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  0438 Datasheet PDF File

For 0438 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | <11> | 12 | 13 | 14 | 15 |   

    SAMSUNG[Samsung semiconductor]
Part No. K4H1G0838M-ULB3 K4H1G0438M-LA2 K4H1G0438M-LB0 K4H1G0438M-LB3 K4H1G0438M-UC K4H1G0438M-UC_LA2 K4H1G0438M-UC_LB0 K4H1G0438M-UC_LB3 K4H1G0438M-UC0 K4H1G0438M-UC2 K4H1G0438M-UC3 K4H1G0438M-UCA2 K4H1G0438M-UCB0 K4H1G0438M-UCB3 K4H1G0438M-ULA2 K4H1G0438M-ULB0 K4H1G0438M-ULB3 K4H1G0838M-LA2 K4H1G0838M-LB0 K4H1G0838M-LB3 K4H1G0838M-UC_LA2 K4H1G0838M-UC_LB0 K4H1G0838M-UC_LB3 K4H1G0838M-UC0 K4H1G0838M-UC2 K4H1G0838M-UC3 K4H1G0838M-UCA2 K4H1G0838M-UCB0 K4H1G0838M-UCB3 K4H1G0838M-ULA2 K4H1G0838M-ULB0
Description 1Gb M-die DDR SDRAM Specification 66 TSOP-II with Pb-Free (RoHS compliant)

File Size 203.93K  /  23 Page

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Amphenol Communications Solutions

Part No. 77317-404-38LF
Description BergStik®, Board to Board connector, Unshrouded Right angle Header, Through Hole, Double Row, 38 Positions ,2.54mm (0.100in) Pitch,
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    SAMSUNG SEMICONDUCTOR CO. LTD.
Samsung Semiconductor Co., Ltd.
Part No. K4H560438E-ULAA K4H560838E-ULAA K4H560438E-UCAA K4H560838E-UCAA K4H560438E-ULB0 K4H560438E-ULA2 K4H560438E-ULB3 K4H560438E-UC/LAA K4H560838E-ULB3 K4H560438E-UCB3 K4H560438E-UCB0 K4H560838E-UCB3 K4H560438E-UC/LA2 K4H560438E-UC/LB0 K4H560438E-UC/LB3 K4H560438E-UCA2 K4H560838E-UC/LB0 K4H560838E-UC/LA2 K4H560838E-UC/LB3 K4H560838E-UCB0 K4H560838E-UC/LAA K4H560838E-UCA2 K4H560838E-ULA2
Description 256Mb E-die DDR SDRAM Specification 66 TSOP-II with Pb-Free (RoHS compliant) 256Mb的电子芯片与DDR SDRAM的规格铅66 TSOP-II免费(符合RoHS

File Size 298.78K  /  23 Page

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Amphenol Communications Solutions

Part No. 68020-438HLF
Description BergStik®, Board to Board connector, Unshrouded Right angled Header, Through Hole, Double Row, 38 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    SAMSUNG[Samsung semiconductor]
Part No. K4H560838E-ULB3 K4H560438E-UC K4H560438E-UC_LA2 K4H560438E-UC_LAA K4H560438E-UC_LB0 K4H560438E-UC_LB3 K4H560438E-UCA2 K4H560438E-UCAA K4H560438E-UCB0 K4H560438E-UCB3 K4H560438E-ULA2 K4H560438E-ULAA K4H560438E-ULB0 K4H560438E-ULB3 K4H560838E-UC_LA2 K4H560838E-UC_LAA K4H560838E-UC_LB0 K4H560838E-UC_LB3 K4H560838E-UCA2 K4H560838E-UCAA K4H560838E-UCB0 K4H560838E-UCB3 K4H560838E-ULA2 K4H560838E-ULAA K4H560838E-ULB0
Description 256Mb E-die DDR SDRAM Specification 66 TSOP-II with Pb-Free (RoHS compliant)

File Size 294.24K  /  23 Page

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Amphenol Communications Solutions

Part No. 77317-104-38LF
Description BergStik®, Board to Board connector, Unshrouded Right angle Header, Through Hole, Double Row, 38 Positions ,2.54mm (0.100in) Pitch,
Tech specs    

Official Product Page

    SAMSUNG[Samsung semiconductor]
Part No. K4H280838F-ULB3 K4H280438F-UC K4H280438F-UCA0 K4H280438F-UCA2 K4H280438F-UCB0 K4H280438F-ULA0 K4H280438F-ULA2 K4H280438F-ULB0 K4H280838F-UCA2 K4H280838F-UCB0 K4H280838F-UCB3 K4H280838F-ULA2 K4H280838F-ULB0
Description 128Mb F-die DDR SDRAM Specification 66 TSOP-II with Pb-Free (RoHS compliant)

File Size 295.20K  /  23 Page

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Amphenol Communications Solutions

Part No. 51940-438LF
Description PwrBlade®, Power Supply Connectors, 8P 44S 8P Vertical Receptacle.
Tech specs    

Official Product Page

    SAMSUNG SEMICONDUCTOR CO. LTD.
Samsung Semiconductor Co., Ltd.
Part No. K4H280438F-ULA2 K4H280838F-UCB3 K4H280838F-ULB3 K4H280438F-UCA2 K4H280838F-UCA2 K4H280438F-UCB0 K4H280438F-UCA0 K4H280838F-UCB0 K4H280438F-ULA0 K4H280838F-ULB0 K4H280438F-UCB00
Description 128Mb F-die DDR SDRAM Specification 66 TSOP-II with Pb-Free (RoHS compliant) 128Mb的的F -模与铅DDR SDRAM的规6 TSOP-II免费(符合RoHS

File Size 299.74K  /  23 Page

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Amphenol Communications Solutions

Part No. 68690-438HLF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 38 Positions, 2.54 mm (0.100in)Pitch.
Tech specs    

Official Product Page

    K4H560438E-ZC/LA2 K4H560838E-ZC/LA2 K4H560438E-ZC/LB0 K4H560838E-ZC/LB0 K4H560438E-ZC/LB3 K4H560838E-ZC/LB3 K4H560838E-Z

Samsung Semiconductor Co., Ltd.
SAMSUNG SEMICONDUCTOR CO. LTD.
Part No. K4H560438E-ZC/LA2 K4H560838E-ZC/LA2 K4H560438E-ZC/LB0 K4H560838E-ZC/LB0 K4H560438E-ZC/LB3 K4H560838E-ZC/LB3 K4H560838E-ZCB3 K4H560438E-ZCB3 K4H560438E-ZLA2 K4H560838E-ZLA2 K4H560438E-ZCA2 K4H560838E-ZCB0 K4H560438E-ZCB0 K4H560838E-ZCA2 K4H560838E-ZLA20 K4H560438E-ZLA20
Description 64M X 4 DDR DRAM, 0.75 ns, PBGA60 ROHS COMPLIANT, FBGA-60
32M X 8 DDR DRAM, 0.75 ns, PBGA60 ROHS COMPLIANT, FBGA-60
CSM, CER 103PF 1000V 10% 1210
CAP, 10NF 1KV 10%, SMT, 1812
Connector Cover; Enclosure Material:Aluminum; Cable Diameter Max:25.4mm; Cable Diameter Min:20.32mm; Cable Entry:Top; For Use With:AVX/Elco 8016 Series Rack and Panel Rectangular Connectors with 90 Contacts RoHS Compliant: Yes
CONN MEMORY CARD HDR CF NORMAL
CONN EJECTOR COMPACTFLASH RIGHT
Rectangular Industrial Connector Housing; Series:C-146; No. of Contacts:10; Gender:Female; Body Material:Aluminum Alloy; Connecting Termination:Screw; For Use With:C146 Rectangular Circular Connectors; Operating Voltage:400V RoHS Compliant: Yes
COVER, SIDE ENTRY, 38WAY; For use with:8016 Series Rectangular Connectors; Material:Aluminium; Colour:Grey; Connector type:Dust Cap & Cover; Contacts, No. of:38; Ways, No. of:38 RoHS Compliant: Yes
Rectangular Industrial Connector Housing; Series:C-146; No. of Contacts:6; Gender:Female; Body Material:Aluminum Alloy; Connecting Termination:Screw; Features:Spring Cover; For Use With:C146 Rectangular Circular Connectors RoHS Compliant: Yes
256Mb E-die DDR SDRAM Specification 60 FBGA with Pb-Free (RoHS compliant)

File Size 360.28K  /  23 Page

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Amphenol Communications Solutions

Part No. 87900-438HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 38 Positions, 2.54 mm Pitch, Vertical, 18.29 mm (0.72in) Mating, 3.05 mm (0.12in) Tail.
Tech specs    

Official Product Page

    K4H560838E-VC/LB3 K4H560438E-VC/LB3 K4H560438E-VC/LA2 K4H560838E-VC/LA2 K4H560438E-VC/LB0 K4H560838E-VC/LB0 K4H560838E-V

Samsung Semiconductor Co., Ltd.
SAMSUNG SEMICONDUCTOR CO. LTD.
Part No. K4H560838E-VC/LB3 K4H560438E-VC/LB3 K4H560438E-VC/LA2 K4H560838E-VC/LA2 K4H560438E-VC/LB0 K4H560838E-VC/LB0 K4H560838E-VCA2 K4H560438E-VCA2 K4H560438E-VLB3 K4H560838E-VCB3 K4H560438E-VLB0 K4H560438E-VLA2 K4H560438E-VCB3 K4H560838E-VLB0 K4H560838E-VLA2 K4H560838E-VCB0 K4H560438E-VCB0 K4H560838E-VLB3
Description 256Mb E-die DDR SDRAM Specification 54 sTSOP-II with Pb-Free (RoHS compliant) 256Mb的电子芯片DDR SDRAM内存规格54 sTSOP与铅二无(符合RoHS

File Size 299.00K  /  23 Page

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Amphenol Communications Solutions

Part No. 10144517-043802LF
Description BergStak® Lite 0.80mm, Board-to-Board Connector, 40 Positions, Dual Row, Vertical Receptacle.
Tech specs    

Official Product Page

    K4H560838E-TC/LB0 K4H560838E-TC/LA2 K4H560838E-TC/LAA K4H560838E-TC/LB3 K4H560438E-TC/LB3 K4H560438E-TC/LB0 K4H560438E-T

Samsung Semiconductor Co., Ltd.
SAMSUNG SEMICONDUCTOR CO. LTD.
Part No. K4H560838E-TC/LB0 K4H560838E-TC/LA2 K4H560838E-TC/LAA K4H560838E-TC/LB3 K4H560438E-TC/LB3 K4H560438E-TC/LB0 K4H560438E-TC/LA2 K4H560438E-TC/LAA K4H560838E K4H560438E-TLAA K4H560838E-TCAA K4H560838E-TLAA K4H560438E-TCAA K4H560438E-TCB3 K4H560438E-TLB3
Description DDR SDRAM 256Mb E-die (x4, x8) 256Mb的DDR SDRAM的电子芯片(了x4,x8
Quad Wide Bandwidth High Output Drive Single Supply Op Amp 16-PDIP -40 to 125
256Mb E-die DDR SDRAM Specification 66 TSOP-II
Dual Micropower Precision Low-Voltage Operational Amplifier 8-SOIC -55 to 125
10-Bit, 32 kSPS ADC Serial Out, uProcessor Periph./Standalone, 11 Ch. 20-PLCC
10-Bit, 32 kSPS ADC Serial Out, uProcessor Periph./Standalone, 11 Ch. 20-PDIP
   DDR SDRAM 256Mb E-die (x4, x8)

File Size 216.51K  /  24 Page

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Amphenol Communications Solutions

Part No. 10043857-202LF
Description 400 Position BGA Plug, 0mm Component Height, 1.27mm x 1.27mm Array, Lead-free
Tech specs    

Official Product Page

    Ametherm, Inc.
Part No. P0438T P0452T P0430T P0433T P0436T P0435T P0440T P0442T P0465T P0439T P0441T P0432T
Description MCU CMOS 64 LD 8MHZ 4K EPRM, -40C to 85C, 64-TQFP, TRAY
MCU CMOS 68 LD Low Power, -40C to 85C, 68-PLCC, TUBE
SMT Toroidal Inductors (Shielded) - One Winding: Ros 1 Series and Ros 2 Series 表面贴装环型电感(屏蔽) -一个绕组:罗斯和罗1系列2系列

File Size 63.72K  /  2 Page

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Amphenol Communications Solutions

Part No. 10144518-043802LF
Description BergStak® Lite 0.80mm, Board-to-Board Connector, 40 Positions, Dual Row, Vertical Header.
Tech specs    

Official Product Page

    K4H560438H K4H560438H-UC_LA2 K4H560438H-UC_LB0 K4H561638H-UC_LA2 K4H561638H-UC_LB0 K4H561638H-UC_LB3 K4H561638H-UC_LCC K

SAMSUNG[Samsung semiconductor]
Part No. K4H560438H K4H560438H-UC_LA2 K4H560438H-UC_LB0 K4H561638H-UC_LA2 K4H561638H-UC_LB0 K4H561638H-UC_LB3 K4H561638H-UC_LCC K4H561638H K4H560838H-UC_LCC K4H560838H K4H560838H-UC_LA2 K4H560838H-UC_LB0 K4H560838H-UC_LB3
Description 256Mb H-die DDR SDRAM Specification

File Size 356.30K  /  24 Page

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Amphenol Communications Solutions

Part No. 86840-438HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 38 Positions, 2.54 mm Pitch, Right Angle, 8.08 mm (0.318in) Mating, 5.84 mm (0.23in) Tail.
Tech specs    

Official Product Page

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