| PART |
Description |
Maker |
| CYM6002K-25 |
32-BIT, 25 MHz, MICROPROCESSOR, XMA 5.780 X 3.300 INCH, HEAT SINK, SURFACE MOUNT PACKAGE
|
Cypress Semiconductor, Corp.
|
| ATS037037025-PF-12X |
37.00 x 37.00 x 25.00 mm BGA Heat Sink (Heat Aspect Ratio Ext.) Custom Pin Fin
|
Advanced Thermal Solutions, Inc.
|
| CP600 CP601 CP604 CP6010 CP602 CP606 CP608 |
SINGLE-PHASE SILICON BRIDGE-P.C. MTG 3A/ HEAR-SINK MTG 6A
SINGLE-PHASE SILICON BRIDGE-P.C. MTG 3A , HEAT-SINK MTG 6A(VOLTAGE 50 to 1000 Volts CURRENT - P.C. MTG 3A , HEAT-SINK MTG 6A)
SINGLE-PHASE SILICON BRIDGE-P.C. MTG 3A / HEAT-SINK MTG 6A(VOLTAGE 50 to 1000 Volts CURRENT - P.C. MTG 3A / HEAT-SINK MTG 6A)
|
TRSYS
Pan Jit International Inc.
PanJit International Inc.
|
| ATS-55210R-C1-R0 |
High Performance X-CUT - Heat Sink, T412, BLACK-ANODIZED
High Perfomance X-CUT - Heat Sink, T412, BLACK-ANODIZED
|
Advanced Analog Technology, Inc.
Advanced Thermal Solutions, Inc.
|
| ST92F120V1Q7 ST92F120R1Q6 ST92F120JR1Q6 ST92F120JR |
8/16-BIT FLASH MCU FAMILY WITH RAM, EEPROM AND J1850 BLPD
8/16-BIT FLASH MCU FAMILY WITH RAM, EEPROM AND J1850 BLPD
HEATSINK TO-220 VERT MNT W/TABS 16位产品系列闪存微控制器与RAM，EEPROM和J1850 BLPD
Heat Sink; Package/Case:TO-218, TO-247; Thermal Resistance:5 C/W; Mounting Type:Screw Mount; Length:38.1mm; Height:38.1mm; Width:41.91mm; Body Material:Aluminum; Body Plating:Anodized; Color:Black; Leaded Process Compatible:Yes RoHS Compliant: Yes
|
ST Microelectronics
STMicroelectronics N.V.
意法半导
|
| ATS-19G-02-C2-R0 |
Heat Sink Assembly
|
Advanced Thermal Soluti...
|
| ATS-19G-115-C2-R0 |
Heat Sink Assembly
|
Advanced Thermal Soluti...
|
| 384-1017 |
Clip-On Heat Sink
|
List of Unclassifed Manufacturers
|
| LPD35-20B LPD35-35B LPD35-5B LPD35-10B LPD35-3B LP |
Low Pressure Drop Heat Sink
|
ALPHA
|
| MG1018-16 MG1023-16 MG1008-15 MG1006-11 MG1022-16 |
GUNN Diodes Cathode Heat Sink
|
Microsemi Corporation
http://
|
