0438 pdf Datasheet P10 Part Num --- IC-ON-LINE


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0438 Datasheet PDF File

For 0438 Found Datasheets File :: 150+ Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | <10> | 11 | 12 | 13 | 14 | 15 |

					SAMSUNG[Samsung semiconductor]
Part No.	K4H560838E-NLB3 K4H560438E-NC K4H560438E-NC_LA2 K4H560438E-NC_LB0 K4H560438E-NC_LB3 K4H560438E-NCA2 K4H560438E-NCB0 K4H560438E-NCB3 K4H560438E-NLA2 K4H560438E-NLB0 K4H560438E-NLB3 K4H560838E-NC_LA2 K4H560838E-NC_LB0 K4H560838E-NC_LB3 K4H560838E-NCA2 K4H560838E-NCB0 K4H560838E-NCB3 K4H560838E-NLA2 K4H560838E-NLB0
Description	256Mb E-die DDR SDRAM Specification 54pin sTSOP(II)
File Size	212.16K / 24 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	77317-404-38LF
Description	BergStik®, Board to Board connector, Unshrouded Right angle Header, Through Hole, Double Row, 38 Positions ,2.54mm (0.100in) Pitch,
Tech specs				Official Product Page

HUA FENG CIRCUIT

					SAMSUNG[Samsung semiconductor]
Part No.	K4H560838E-GLB3 K4H560438E-GC K4H560438E-GC_LA2 K4H560438E-GC_LB0 K4H560438E-GC_LB3 K4H560438E-GCA2 K4H560438E-GCB0 K4H560438E-GCB3 K4H560438E-GLA2 K4H560438E-GLB0 K4H560438E-GLB3 K4H560838E-GC_LA2 K4H560838E-GC_LB0 K4H560838E-GC_LB3 K4H560838E-GCA2 K4H560838E-GCB0 K4H560838E-GCB3 K4H560838E-GLA2 K4H560838E-GLB0
Description	256Mb E-die DDR SDRAM Specification 60Ball FBGA (x4/x8)
File Size	241.25K / 24 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	68020-438HLF
Description	BergStik®, Board to Board connector, Unshrouded Right angled Header, Through Hole, Double Row, 38 Positions, 2.54mm (0.100in) Pitch.
Tech specs				Official Product Page

					Molex Electronics Ltd.
Part No.	5019390503 501939-0500 501939-0436 501939-0503 501939-0537 501939-0534 501939-0339 501939-0439 501939-0536 501939-0539 501939-0330 501939-0336 501939-0430 501939-0438 501939-0431 501939-0437 501939-0532 501939-0337 501939-0338 501939-0533 501939-0538
Description	1.0 WIRE TO BOARD CONN. 1-ROW RECPTACLE HOUSING POSITIVE LOCK
File Size	131.20K / 2 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	77317-104-38LF
Description	BergStik®, Board to Board connector, Unshrouded Right angle Header, Through Hole, Double Row, 38 Positions ,2.54mm (0.100in) Pitch,
Tech specs				Official Product Page

					Samsung Semiconductor Co., Ltd. SAMSUNG SEMICONDUCTOR CO. LTD.
Part No.	K4H560438E-NC/LA2 K4H560838E-NC/LA2 K4H560438E-NC/LB0 K4H560838E-NC/LB0 K4H560438E-NC/LB3 K4H560838E-NC/LB3 K4H560438E-NCA2 K4H560438E-NCB0 K4H560838E-NCA2 K4H560438E-NCB3 K4H560838E-NCB0 K4H560838E-NCB3 K4H560838E-NLB0 K4H560438E-NLB3 K4H560438E-NLB0 K4H560838E-NLB3 K4H560838E-NLA2
Description	256Mb E-die DDR SDRAM Specification 54pin sTSOP(II) 256Mb的电子芯片DDR SDRAM内存规格54pin sTSOP（二 DIODE ZENER SINGLE 300mW 43Vz 5mA-Izt 0.02 0.05uA-Ir 33 SOT-23 3K/REEL 256Mb的电子芯片DDR SDRAM内存规格54pin sTSOP（二 Quad Wide Bandwidth High Output Drive Single Supply Op Amp 20-HTSSOP 0 to 70 Quad Wide Bandwidth High Output Drive Single Supply Op Amp 16-SOIC -40 to 125 10-Bit, 32 kSPS ADC Serial Out, uProcessor Periph./Standalone, 11 Ch. 20-SOIC 256Mb E-die DDR SDRAM Specification 54pin sTSOP(II)
File Size	216.89K / 24 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	51940-438LF
Description	PwrBlade®, Power Supply Connectors, 8P 44S 8P Vertical Receptacle.
Tech specs				Official Product Page

					SAMSUNG[Samsung semiconductor]
Part No.	K4H560838E-VLB3 K4H560438E-VC K4H560438E-VC_LA2 K4H560438E-VC_LB0 K4H560438E-VC_LB3 K4H560438E-VCA2 K4H560438E-VCB0 K4H560438E-VCB3 K4H560438E-VLA2 K4H560438E-VLB0 K4H560438E-VLB3 K4H560838E-VC_LA2 K4H560838E-VC_LB0 K4H560838E-VC_LB3 K4H560838E-VCA2 K4H560838E-VCB0 K4H560838E-VCB3 K4H560838E-VLA2 K4H560838E-VLB0
Description	256Mb E-die DDR SDRAM Specification 54 sTSOP-II with Pb-Free (RoHS compliant)
File Size	294.46K / 23 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	68690-438HLF
Description	BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 38 Positions, 2.54 mm (0.100in)Pitch.
Tech specs				Official Product Page

					SAMSUNG[Samsung semiconductor]
Part No.	K4H560838E-ZLB3 K4H560438E-ZC K4H560438E-ZC_LA2 K4H560438E-ZC_LB0 K4H560438E-ZC_LB3 K4H560438E-ZCA2 K4H560438E-ZCB0 K4H560438E-ZCB3 K4H560438E-ZLA2 K4H560438E-ZLB0 K4H560438E-ZLB3 K4H560838E-ZC_LA2 K4H560838E-ZC_LB0 K4H560838E-ZC_LB3 K4H560838E-ZCA2 K4H560838E-ZCB0 K4H560838E-ZCB3 K4H560838E-ZLA2 K4H560838E-ZLB0
Description	256Mb E-die DDR SDRAM Specification 60 FBGA with Pb-Free (RoHS compliant)
File Size	355.74K / 23 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	87900-438HLF
Description	BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 38 Positions, 2.54 mm Pitch, Vertical, 18.29 mm (0.72in) Mating, 3.05 mm (0.12in) Tail.
Tech specs				Official Product Page

					Samsung Electronic SAMSUNG[Samsung semiconductor]
Part No.	K4H560838E K4H560838E-TC_LB3 K4H560438E-TC_LA2 K4H560438E-TC_LAA K4H560438E-TC_LB0 K4H560438E-TC_LB3 K4H560838E-TC_LA2 K4H560838E-TC_LAA K4H560838E-TC_LB0 K4H560838E-TC/LA2 K4H560838E-TC/LAA K4H560838E-TC/LB0 K4H560838E-TC/LB3
Description	DDR SDRAM 256Mb E-die (x4, x8)
File Size	211.78K / 24 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	10144517-043802LF
Description	BergStak® Lite 0.80mm, Board-to-Board Connector, 40 Positions, Dual Row, Vertical Receptacle.
Tech specs				Official Product Page

					Samsung Semiconductor Co., Ltd. SAMSUNG SEMICONDUCTOR CO. LTD.
Part No.	K4H560438D-NC/LA0 K4H560838D-NC/LA0 K4H560438D-NC/LA2 K4H560838D-NC/LA2 K4H560438D-NC/LB0 K4H560838D-NC/LB0 K4H560438D-NC/LB3 K4H560838D-NC/LB3
Description	256Mb sTSOPII 256Mb的sTSOPII DIODE ZENER SINGLE 300mW 10Vz 20mA-Izt 0.02513 0.1uA-Ir 8 SOT-23 3K/REEL DIODE ZENER SINGLE 200mW 9.1Vz 20mA-Izt 0.02592 0.1uA-Ir 7 SOD-323 3K/REEL DIODE ZENER TRIPLE ISOLATED 200mW 9.95Vz 20mA-Izt 0.02513 0.1uA-Ir 8 SOT-363 3K/REEL
File Size	93.90K / 18 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	10043857-202LF
Description	400 Position BGA Plug, 0mm Component Height, 1.27mm x 1.27mm Array, Lead-free
Tech specs				Official Product Page

					Samsung Electronic SAMSUNG[Samsung semiconductor]
Part No.	K4H560838D-NC_LA0 K4H560838D-NC_LA2 K4H560838D-NC_LB0 K4H560838D-NC_LB3 K4H560438D-NC_LB3 K4H560438D-NC K4H560438D-NC_LA0 K4H560438D-NC_LA2 K4H560438D-NC_LB0 K4H560438D-NC/LA0 K4H560438D-NC/LA2 K4H560438D-NC/LB0 K4H560438D-NC/LB3 K4H560838D-NC/LA0 K4H560838D-NC/LA2 K4H560838D-NC/LB0 K4H560838D-NC/LB3
Description	256MB STSOPII
File Size	89.94K / 18 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	10144518-043802LF
Description	BergStak® Lite 0.80mm, Board-to-Board Connector, 40 Positions, Dual Row, Vertical Header.
Tech specs				Official Product Page

					Samsung Semiconductor Co., Ltd. SAMSUNG SEMICONDUCTOR CO. LTD.
Part No.	K4H280438F-TC/LA0 K4H280838F-TC/LA2 K4H280838F-TC/LB3 K4H280438F-TC/LA2 K4H280838F-TC/LB0 K4H280438F-TC/LB0
Description	128Mb F-die DDR SDRAM Specification 128Mb的的F - DDR SDRAM内存芯片规格 RESISTOR, 2M OHM, 0.063W, 1%
File Size	208.51K / 23 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	86840-438HLF
Description	BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 38 Positions, 2.54 mm Pitch, Right Angle, 8.08 mm (0.318in) Mating, 5.84 mm (0.23in) Tail.
Tech specs				Official Product Page

For 0438 Found Datasheets File :: 150+ Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | <10> | 11 | 12 | 13 | 14 | 15 |

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