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Amphenol Communications Solutions |
Part No. |
68000-331HLF
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Description |
BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Double Row, 31 Positions, 2.54 mm (0.100in) Pitch
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
68000-336HLF
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Description |
BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Double Row, 36 Positions, 2.54 mm (0.100in) Pitch
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Tech specs |
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Official Product Page
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Syfer Technology, Ltd.
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Part No. |
0805Y2000333KXT 1808Y2000333KXB 1206F0250224KXB 1206F0250224KXT
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Description |
CAPACITOR, CERAMIC, MULTILAYER, 200 V, X7R, 0.033 uF, SURFACE MOUNT, 0805 CHIP, ROHS COMPLIANT CAPACITOR, CERAMIC, MULTILAYER, 200 V, X7R, 0.033 uF, SURFACE MOUNT, 1808 CHIP, ROHS COMPLIANT CAPACITOR, CERAMIC, MULTILAYER, 25 V, X7R, 0.22 uF, SURFACE MOUNT, 1206 CHIP, ROHS COMPLIANT
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File Size |
162.76K /
1 Page |
View
it Online |
Download Datasheet |
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Bom2Buy.com
Price and Availability
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