP101BBWP CDR01BP101BBWR CDR01BP101BCSM CDR01BP101BCSP CDR01BP101BCSR CDR01BP101BCUM CDR01BP101BCUP CDR01BP101BCUR CDR01BP101BCWM CDR01BP101BCWP CDR01BP101BCWR CDR01BP101BDSM CDR01BP101BDSP CDR01BP101BDSR CDR01BP101BDUM CDR01BP101BDUP CDR01BP101BDUR CDR01BP101BDWM CDR01BP101BDWP CDR01BP101BDWR CDR01BP109ABSM CDR01BP109ABSP CDR01BP109ABSR CDR01BP109ABUM CDR01BP109ABUP CDR01BP109ABUR CDR01BP109ABWM CDR01BP109ABWP CDR01BP109ABWR CDR01BP109ACSM CDR01BP109ACSP CDR01BP109ACSR CDR01BP109ACUM CDR01BP109ACUP CDR01BP109ACUR CDR01BP109ACWM CDR01BP109ACWP CDR01BP109ACWR CDR01BP109ADSM CDR01BP109ADSP CDR01BP109ADSR CDR01BP109ADUM CDR01BP109ADUP CDR01BP109ADUR CDR01BP109ADWM
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| OCR Text |
...quiv: Y, W) H -- SolderGuard I (sn60) (Military equiv: S, U)
SPECIFICATION
P -MIL-PRF-55681 = CDR01-CDR06 N-MIL-PRF-55681 = CDR31-CDR35
FAILURE RATE (%/1,000 hrs.)
M -- 1.0 P -- 0.1 R -- 0.01 S -- 0.001
CAPACITANCE CODE
Expresse... |
| Description |
CERAMIC CHIP/MIL-PRF-55681
CAPACITOR, CERAMIC, MULTILAYER, 50 V, BX, 0.39 uF, SURFACE MOUNT, 1825 CHIP
CAPACITOR, CERAMIC, MULTILAYER, 50 V, BX, 0.27 uF, SURFACE MOUNT, 1825 CHIP
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| File Size |
959.72K /
10 Page |
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it Online |
Download Datasheet
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Hi-Sincerity Mocroelectronics Corp.
HSMC[Hi-Sincerity Mocroelectronics]
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| Part No. |
H01N45A
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| OCR Text |
...aterial: * Lead solder plating: sn60/Pb40 (Normal), Sn/3.0Ag/0.5Cu or Pure-Tin (Pb-free) * Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0
DIM A B C D E F G H I 1 2 3
Min. 4.33 4.33 12.70 0.36 3.36 0.36 -
... |
| Description |
N-channel High Voltage MOSFET
N-Channel Power Field Effect Transistor
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| File Size |
42.87K /
4 Page |
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it Online |
Download Datasheet |
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AMI[AMI SEMICONDUCTOR]
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| Part No. |
AMIS-710401
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| OCR Text |
...s Distance
MTF (%)
SN2028 sn60
AMI Semiconductor - Jun. 06, M-20589-001 www.amis.com
6
AMIS710401-A4: 400dpi CIS Module
Red 600nm LED Light Source
Data Sheet
11.0 Timing Characteristics at 25C
The timing characteristi... |
| Description |
400dpi CIS Module
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| File Size |
199.70K /
9 Page |
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it Online |
Download Datasheet |
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HB[HB Electronic Components]
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| Part No. |
1206KYCT
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| OCR Text |
...sipation of iron : 20W Max. use sn60 solder of solder with silver content and don't to touch LED lens when soldering.
DRAWING NO. : DS-71-04-0005
DATE : 2004-06-07
PAGE 8 of 10
SURFACE MOUNT DEVICE LED Part No. : 1206KYCT
REV:B... |
| Description |
SURFACE MOUNT DEVICE LED
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| File Size |
681.89K /
10 Page |
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it Online |
Download Datasheet |
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HI-SINCERITY MICROELECTRONICS, CORP.
HSMC[Hi-Sincerity Mocroelectronics]
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| Part No. |
HLB125HE
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| OCR Text |
...aterial: * Lead solder plating: sn60/Pb40 (Normal), Sn/3.0Ag/0.5Cu or Pure-Tin (Pb-free) * Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0
DIM A B C D E F G H I J K L M N O P
Min. 5.58 8.38 4.40 1.15 0.35 ... |
| Description |
NPN EPITAXIAL PLANAR TRANSISTOR 瑞展晶体
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| File Size |
48.96K /
5 Page |
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it Online |
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HSMC[Hi-Sincerity Mocroelectronics]
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| Part No. |
HMBT468
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| OCR Text |
...aterial: * Lead solder plating: sn60/Pb40 (Normal), Sn/3.0Ag/0.5Cu or Pure-Tin (Pb-free) * Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0
V
G
DIM A B C D G H J K L S V
Min. 2.80 1.20 0.89 0.30 1.70 ... |
| Description |
NPN EPITAXIAL PLANAR TRANSISTOR
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| File Size |
40.00K /
5 Page |
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it Online |
Download Datasheet |
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Price and Availability
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