|
|
 |
Jewel Hill Electronic Co., Ltd. Vectron International, Inc.
|
Part No. |
GB162A GB162ANGAANUB-V01 GB162AHGAAMLB-V01 GB162ANGABNDB-V01 GB162ANGBBNUA-V01 GB162ASYABNUA-V01 GB162ANGBANLA-V01 GB162ANGBANDB-V01 GB162AHGBAMDA-V01 GB162AHGAANLB-V01 GB162AHGAAMLA-V01 GB162AHGAAMDB-V01 GB162ANGBAMUB-V01 GB162ANYABMLB-V01
|
Description |
CONN,RF,BNC,FEM BULKHEAD, TWIST-ON FOR RG 58/U SOCKET,IC,24PIN,MACHINE TOOLED SLIMLINE LP,soldertail,0.3"W CABLE ASM,SMA,RG174,1/2 FT, SMA R/A MALE TO SMA R/A MALE CAP,TANT,.47uF,35V,10%(10) PWR SPLY,SW,WALL,24V/0.25A, 6W,2.1x5.5mm,F2,UL/CUL/CE 规格液晶模块 SPECIFICATIONS FOR LCD MODULE 规格液晶模块 SOCKET,IC,DUAL WIPE,20PIN soldertail,LPD,0.30"WIDETH(10) 规格液晶模块 HEADER,VERTICAL,REC,2RW,16cont 规格液晶模块 TRANSISTOR,TIP30C.PNP SIL,100Vceo,15hfe@1A,TO-220 规格液晶模块
|
File Size |
274.93K /
23 Page |
View
it Online |
Download Datasheet
|
|
|
 |

Molex Electronics Ltd.
|
Part No. |
87775-1001 0877751001
|
Description |
1.00mm (.039) Pitch DDR2 DIMM Socket, Through Hole, 0.76渭m (30渭) Gold (Au), 2.67mm (0.109) soldertail, 276 Circuits, Lead free 1.00mm (.039) Pitch DDR2 DIMM Socket, Through Hole, 0.76μm (30μ) Gold (Au), 2.67mm (0.109) soldertail, 276 Circuits, Lead free
|
File Size |
457.39K /
8 Page |
View
it Online |
Download Datasheet
|
|
|
 |
DB Lectro Inc. DB Lectro, Inc.
|
Part No. |
SR2C101KR SR2E470KR SR2E470KC SR2E470MT SR2E470MR SR2E221LR SR1V470LT SR1V470MR SR2C220KC SR2C101MT SR2C101MC SR1A101MR SR1A101MT SR1C220MC SR2D220MC
|
Description |
SPEAKER,RND,PC MNT,1.2",8ohm, .15WATT 1.2KHZ-4KHZ,MYLAR SOCKET,PLCC,52PIN,soldertail THRU-HOLE SOCKET,PLCC,44 PIN,soldertail, THRU-HOLE SWITCH BOX,25PIN,A/B SWITCH 20/cs SWITCH BOX,DB9,2-WAY 20/CS MOTOR,STEP,12VDC/.4A, 2100 GM-CM 铝电解电容器 ALUMINIUM ELECTROLYTIC CAPACITOR 铝电解电容器 MOTOR,DC,GEAR,12V,167/1,36RPM, 5400G-CM,94MA 铝电解电容器 MOTOR,DC,GEAR,12V,150/1,40RPM, 4800G-CM,88MA 铝电解电容器 MOTOR,DC,GEAR,12V,90/1,66RPM, 2100G-CM,80MA 铝电解电容器 CONNECTOR,RJ11,6P6C,STRANDED (10) 铝电解电容器 CONNECTOR,RJ45,8P8C,STRANDE 铝电解电容器
|
File Size |
110.30K /
2 Page |
View
it Online |
Download Datasheet
|
|
|
 |

Molex Electronics Ltd.
|
Part No. |
0877159901 87715-9901
|
Description |
Phosphor Bronze, 0.38μm (15μ) Gold (Au) Plating, with Plastic Pegs, 2.54mm (.100)soldertail, PCB Thickness 1.58mm (.062), 26 Circuits, Lead Free Phosphor Bronze, 0.38渭m (15渭") Gold (Au) Plating, with Plastic Pegs, 2.54mm (.100")soldertail, PCB Thickness 1.58mm (.062"), 26 Circuits, Lead Free
|
File Size |
132.16K /
3 Page |
View
it Online |
Download Datasheet
|
|
|
 |

Molex Electronics Ltd.
|
Part No. |
0739446116 73944-6116
|
Description |
2.00mm (.079") Pitch HDM庐 Board-to-Board Backplane Header, Vertical, SMC, soldertail, Guide Pin Option, 72 Circuits 2.00mm (.079) Pitch HDM? Board-to-Board Backplane Header, Vertical, SMC, soldertail, Guide Pin Option, 72 Circuits
|
File Size |
153.82K /
4 Page |
View
it Online |
Download Datasheet
|
|
|
 |

Molex Electronics Ltd.
|
Part No. |
0739447201 73944-7201
|
Description |
2.00mm (.079") Pitch HDM庐 Board-to-Board Backplane Header, Vertical, SMC, soldertail, Guide Pin Option, 144 Circuits 2.00mm (.079) Pitch HDM? Board-to-Board Backplane Header, Vertical, SMC, soldertail, Guide Pin Option, 144 Circuits
|
File Size |
154.08K /
4 Page |
View
it Online |
Download Datasheet
|
|
|
 |

Molex Electronics Ltd.
|
Part No. |
0739447200 73944-7200
|
Description |
2.00mm (.079") Pitch HDM庐 Board-to-Board Backplane Header, Vertical, SMC, soldertail, Guide Pin Option, 144 Circuits 2.00mm (.079) Pitch HDM? Board-to-Board Backplane Header, Vertical, SMC, soldertail, Guide Pin Option, 144 Circuits
|
File Size |
154.08K /
4 Page |
View
it Online |
Download Datasheet
|
|
|
 |

Molex Electronics Ltd.
|
Part No. |
73944-7016 0739447016
|
Description |
2.00mm (.079) Pitch HDM? Board-to-Board Backplane Header, Vertical, SMC, soldertail, Guide Pin Option, 144 Circuits 2.00mm (.079") Pitch HDM庐 Board-to-Board Backplane Header, Vertical, SMC, soldertail, Guide Pin Option, 144 Circuits
|
File Size |
154.47K /
4 Page |
View
it Online |
Download Datasheet
|
|

Price and Availability
|