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SGS Thomson Microelectronics
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| Part No. |
AN1547
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| OCR Text |
...00 m and a stencil thickness of 150m. Flip-Chip CSPs are fully compatible with the use of eutectic Sn63Pb37 solder paste with no clean flux....diameter (circular) 300m diameter minimum Cu-Ni (2-6m) - Au (0.2m max.)
Recommended : Tpeak = 230... |
| Description |
FLIP CHIP 170MICRONSM RECOMMENDATIONS FOR AUDIO POWER AMPLIFIERS
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| File Size |
68.82K /
6 Page |
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it Online |
Download Datasheet
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SGS Thomson Microelectronics
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| Part No. |
AN1553
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| OCR Text |
...20 m and a stencil thickness of 150m. Flip-Chip CSPs are fully compatible with the use of eutectic Sn63Pb37 solder paste with no clean flux....diameter (circular) 340m diameter minimum Cu-Ni (2-6m) - Au (0.2m max.)
Recommended : Tpeak = 230... |
| Description |
FLIP CHIP 300MICRONSM RECOMMENDATIONS FOR AUDIO POWER AMPLIFIER
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| File Size |
68.17K /
6 Page |
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it Online |
Download Datasheet |
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ST Microelectronics
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| Part No. |
EMIF02-SPK01F1
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| OCR Text |
...urn aplacvar ls 1nh aplacvar rs 150m aplacvar rspk 10 aplacvar lspk 10p aplacvar cdiode1 234pf aplacvar cdiode2 3.5ppf aplacvar cdiode3 1nf ...diameter : 250m recommended , 300m max solder stencil opening : 330m solder mask opening recommendat... |
| Description |
2 LINES EMI FILTER AND ESD PROTECTION
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| File Size |
259.08K /
7 Page |
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it Online |
Download Datasheet |
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