| PART |
Description |
Maker |
| BL817S |
High Density Mounting Type Photocoupler
|
SeCoS Halbleitertechnologie GmbH
|
| PC818 |
High Density Mounting Type Photocoupler
|
Sharp Electrionic Components
|
| HPCL-817 HPCL817 |
Phototransistor Optocoupler High Density Mounting Type
|
Agilent Technologies
|
| PC845 |
High Sensitivity, High Density Mounting Type Photocoupler
|
Sharp Electrionic Compo...
|
| HCPL-814 HCPL-814-W0AE HCPL-814-56AE |
1 CHANNEL AC INPUT-TRANSISTOR OUTPUT OPTOCOUPLER
AC Input Phototransistor Optocoupler High Density Mounting Type
|
AVAGO TECHNOLOGIES LIMITED
|
| HSM88AS |
MPAK package is suitable for high density surface mounting and high speed assembly
|
TY Semiconductor Co., Ltd
|
| HSM88ASR |
MPAK package is suitable for high density surface mounting and high speed assembly
|
TY Semiconductor Co., Ltd
|
| HSM88WA |
MPAK package is suitable for high density surface mounting and high speed assembly
|
TY Semiconductor Co., Ltd
|
| LTV-354T |
Hybrid substrates that require high density mounting
|
Lite-On Technology Corporation
|
| HSU88 |
Ultra small Resin Package (URP) is suitablefor high density surface mounting and high speed assembly
|
TY Semiconductor Co., Ltd
|
| IS2701-1 |
HIGH DENSITY MOUNTING PHOTOTRANSISTOR OPTICALLY COUPLED ISOLATORS
|
List of Unclassifed Manufacturers
ISOCOM
|
