| PART |
Description |
Maker |
| 87891-2818 0878912818 |
2.54mm (.100) Pitch KK? Header, Through Hole, Breakaway, Vertical, 28 Circuits, 0.38μm (15μ) Gold (Au) Plating, with Cap, Tape on Reel Packaging, Lead-free
2.54mm (.100) Pitch KK垄莽 Header, Through Hole, Breakaway, Vertical, 28 Circuits, 0.38楼矛m (15楼矛) Gold (Au) Plating, with Cap, Tape on Reel Packaging, Lead-free
|
Molex Electronics Ltd.
|
| HM11-52004 HM11-21001 HM11-21302 HM11-21503 HM11-2 |
LEAD FREE A8904SLB-T WITH TAPE & REEL
Vertical Mount Inductors
BACKLIGHT DRIVER FOR MEDIUM SIZE LCDS
50 AMP BI-DIRECTIONAL CURRENT SENSOR
75 AMP BI-DIRECTIONAL CURRENT SENSOR
100 AMP BI-DIRECTIONAL CURRENT SENSOR
30A BI-DIRECTIONAL CURRENT SENSOR
Hall Effect IC; Package/Case:module-5; Current Rating:-50A to ; Leaded Process Compatible:Yes; Operating Temp. Min:-20 C; Peak Reflow Compatible (260 C):Yes; Primary Sensed Current :50A; Primary Sensed Current -:50A RoHS Compliant: Yes
LEAD FREE A8904SLP-T WITH TAPE & REEL
20A BI-DIRECTIONAL CURRENT SENSOR 垂直安装电感
|
List of Unclassifed Manufacturers
ETC[ETC]
Electronic Theatre Controls, Inc.
|
| 54819-1572 0548191572 |
USB On-The-Go (OTG) Mini-B Receptacle, Right Angle, SMT Solder Tails and ShellTabs, with Cover Tape, Lead-free, LCP Housing
|
Molex Electronics Ltd.
|
| AM29F800BT-90WBC AM29F800BT-55WBI AM29F800BB-55WBE |
and flexible way to implement power solutions for the latest high performance CPUs and ASICs.; Same as IR3087 with bag packaging
30V Single N-Channel HEXFET Power MOSFET in a I-Pak package; Similar to IRFU3709Z with Lead Free Packaging
40V Single N-Channel HEXFET Power MOSFET in a SO-8 package; Similar to IRF7470 with Lead Free Packaging
Complete VR11.0 or AMD PVID power solution.; A IR3505M packaged on tape and reel 3000 per reel
8 PWM 400 KHz Sync Contr in a 8-Pin SOIC(NB) package; A IRU3037ACS with Standard Packaging
55V Single N-Channel HEXFET Power MOSFET in a D2-Pak package; Similar to IRLZ44NS with Lead Free Packaging
The XPHASE Control IC combined with an IR XPhase TM Phase IC provides a full featured and flexible way to implement a complete an Opteron or Athlon 64 power solution.; A IR3082M with Tape and Reel Packaging
55V Single N-Channel HEXFET Power MOSFET in a SOT-223 package; Similar to IRLL024Z with Lead Free Packaging
55V Single N-Channel HEXFET Power MOSFET in a SOT-223 package; A IRLL2705 with Standard Packaging
75V Single N-Channel HEXFET Power MOSFET in a TO-262 Package; Similar to IRF2807ZL with Lead Free Packaging
55V Single N-Channel HEXFET Power MOSFET in a D2-Pak package; Similar to IRF3805S with Lead Free Packaging
x8/x16 Flash EEPROM x8/x16闪存EEPROM
XPHASE VRD10 Control IC with VccVid and Overtemp Detect; Similar to IR3080M with Lead Free Packaging on Tape and Reel x8/x16闪存EEPROM
XPHASE IC with Fault and Overtemp Detect; Same as the IR3088AM with Tape and Reel Packaging. x8/x16闪存EEPROM
8 Megabit (1 M x 8-Bit/512 K x 16-Bit) CMOS 5.0 Volt-only, Boot Sector Flash Memory 512K X 16 FLASH 5V PROM, 70 ns, PDSO48
8 Megabit (1 M x 8-Bit/512 K x 16-Bit) CMOS 5.0 Volt-only, Boot Sector Flash Memory 512K X 16 FLASH 5V PROM, 70 ns, PDSO44
8 Megabit (1 M x 8-Bit/512 K x 16-Bit) CMOS 5.0 Volt-only, Boot Sector Flash Memory 512K X 16 FLASH 5V PROM, 150 ns, PDSO48
8 Megabit (1 M x 8-Bit/512 K x 16-Bit) CMOS 5.0 Volt-only, Boot Sector Flash Memory 512K X 16 FLASH 5V PROM, 150 ns, PDSO44
|
Linear Technology, Corp.
ATM Electronic, Corp.
Integrated Device Technology, Inc.
Advanced Micro Devices, Inc.
|
| 42-21SURC/S530-A3/TR8 |
LED: 1.8mm Round Subminiature Chip LED: Lead Free: Tape and Reel
|
Everlight Electronic Co., Ltd.
|
| 0533750590 53375-0590 |
2.50mm (.098) Pitch Mini-Lock Wire-to-Board Header, Vertical, Friction and PositiveLock, Radial Tape Packaging, 5 Circuits, Lead-free
|
Molex Electronics Ltd.
|
| 0534260790 53426-0790 |
2.50mm (.098) Pitch Mini-Lock?/a> Wire-to-Board Header, Right Angle, Friction and Positive Lock, Radial Tape Packaging, 7 Circuits, Lead-free
2.50mm (.098") Pitch Mini-Lock垄芒 Wire-to-Board Header, Right Angle, Friction and Positive Lock, Radial Tape Packaging, 7 Circuits, Lead-free
|
Molex Electronics Ltd.
|
| PS7221-2A PS7221-2A-F3 PS7221-2A-F4 PS72221-2A-F4 |
3 Phase Driver, Soft Turn-on, Inverting Input Separate High and Low Side Inputs, 200ns Deadtime.; A IR2136 packaged in a Lead-Free 28-Lead SOIC 场效应管输出光耦合
3 Phase Driver, Soft Turn-on, Inverting Input Separate High and Low Side Inputs, 200ns Deadtime.; Similar to IR2136S with Lead-Free Packaging shipped on Tape and Reel
FET-OUTPUT OPTOCOUPLER
8-PIN SOP 200 V BREAK DOWN VOLTAGE 2-ch Optical Coupled MOS FET
|
NEC, Corp.
NEC Corp.
NEC[NEC]
|
| MMSZ5254B MMSZ5234B MMSZ5256B MICROCOMMERCIALCOMPO |
500 mW Zener Diodes 2.4 to 39 Volts
2.93 V Microprocessor Reset with Open Drain Output and 100 ms Minimum Delay; Package: SC-70 (SOT-323) 3 LEAD; No of Pins: 3; Container: Tape and Reel; Qty per Container: 3000
Single Non Inverting Buffer, 3-State; Package: SC-88A, SOT-353, SC-70 5 LEAD; No of Pins: 5; Container: Tape and Reel; Qty per Container: 3000
2.63V uP Supervisory Circuit with Active High and Active Low Complementary outputs, Pb-Free Device; Package: Micro8™; No of Pins: 8; Container
|
Micro Commercial Compon...
Micro Commercial Components Corp.
|
| 0877592083 |
2.00mm (.079) Pitch Milli-Grid Header, Surface Mount, Vertical, 20 Circuits, 2.54μm (100μ) Tin (Sn) Plating, without Peg, Embossed Tape onReel, Lead-free
|
Molex Electronics Ltd.
|
| 87920-9311 0879209311 |
2.54mm (.100) Pitch C-Grid? Header, Surface Mount, Dual Row, Vertical, 4 Circuits, Tin (Sn) Overall Plating, with Cap, without Peg, Tape on Reel Packaging, Lead-free
|
Molex Electronics Ltd.
|
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