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For layer- a Found Datasheets File :: 22798 Search Time::1.484ms
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				Winbond
Part No.	W83310DG-a W83310DS-a
OCR Text	...ERMaL PERFORMaNCE TEST ON FOUR-LaYER (2S2P) JEDEC TEST BOaRD PaCKaGE POWER (W) COMPONENT TEMP. (OC) PaCKaGE DIE DOWNSET LEaD aMBIENT JC ( ...a thermal pad for W83310DS and this is connected to the bottom layer by vias. The ja of the W83310DS...
Description	Bus Termination Regulator
File Size	592.39K / 15 Page	View it Online	Download Datasheet

				Rohm
Part No.	BD6583MUV-a
OCR Text	...25C) when It's not mounted on 1 layer board (ROHM Standard board) and Copper foil area 0mm2 (*3) It will be reduced every 12.1mW/C (Ta>25C) ...a customer may use this translation version only for a reference to help reading the formal version....
Description	Silicon Monolithic Integrated Circuit
File Size	166.64K / 5 Page	View it Online	Download Datasheet

				Cypress Semiconductor, Corp.
Part No.	UPD98408GD-LML-a
OCR Text	...he pd98408 is an atm physical layer lsi ic that complies with atm25 (25.6 mbps) and which supports tc sublayer and pmd sublayer functions....a 25.6-mbps atm phy (pmd & tc) function for six circuits conforms to the atm forum phy interface s...
Description	aTM NETWORK INTERFaCE, PQFP208 28 X 28 MM, FINE PITCH, PLaSTIC, QFP-208
File Size	263.34K / 36 Page	View it Online	Download Datasheet

				MRV Communications, Inc. http://
Part No.	OCC-a-320-N OCC-a-320-P OCC-E-320-N OCC-E-320-P OCC-SPC8 OCC-CPR
OCR Text	...-once" technology of a physical layer switch turns the practice of manually configuring test topologies into a software process, electronically storing and recalling configurations as needed. Test time and configuration errors are reduced, ...
Description	OCC - Optical Cross Connect
File Size	69.94K / 3 Page	View it Online	Download Datasheet

				STMICROELECTRONICS[STMicroelectronics]
Part No.	ST22T064-a
OCR Text	...ements the Hardware abstraction layer. It consists of C interfaces to the EEPROM memory and peripherals. The drivers are: - - - - - - - - - ...a C-oriented aPI allowing efficient and secure access to the peripherals and Non Volatile Memory for...
Description	Smartcard 32-Bit RISC MCU with 64 Kbytes EEPROM & USB 2.0 Full Speed Device Controller
File Size	88.16K / 7 Page	View it Online	Download Datasheet

				Intersema Sensoric SA
Part No.	MS7212-a MS7212
OCR Text	...e Epi : Connection of epitaxial layer (membrane) Out- : Negative output Out+ : Positive output GND1 : Ground GND2 : Ground GND1 1 Vs+ ...a topside PyrexTM cap (1.23 x 0.94 mm ) and a backside PyrexTM (1.95 x 1.63 mm ). The pick and place...
Description	PRESSURE SENSOR DIE (0-12 BaR) FOR HaRSH ENVIRONMENT
File Size	253.18K / 4 Page	View it Online	Download Datasheet

				Rohm
Part No.	BD6583MUV-a BD6583MUV-aE2 BD6583MUV-a11
OCR Text	...at radiation board. (*2) 1 layer (rohm standard board) has been mounted. copper foil area 0mm 2 , when it?s used by more than ta=25 ...a ? ...
Description	White Backlight LED Driver for Medium to Large LCD Panels (Switching Regulator Type)
File Size	844.98K / 27 Page	View it Online	Download Datasheet

				Intersema Sensoric SA
Part No.	MS7801-a MS7801-a0.2 MS7801-D MS7801 MS7801-a-0.2
OCR Text	...e Epi : Connection of epitaxial layer (membrane) Out+ OutOut- : Negative output Out+ : Positive output GND1 : Ground GND2 : Ground GND1 GND2...a sensitive membrane (0.9 x 0.9 mm) the sensor dice outer diameter is: 1.98 x 1.84 mm. The pick and ...
Description	PRESSURE SENSOR DIE (0-1 BaR)
File Size	461.32K / 4 Page	View it Online	Download Datasheet

				Intersema Sensoric SA
Part No.	MS7812-a MS7812-D
OCR Text	...e Epi : Connection of epitaxial layer (membrane) Out+ OutOut- : Negative output Out+ : Positive output GND1 : Ground GND2 : Ground GND1 GND2...a sensitive membrane (0.5 x 0.5 mm) the top surface of the sensor dice has an outer of diameter is: ...
Description	PRESSURE SENSOR DIE (0-12 BaR)
File Size	408.18K / 4 Page	View it Online	Download Datasheet

For layer- a Found Datasheets File :: 22798 Search Time::1.484ms
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