0438 pdf Datasheet P12 Part Num --- IC-ON-LINE


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0438 Datasheet PDF File

For 0438 Found Datasheets File :: 150+ Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | <12> | 13 | 14 | 15 |

					SAMSUNG[Samsung semiconductor]
Part No.	K4H510438D K4H510438D-UC_LA2 K4H510438D-UC_LB0 K4H511638D-UC_LCC K4H510838D K4H510838D-UC_LA2 K4H510838D-UC_LB0 K4H510838D-UC_LB3 K4H510838D-UC_LCC K4H511638D-UC_LA2 K4H511638D-UC_LB0 K4H511638D-UC_LB3 K4H511638D
Description	512MB D-DIE DDR SDRAM SPECIFICATION
File Size	357.08K / 24 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	77317-404-38LF
Description	BergStik®, Board to Board connector, Unshrouded Right angle Header, Through Hole, Double Row, 38 Positions ,2.54mm (0.100in) Pitch,
Tech specs				Official Product Page

HUA FENG CIRCUIT

					Samsung Electronic SAMSUNG[Samsung semiconductor]
Part No.	K4H510438B-UC_LA2 K4H510438B-UC_LB0 K4H510438B-TC_LB3 K4H510438B-TC_LA2 K4H510438B-TC_LB0 K4H510438B-UC_LB3 K4H511638B-UC_LCC K4H510438 K4H510838B-TC_LA2 K4H510838B-TC_LB0 K4H510838B-TC_LB3 K4H510838B-TC_LCC K4H510838B-UC_LA2 K4H510838B-UC_LB0 K4H510838B-UC_LB3 K4H510838B-UC_LCC K4H511638B-TC_LA2 K4H511638B-TC_LB0 K4H511638B-TC_LB3 K4H511638B-TC_LCC K4H511638B-UC_LA2 K4H511638B-UC_LB0 K4H511638B-UC_LB3 K4H510438B-UC/LA2 K4H510438B-UC/LB0 K4H510438B-UC/LB3 K4H510838B-UC/LA2 K4H510838B-UC/LB0 K4H510838B-UC/LB3 K4H510838B-UC/LCC K4H511638B-UC/LA2 K4H511638B-UC/LB0 K4H511638B-UC/LB3 K4H511638B-UC/LCC K4H510438B-TC/LA2 K4H510438B-TC/LB0 K4H510438B-TC/LB3 K4H511638B-TC/LA2 K4H511638B-TC/LB0 K4H511638B-TC/LB3 K4H511638B-TC/LCC
Description	512MB B-DIE DDR SDRAM SPECIFICATION
File Size	355.93K / 24 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	68020-438HLF
Description	BergStik®, Board to Board connector, Unshrouded Right angled Header, Through Hole, Double Row, 38 Positions, 2.54mm (0.100in) Pitch.
Tech specs				Official Product Page

					Samsung Electronic SAMSUNG[Samsung semiconductor]
Part No.	K4H510438B-GC_LB3 K4H510438B-ZC_LA2 K4H510438B-ZC_LB0 K4H510438B-ZC_LCC K4H510438B-GC_LA2 K4H510438B-GC_LCC K4H510438B-GC_LB0 K4H510438B-ZC_LB3 K4H511638B-ZC_LCC K4H510838B-GC_LA2 K4H510838B-GC_LB0 K4H510838B-GC_LB3 K4H510838B-GC_LCC K4H510838B-ZC_LA2 K4H510838B-ZC_LB0 K4H510838B-ZC_LB3 K4H510838B-ZC_LCC K4H511638B-G K4H511638B-GC_LA2 K4H511638B-GC_LB0 K4H511638B-GC_LB3 K4H511638B-GC_LCC K4H511638B-ZC_LA2 K4H511638B-ZC_LB0 K4H511638B-ZC_LB3 K4H510438B-ZC/LA2 K4H510438B-ZC/LB0 K4H510438B-ZC/LB3 K4H510438B-ZC/LCC K4H510838B-ZC/LA2 K4H510838B-ZC/LB0 K4H510838B-ZC/LB3 K4H510838B-ZC/LCC K4H511638B-ZC/LA2 K4H511638B-ZC/LB0 K4H511638B-ZC/LB3 K4H511638B-ZC/LCC K4H510438B-GC/LA2 K4H510438B-GC/LB0 K4H510438B-GC/LB3 K4H510438B-GC/LCC K4H510838B-GC/LA2 K4H510838B-GC/LB0 K4H510838B-GC/LB3 K4H510838B-GC/LCC K4H511638B-GC/LA2 K4H511638B-GC/LB0 K4H511638B-GC/LB3 K4H511638B-GC/LCC
Description	512MB B-DIE DDR SDRAM SPECIFICATION
File Size	380.94K / 24 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	77317-104-38LF
Description	BergStik®, Board to Board connector, Unshrouded Right angle Header, Through Hole, Double Row, 38 Positions ,2.54mm (0.100in) Pitch,
Tech specs				Official Product Page

					Cypress Semiconductor, Corp. Samsung semiconductor
Part No.	K4H1G0438A-UC/LA2 K4H1G0838A-UC/LA2 K4H1G0438AUC/LB3 K4H1G0838A-UC/LB3 K4H1G0438A-UC/LCC K4H1G0438A-UC/LB0 K4H1G0838A-UC/LCC K4H1G0438A-UCB00 K4H1G0838A-UCA20
Description	128M X 8 DDR DRAM, 0.75 ns, PDSO66 0.400 X 0.875 INCH, 0.65 MM PITCH, ROHS COMPLIANT, TSOP2-66 256M X 4 DDR DRAM, 0.75 ns, PDSO66 0.400 X 0.875 INCH, 0.65 MM PITCH, ROHS COMPLIANT, TSOP2-66 1Gb A-die SDRAM Specification
File Size	360.68K / 24 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	51940-438LF
Description	PwrBlade®, Power Supply Connectors, 8P 44S 8P Vertical Receptacle.
Tech specs				Official Product Page

					SAMSUNG[Samsung semiconductor]
Part No.	K4H1G0438A-UC_LA2 K4H1G0438A-UC_LCC K4H1G0438AUC_LB3 K4H1G0438A K4H1G0438A-UC_LB0 K4H1G0838AUC_LB0 K4H1G0838A K4H1G0838A-UC_LA2 K4H1G0838A-UC_LB3 K4H1G0838A-UC_LCC
Description	1Gb A-die SDRAM Specification
File Size	355.95K / 24 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	68690-438HLF
Description	BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 38 Positions, 2.54 mm (0.100in)Pitch.
Tech specs				Official Product Page

					Samsung Semiconductor Co., Ltd. SAMSUNG SEMICONDUCTOR CO. LTD.
Part No.	K4H1G0438M-UC/LA2 K4H1G0838M-UC/LA2 K4H1G0838M-UC/LB0 K4H1G0438M-UC/LB3 K4H1G0838M-UC/LB3 K4H1G0438M-UC K4H1G0438M-UC/LB0 K4H1G0438M-LA2 K4H1G0438M-UCA2 K4H1G0438M-ULA2 K4H1G0838M-LA2 K4H1G0838M-UCA2 K4H1G0838M-ULA2 K4H1G0438M-UCB0 K4H1G0438M-ULB0 K4H1G0838M-LB0 K4H1G0838M-ULB0 K4H1G0838M-UCB0 K4H1G0438M-UC0 K4H1G0838M-UC2 K4H1G0438M-UC3 K4H1G0838M-UC3 K4H1G0438M-LB3 K4H1G0438M-UCB3 K4H1G0438M-ULB3 K4H1G0838M-LB3 K4H1G0838M-UCB3 K4H1G0838M-ULB3 K4H1G0838M-UC0 K4H1G0438M-UC2 K4H1G0438M-ULB30 K4H1G0438M-UCA20 K4H1G0838M-ULB00 K4H1G0438M-ULA20
Description	128M X 8 DDR DRAM, 0.75 ns, PDSO66 0.400 X 0.875 INCH, 0.65 MM PITCH, LEAD FREE, TSOP2-66 256M X 4 DDR DRAM, 0.75 ns, PDSO66 0.400 X 0.875 INCH, 0.65 MM PITCH, LEAD FREE, TSOP2-66 256M X 4 DDR DRAM, 0.7 ns, PDSO66 0.400 X 0.875 INCH, 0.65 MM PITCH, LEAD FREE, TSOP2-66 0603 18 OHM 1/16W RESISTOR, 1K, 1%, SMT 0603 1Gb M-die DDR SDRAM Specification 66 TSOP-II with Pb-Free (RoHS compliant)
File Size	208.47K / 23 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	87900-438HLF
Description	BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 38 Positions, 2.54 mm Pitch, Vertical, 18.29 mm (0.72in) Mating, 3.05 mm (0.12in) Tail.
Tech specs				Official Product Page

					Samsung semiconductor
Part No.	K4H510438G-LC/LB0 K4H510438G-LC/LB3 K4H510838G-LC/LB3 K4H511638G-LC/LB3 K4H510838G-LC/LCC K4H511638G-LC/LCC
Description	512Mb G-die DDR SDRAM Specification
File Size	351.41K / 24 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	10144517-043802LF
Description	BergStak® Lite 0.80mm, Board-to-Board Connector, 40 Positions, Dual Row, Vertical Receptacle.
Tech specs				Official Product Page

					Samsung semiconductor
Part No.	K4H560438J-LC/LB0 K4H560438J-LC/LB3 K4H560838J-LC/LCC K4H561638J-LC/LB3 K4H561638J-LC/LCC K4H560838J-LC/LB3
Description	256Mb J-die DDR SDRAM Specification
File Size	352.76K / 24 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	10043857-202LF
Description	400 Position BGA Plug, 0mm Component Height, 1.27mm x 1.27mm Array, Lead-free
Tech specs				Official Product Page

					Samsung semiconductor
Part No.	K4H511638F-LC/LCC K4H510438F-LC/LB3 K4H510838F-LC/LCC K4H510838F-LC/LB3 K4H511638F-LC/LB3 K4H510438F-LC/LB0
Description	512Mb F-die DDR SDRAM Specification
File Size	354.41K / 24 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	10144518-043802LF
Description	BergStak® Lite 0.80mm, Board-to-Board Connector, 40 Positions, Dual Row, Vertical Header.
Tech specs				Official Product Page

					Samsung Electronic SAMSUNG[Samsung semiconductor]
Part No.	K4H510438C-ZCCC K4H510438C-ZLB3 K4H510438C-ZLCC K4H510438C-ZCB3 K4H511638C-ZLCC K4H510838C-ZCB3 K4H510838C-ZCCC K4H510838C-ZLB3 K4H510838C-ZLCC K4H511638C-Z K4H511638C-ZCB3 K4H511638C-ZCCC K4H511638C-ZLB3
Description	512MB C-DIE DDR SDRAM SPECIFICATION
File Size	379.18K / 24 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	86840-438HLF
Description	BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 38 Positions, 2.54 mm Pitch, Right Angle, 8.08 mm (0.318in) Mating, 5.84 mm (0.23in) Tail.
Tech specs				Official Product Page

For 0438 Found Datasheets File :: 150+ Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | <12> | 13 | 14 | 15 |

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