| PART |
Description |
Maker |
| KVR8X72V84-50EG |
Memory Module Specification (EDO Memory Module)
|
Electronic Theatre Controls, Inc.
|
| HYM324000GD-60 HYM324000GD-50 |
4M x 32-Bit Dynamic RAM Module SMALL OUTLINE MEMORY MODULE 4M X 32 FAST PAGE DRAM MODULE, 60 ns, ZMA72
CAP 0.5PF 50V /-0.2PF THIN-FILM SN96/AG4/NI 30PPM TR-7-PA
4M x 32 Bit DRAM Module (SO-DIMM)
-4M x 32-Bit Dynamic RAM Module SMALL OUTLINE MEMORY MODULE
|
SIEMENS A G
SIEMENS AG
SIEMENS[Siemens Semiconductor Group]
Infineon
|
| PIC12F PIC16F |
PIC16F/LF182X/PIC12F/LF1822 Memory Programming Specification
PIC16F/LF182X/PIC12F/LF1822 Memory Programming Specification
|
Microchip Technology
|
| PIC16F87 |
Flash Memory Programming Specification
|
Microchip Technology
|
| PIC16F873 |
EEPROM Memory Programming Specification
|
Microchip Technology
|
| PIC16F87 PIC16F88 |
PIC16F87/88 FLASH Memory Programming Specification
|
Microchip Technology
|
| V16DJX432BLT V16DJ432BLT |
4M X 32 High Performance EDO Memory Module(4M X 32高性能EDO存储器模
4M X 32 High Performance FPM Memory Module(4M X 32高性能FPM存储器模
|
Mosel Vitelic, Corp.
|
| KMM594000-10 KMM594000-8 KMM594000 |
4M x 9 CMOS DRAM Memory Module 4米9的CMOS DRAM记忆体模
4M x 9 CMOS DRAM SIMM Memory Module
|
Samsung Semiconductor Co., Ltd.
Samsung Electronics
|
| 2832483 |
Memory module, 2 port twisted pair module for saving the switch configuration
|
PHOENIX CONTACT
|
| HYM328000GD-60 HYM328000GD-50 |
8M x 32 -Bit Dynamic RAM Module SMALL OUTLINE MEMORY MODULE
|
Infineon
|
| XC17V00 DS073 XC17V16PC20C XC17V16PC20I XC17V16PC4 |
GIGATRUE 550 CAT6 PATCH 100 FT, SNAGLESS, BLACK 2M X 1 CONFIGURATION MEMORY, PQCC20
XC17V00 Series Configuration PROM XC17V00系列配置PROM
XC17V00 Series Configuration PROM 2M X 8 CONFIGURATION MEMORY, PQFP44
Advance Product Specification
From old datasheet system
|
Xilinx, Inc.
XILINX[Xilinx, Inc]
|
