PART |
Description |
Maker |
SDT04S60 SDD04S60 SDP04S60 Q67040-S4368 Q67040-S43 |
Heat Sink; Package/Case:TO-220; Thermal Resistance:20.3 C/W; Mounting Type:Through Hole; Body Material:Plastic; Color:Black; Leaded Process Compatible:No; Peak Reflow Compatible (260 C):No; Sink Material:Plastic RoHS Compliant: No Heat Sink; Package/Case:TO-220; Thermal Resistance:20.3 C/W; Mounting Type:Through Hole; Length:18.03mm; Height:12.7mm; Width:25.4mm; Body Material:Plastic; Color:Black; Leaded Process Compatible:Yes RoHS Compliant: Yes Silicon Carbide Schottky Diodes - 4A diode in TO220-3 package Silicon Carbide Schottky Diodes - 4A diode in TO252 package Silicon Carbide Schottky Diodes - 4A diode in TO220-2 package
|
INFINEON[Infineon Technologies AG]
|
528-45AB |
Heat Sink; Package/Case:Half Brick; Body Material:Aluminum; Thermal Resistance:3.2 C/W; Color:Black; Size/Dimensions:0.450H x 2.240W x 2.280L"
|
Wakefield Thermal Solutions
|
ATS-19G-121-C1-R0 |
Heat Sink Assembly
|
Advanced Thermal Soluti...
|
ATS-19G-02-C2-R0 |
Heat Sink Assembly
|
Advanced Thermal Soluti...
|
ATS-19G-115-C2-R0 |
Heat Sink Assembly
|
Advanced Thermal Soluti...
|
ATS-19G-117-C1-R0 |
Heat Sink Assembly
|
Advanced Thermal Soluti...
|
ATS-19G-117-C2-R0 |
Heat Sink Assembly
|
Advanced Thermal Soluti...
|
XC4028EX-2HQ240C XC4028EX-2HQ304C XC4028EX-2HQ208C |
FPGA, 1024 CLBS, 18000 GATES, 166 MHz, PQFP240 HEAT SINK, QFP-240 FPGA, 1024 CLBS, 18000 GATES, 166 MHz, PQFP304 HEAT SINK, QFP-304 FPGA, 1024 CLBS, 18000 GATES, 166 MHz, PQFP208 HEAT SINK, QFP-208 FPGA, 1296 CLBS, 22000 GATES, 143 MHz, PQFP240 FPGA, 1024 CLBS, 18000 GATES, 166 MHz, CPGA299 FPGA, 1024 CLBS, 15000 GATES, 166 MHz, PQFP304
|
Xilinx, Inc. XILINX INC
|
SQ50X34 |
Heat Sink for DPSS Laser Modules
|
Roithner LaserTechnik G...
|
ATS-1108-C1-R0 |
Heat Sink for Full Brick DC-DC Converter
|
Advanced Thermal Soluti...
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