0438 pdf Datasheet P9 Part Num --- IC-ON-LINE


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0438 Datasheet PDF File

For 0438 Found Datasheets File :: 150+ Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | <9> | 10 | 11 | 12 | 13 | 14 | 15 |

					SAMSUNG[Samsung semiconductor]
Part No.	K4H510438C-LA2 K4H510438C-LB0 K4H510438C-LB3 K4H510438C-LCC K4H510438C-UC K4H510838C-UC
Description	512Mb C-die DDR SDRAM Specification
File Size	209.84K / 23 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	77317-404-38LF
Description	BergStik®, Board to Board connector, Unshrouded Right angle Header, Through Hole, Double Row, 38 Positions ,2.54mm (0.100in) Pitch,
Tech specs				Official Product Page

HUA FENG CIRCUIT

					Samsung Semiconductor Co., Ltd. SAMSUNG SEMICONDUCTOR CO. LTD. SAMSUNG[Samsung semiconductor]
Part No.	K4H560838E-GCCC K4H560438E-GCC4 K4H560438E-GCCC K4H560838E-GCC4
Description	DIODE ZENER SINGLE 300mW 27Vz 5mA-Izt 0.02503 0.05uA-Ir 21 SOT-23 3K/REEL 256Mb的电子芯片的DDR 400内存规格60Ball FBGA封装（x4/x8 DIODE ZENER SINGLE 300mW 29.8Vz 5mA-Izt 0.02503 0.05uA-Ir 23 SOT-23 3K/REEL 256Mb E-die DDR 400 SDRAM Specification 60Ball FBGA (x4/x8)
File Size	195.42K / 18 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	68020-438HLF
Description	BergStik®, Board to Board connector, Unshrouded Right angled Header, Through Hole, Double Row, 38 Positions, 2.54mm (0.100in) Pitch.
Tech specs				Official Product Page

					Samsung Semiconductor Co., Ltd.
Part No.	K4H560438E-ZLB30 K4H560838E-ZLB30
Description	64M X 4 DDR DRAM, 0.7 ns, PBGA60 ROHS COMPLIANT, FBGA-60 32M X 8 DDR DRAM, 0.7 ns, PBGA60 ROHS COMPLIANT, FBGA-60
File Size	385.02K / 24 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	77317-104-38LF
Description	BergStik®, Board to Board connector, Unshrouded Right angle Header, Through Hole, Double Row, 38 Positions ,2.54mm (0.100in) Pitch,
Tech specs				Official Product Page

					Micro Commercial Components, Corp.
Part No.	K4H510438J-BPB30 K4H510838J-BPB30
Description	128M X 4 DDR DRAM, 0.7 ns, PBGA60 HALOGEN FREE AND ROHS COMPLIANT, FBGA-60 64M X 8 DDR DRAM, 0.7 ns, PBGA60 HALOGEN FREE AND ROHS COMPLIANT, FBGA-60
File Size	370.06K / 27 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	51940-438LF
Description	PwrBlade®, Power Supply Connectors, 8P 44S 8P Vertical Receptacle.
Tech specs				Official Product Page

					Molex Electronics Ltd.
Part No.	150-S-004-2-Z02 33472-0408 33472-0431 33472-0434 33472-0440 33472-0442 33472-0401 33472-0402 33472-0403 33472-0451 33472-0433 33472-0436 33472-0438 33472-0443 33472-0444 33472-0445 33472-0447 33472-0449 33472-0452 33472-0404 33472-0406 33472-0407 33472-0432 33472-0435 33472-0437 33472-0439 33472-0441 33472-0446 33472-0448 33472-0450
Description	DIRECT CONNECT INTERFACE 4 WAY 1.5MM SEALED MALE
File Size	1,174.31K / 10 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	68690-438HLF
Description	BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 38 Positions, 2.54 mm (0.100in)Pitch.
Tech specs				Official Product Page

					Cypress Semiconductor, Corp.
Part No.	K4H1G0438A-UCB30 K4H1G0838A-UCB00
Description	256M X 4 DDR DRAM, 0.7 ns, PDSO66 0.400 X 0.875 INCH, 0.65 MM PITCH, ROHS COMPLIANT, TSOP2-66 128M X 8 DDR DRAM, 0.75 ns, PDSO66
File Size	359.14K / 24 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	87900-438HLF
Description	BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 38 Positions, 2.54 mm Pitch, Vertical, 18.29 mm (0.72in) Mating, 3.05 mm (0.12in) Tail.
Tech specs				Official Product Page

					SAMSUNG SEMICONDUCTOR CO. LTD.
Part No.	K4H1G0838M-TC/LB0 K4H1G0838M-TC/LA2 K4H1G0838M-TC/LB3 K4H1G0438M-TC/LA2 K4H1G0438M-TC/LB0 K4H1G0438M-TC/LB3
Description	DIODE ZENER DUAL COMMON-CATHODE 300mW 43Vz 5mA-Izt 0.0698 0.1uA-Ir 32 SOT-23 3K/REEL 1Gb M-die DDR SDRAM Specification
File Size	208.27K / 23 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	10144517-043802LF
Description	BergStak® Lite 0.80mm, Board-to-Board Connector, 40 Positions, Dual Row, Vertical Receptacle.
Tech specs				Official Product Page

					Samsung Electronic SAMSUNG[Samsung semiconductor]
Part No.	K4H1G0838M-TC_LB3 K4H1G0438M K4H1G0438M-TC_LA2 K4H1G0438M-TC_LB0 K4H1G0438M-TC_LB3 K4H1G0838M-TC_LA2 K4H1G0838M-TC_LB0 K4H1G0438M-TC/LB0 K4H1G0838M-TC/LB0 K4H1G0438M-TC/LA2 K4H1G0438M-TC/LB3 K4H1G0838M-TC/LA2 K4H1G0838M-TC/LB3
Description	1Gb M-die DDR SDRAM Specification
File Size	203.73K / 23 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	10043857-202LF
Description	400 Position BGA Plug, 0mm Component Height, 1.27mm x 1.27mm Array, Lead-free
Tech specs				Official Product Page

					Samsung Semiconductor Co., Ltd. SAMSUNG SEMICONDUCTOR CO. LTD. http://
Part No.	K4H560838E-GC/LA2 K4H560838E-GC/LB0 K4H560838E-GC/LB3 K4H560438E-GC/LA2 K4H560438E-GC/LB0 K4H560438E-GC/LB3 K4H560438E-GLB0 K4H560438E-GLB3 K4H560438E-GCB3 K4H560438E-GCA2 K4H560838E-GCA2 K4H560438E-GCB0 K4H560838E-GCB0 K4H560838E-GLB0 K4H560838E-GLB3 K4H560838E-GLA2
Description	DIODE ZENER TRIPLE ISOLATED 200mW 39.13Vz 5mA-Izt 0.02518 0.05uA-Ir 30 SOT-363 3K/REEL 256Mb的电子芯片DDR SDRAM内存规格60Ball FBGA封装（x4/x8 DIODE ZENER TRIPLE ISOLATED 200mW 36.28Vz 5mA-Izt 0.02522 0.05uA-Ir 30 SOT-363 3K/REEL 256Mb的电子芯片DDR SDRAM内存规格60Ball FBGA封装（x4/x8 DIODE ZENER TRIPLE ISOLATED 200mW 22.08Vz 5mA-Izt 0.02514 0.05uA-Ir 17 SOT-363 3K/REEL 256Mb的电子芯片DDR SDRAM内存规格60Ball FBGA封装（x4/x8 DIODE ZENER TRIPLE ISOLATED 200mW 12Vz 10mA-Izt 0.02532 0.1uA-Ir 9.1 SOT-363 3K/REEL 256Mb的电子芯片DDR SDRAM内存规格60Ball FBGA封装（x4/x8 DIODE ZENER SINGLE 300mW 22.1Vz 5mA-Izt 0.02514 0.05uA-Ir 17 SOT-23 3K/REEL 256Mb的电子芯片DDR SDRAM内存规格60Ball FBGA封装（x4/x8 DIODE ZENER TRIPLE ISOLATED 200mW 13.79Vz 10mA-Izt 0.02503 0.05uA-Ir 11 SOT-363 3K/REEL 256Mb的电子芯片DDR SDRAM内存规格60Ball FBGA封装（x4/x8 DIODE ZENER SINGLE 300mW 14Vz 10mA-Izt 0.02503 0.05uA-Ir 11 SOT-23 3K/REEL 256Mb的电子芯片DDR SDRAM内存规格60Ball FBGA封装（x4/x8 DIODE ZENER SINGLE 300mW 12.9Vz 10mA-Izt 0.02562 0.1uA-Ir 10 SOT-23 3K/REEL 256Mb的电子芯片DDR SDRAM内存规格60Ball FBGA封装（x4/x8 DIODE ZENER TRIPLE ISOLATED 200mW 11.1Vz 10mA-Izt 0.02523 0.1uA-Ir 8.4 SOT-363 3K/REEL 256Mb的电子芯片DDR SDRAM内存规格60Ball FBGA封装（x4/x8 DIODE ZENER TRIPLE ISOLATED 200mW 19.7Vz 10mA-Izt 0.0251 0.05uA-Ir 15 SOT-363 3K/REEL 256Mb的电子芯片DDR SDRAM内存规格60Ball FBGA封装（x4/x8 DIODE ZENER SINGLE 300mW 12Vz 10mA-Izt 0.02532 0.1uA-Ir 9.1 SOT-23 3K/REEL 256Mb的电子芯片DDR SDRAM内存规格60Ball FBGA封装（x4/x8 DIODE ZENER SINGLE 300mW 19.7Vz 10mA-Izt 0.0251 0.05uA-Ir 15 SOT-23 3K/REEL 256Mb的电子芯片DDR SDRAM内存规格60Ball FBGA封装（x4/x8 DIODE ZENER SINGLE 300mW 23.7Vz 5mA-Izt 0.02509 0.05uA-Ir 19 SOT-23 3K/REEL DIODE ZENER TRIPLE ISOLATED 200mW 12.88Vz 10mA-Izt 0.02562 0.1uA-Ir 10 SOT-363 3K/REEL 256Mb E-die DDR SDRAM Specification 60Ball FBGA (x4/x8) 256Mb E-die DDR SDRAM Specification 60Ball FBGA (x4/x8)
File Size	245.98K / 24 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	10144518-043802LF
Description	BergStak® Lite 0.80mm, Board-to-Board Connector, 40 Positions, Dual Row, Vertical Header.
Tech specs				Official Product Page

					Littelfuse
Part No.	0438001.WR 043801.5WR 043803.5WR 0438.250WR 0438002.WR 0438006.WR 0438004.WR 043802.5WR 04381.75WR 0438.375WR 0438005.WR 04381.25WR 0438.500WR 0438.750WR 0438003.WR
Description	Surface Mount Fuses Ceramic Fuse > 438 Series
File Size	555.87K / 3 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	86840-438HLF
Description	BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 38 Positions, 2.54 mm Pitch, Right Angle, 8.08 mm (0.318in) Mating, 5.84 mm (0.23in) Tail.
Tech specs				Official Product Page

For 0438 Found Datasheets File :: 150+ Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | <9> | 10 | 11 | 12 | 13 | 14 | 15 |

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