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Rochester Electronics LLC |
Part No. |
AM27C512-200DI
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Description |
AM27C512 - 512K (64K x 8) CMOS EPROM
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Tech specs |
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Official Product Page
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Rochester Electronics LLC |
Part No. |
27C512-200DM/B
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Description |
27C512 - 512K (64K x 8) CMOS EPROM
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Tech specs |
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Official Product Page
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Rochester Electronics LLC |
Part No. |
AM27C512-200JI
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Description |
AM27C512 - 512Kb (64K x 8-Bit) CMOS OTP EPROM
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Tech specs |
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Official Product Page
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TE Connectivity, Ltd. Rhombus Industries, Inc. Bel Fuse, Inc.
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Part No. |
MP3-Y22200/250/20LL40MM MP3-Y20.015/250/20LL40MM MP3-Y24700/250/20LL40MM
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Description |
CAPACITOR, METALLIZED PAPER, 0.0022 uF, THROUGH HOLE MOUNT RADIAL LEADED CAPACITOR, METALLIZED PAPER, 0.015 uF, THROUGH HOLE MOUNT RADIAL LEADED CAPACITOR, METALLIZED PAPER, 0.0047 uF, THROUGH HOLE MOUNT RADIAL LEADED
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File Size |
358.77K /
2 Page |
View
it Online |
Download Datasheet
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Rochester Electronics LLC |
Part No. |
AM27C512-200DC
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Description |
AM27C512 - 512K (64K x 8) CMOS EPROM
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
87185-130HLF
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Description |
BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 30 Positions, 2.54 mm Pitch, Vertical, 26.49 mm (1.043in) Mating, 2.41 mm (0.095in) Tail.
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
10132797-025130LF
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Description |
BergStak® 0.5mm Mezzanine Connector, Board To Board Connectors, 20 position, 4.3mm height plug connector.
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
HM2P08PD5130N9LF
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Description |
Back Plane Connectors,2mm Hard Metric Series,Millipacs, 5 Row Vertical Header, Type B, 125 Signal Pin, Press Fit Tail, 250 mating cycles and ROHS Compliant
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Tech specs |
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Official Product Page
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Vishay Beyschlag Vishay Intertechnology, Inc.
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Part No. |
MKS01-SMD5.70.022/20/50VDCBP180 MKS01-SMD5.71000/20/50VDCBP330 MKS01-SMD5.74700/20/50VDCBP330 MKS01-SMD5.72200/20/50VDCBP330
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Description |
CAPACITOR, METALLIZED FILM, POLYETHYLENE AND TEREPHTHALATE, 50 V, 0.022 uF, SURFACE MOUNT CHIP CAPACITOR, METALLIZED FILM, POLYETHYLENE AND TEREPHTHALATE, 50 V, 0.001 uF, SURFACE MOUNT CHIP CAPACITOR, METALLIZED FILM, POLYETHYLENE AND TEREPHTHALATE, 50 V, 0.0047 uF, SURFACE MOUNT CHIP CAPACITOR, METALLIZED FILM, POLYETHYLENE AND TEREPHTHALATE, 50 V, 0.0022 uF, SURFACE MOUNT CHIP
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File Size |
485.52K /
3 Page |
View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
Part No. |
79425-130HLF
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Description |
BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 30 Positions, 2.54 mm Pitch, Vertical, 4.83 mm (0.19 in.) Mating, 3.05 mm (0.12 in.) Tail.
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
95615-130TRLF
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Description |
Minitek® 2.00mm, Board to Board, Shrouded Vertical Header- Through Mount - Double row - 30 Positions - 2.00mm (0.079in) Pitch.
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
68695-130HLF
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Description |
BergStik® 2.54mm, Board To Board Connector, Unshrouded Header, Through Hole, Double Row, 30 Positions, 2.54mm Pitch, Right Angle, 5.84mm (0.23in) Mating, 2.29mm (0.09in) Tail.
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Tech specs |
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Official Product Page
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Price and Availability
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