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Molex Electronics Ltd.
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| Part No. |
87891-2818 0878912818
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| Description |
2.54mm (.100) Pitch KK? Header, Through Hole, Breakaway, Vertical, 28 Circuits, 0.38μm (15μ) Gold (Au) Plating, with Cap, Tape on Reel Packaging, Lead-free
2.54mm (.100) Pitch KK垄莽 Header, Through Hole, Breakaway, Vertical, 28 Circuits, 0.38楼矛m (15楼矛) Gold (Au) Plating, with Cap, Tape on Reel Packaging, Lead-free
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| File Size |
288.12K /
5 Page |
 View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
| Part No. |
75188-828-18LF
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| Description |
BergStik® 2.54mm, Board To Board Connector, Unshrouded Vertical header, Through Hole, Single Row, 18 Positions, 5.08mm (0.200in) Pitch.
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
87891-0106
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| Description |
2.54mm (.100) Pitch KK庐 Header, Through Hole, Vertical, 1 Circuit, 2.50 渭m (100渭) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
2.54mm (.100) Pitch KK? Header, Through Hole, Vertical, 1 Circuit, 2.50 μm (100μ) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
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| File Size |
759.44K /
10 Page |
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it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
54242-109281800LF
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| Description |
BergStik®, Board to Board connector, Unshrouded vertical stacked header, Surface Mount, Double Row, 28 Positions, 2.54mm (0.100in) Pitch.
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
87891-0306
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| Description |
2.54mm (.100) Pitch KK庐 Header, Through Hole, Breakaway, Vertical, 3 Circuits, 2.50渭m (100渭) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
2.54mm (.100) Pitch KK? Header, Through Hole, Breakaway, Vertical, 3 Circuits, 2.50μm (100μ) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
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| File Size |
759.44K /
10 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
54242-109281850LF
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| Description |
BergStik®, Board to Board connector, Unshrouded vertical stacked header, Surface Mount, Double Row, 28 Positions, 2.54mm (0.100in) Pitch.
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
87891-4006
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| Description |
2.54mm (.100) Pitch KK庐 Header, Through Hole, Breakaway, Vertical, 40 Circuits, 2.50渭m (100渭) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
2.54mm (.100) Pitch KK? Header, Through Hole, Breakaway, Vertical, 40 Circuits, 2.50μm (100μ) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
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| File Size |
759.44K /
10 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
77315-428-18LF
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| Description |
BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 18 Positions 2.54mm (0.100in) Pitch, Right Angle
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
87891-0408
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| Description |
2.54mm (.100) Pitch KK庐 Header, Through Hole, Vertical, 4 Circuit, 2.50渭m (100渭) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
2.54mm (.100) Pitch KK? Header, Through Hole, Vertical, 4 Circuit, 2.50μm (100μ) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
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| File Size |
287.76K /
5 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
54122-818321850LF
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| Description |
BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 32 position, 2.54mm (0.100in) pitch
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
87891-1818
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| Description |
2.54mm (.100) Pitch KK庐 Header, Through Hole, Breakaway, Vertical, 18 Circuits, 0.38渭m (15渭) Gold (Au) Plating, with Cap, Tape on Reel Packaging, Lead-free
2.54mm (.100) Pitch KK? Header, Through Hole, Breakaway, Vertical, 18 Circuits, 0.38μm (15μ) Gold (Au) Plating, with Cap, Tape on Reel Packaging, Lead-free
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| File Size |
287.95K /
5 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
54112-818341000LF
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| Description |
BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 34 Positions, 2.54mm (0.100in) Pitch.
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
87891-1817
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| Description |
2.54mm (.100) Pitch KK庐 Header, Through Hole, Breakaway, Vertical, 18 Circuits, 2.50渭m (100渭) Tin (Sn) Plating, with Cap, Tape on Reel Packaging, Lead-free
2.54mm (.100) Pitch KK? Header, Through Hole, Breakaway, Vertical, 18 Circuits, 2.50μm (100μ) Tin (Sn) Plating, with Cap, Tape on Reel Packaging, Lead-free
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| File Size |
287.95K /
5 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
54112-818122250LF
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| Description |
BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 12 Positions, 2.54mm (0.100in) Pitch.
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
87891-0606
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| Description |
2.54mm (.100) Pitch KK庐 Header, Through Hole, Breakaway, Vertical, 6 Circuits, 2.50渭m (100渭) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
2.54mm (.100) Pitch KK? Header, Through Hole, Breakaway, Vertical, 6 Circuits, 2.50μm (100μ) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
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| File Size |
759.44K /
10 Page |
View
it Online |
Download Datasheet |
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Texas Instruments |
| Part No. |
UCC2818AN
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| Description |
BiCMOS Power Factor Preregulator 16-PDIP -40 to 85
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| Tech specs |
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Official Product Page
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Texas Instruments |
| Part No. |
TPS2818MDBVREPG4
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| Description |
Enhanced Product Single High-Speed Mosfet Driver 5-SOT-23 -55 to 125
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| Tech specs |
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Official Product Page
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Texas Instruments |
| Part No. |
TPS728180300YZUR
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| Description |
Single Output LDO, 200mA, Dual Level Fixed with Vset Pin 5-DSBGA -40 to 125
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| Tech specs |
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Get Free Sample |
Official Product Page
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