PART |
Description |
Maker |
10-89-7321 |
(10-89-7xxx) Dual Row / Straight / Breakaway Header
|
Molex
|
DDS040-347TG DDS010-347TG DDS030-347TG DDS050-168T |
40 POS DUAL ROW SOCKET DIP80, IC SOCKET 10 POS DUAL ROW SOCKET DIP20, IC SOCKET 30 POS DUAL ROW SOCKET DIP60, IC SOCKET 50 POS DUAL ROW SOCKET DIP100, IC SOCKET 20 POS DUAL ROW SOCKET DIP40, IC SOCKET 10 POS SINGLE ROW ADAPTER SIP10, IC SOCKET 20 POS SINGLE ROW ADAPTER SIP20, IC SOCKET
|
Advanced Interconnections, Corp. ADVANCED INTERCONNECTIONS CORP
|
87761-4408 |
2.00mm (.079) Pitch Milli-Grid Header, Dual Row Dual Body, Through Hole, Vertical, 44 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, 12.50mm (.492) Stacking
|
Molex Electronics Ltd.
|
0741620040 74162-0040 74162-1030 |
2.54mm (.100) Pitch C-Grid? Receptacle, Right Angle, Through Hole, Dual Row,Shrouded, Version B, High-Temperature, 30 Circuits, Tin (Sn) 2.54mm (.100) Pitch C-Grid Receptacle, Right Angle, Through Hole, Dual Row, Shrouded MOLEX Connector
|
Molex Electronics Ltd.
|
855-99-016-20-001 855-93-016-20-001 855-91-016-20- |
PCB connectors 1.27 mm Single row / double row / triple row Solder tail 电路板连接器1.27毫米单列/双列/三列焊尾
|
PRECI-DIP SA PREDIP[Precid-Dip Durtal SA]
|
805-99-016-10-001 801-91-016-10-001 801-93-016-10- |
PCB connectors 2.54 mm Single row / double row / triple row Solder tail 电路板连接器2.54毫米单列/双列/三列焊尾
|
PRECI-DIP SA PREDIP[Precid-Dip Durtal SA]
|
87761-5021 |
2.00mm (.079) Pitch Milli-Grid?/a> Header, Dual Row Dual Body, Through Hole, Vertical, 50 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, 8.70mm (.343) Stacking Height
|
Molex Electronics Ltd.
|
15-44-5172 |
2.54mm (.100) Pitch C-Grid? Receptacle, Through Hole, Dual Row 2.54mm (.100") Pitch C-Grid垄莽 Receptacle, Through Hole, Dual Row
|
Molex Electronics Ltd.
|
87914-2216 0879142216 |
2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, 22 Circuits, 2.50μm (98.4μ) Tin (Sn) Overall Plating, Tray Packaging, Lead-free 2.54mm (.100) Pitch C-Grid庐 Header, Through Hole, Dual Row, Vertical, 22 Circuits, 2.50渭m (98.4渭) Tin (Sn) Overall Plating, Tray Packaging, Lead-free 2.54mm (.100) Pitch C-Grid垄莽 Header, Through Hole, Dual Row, Vertical, 22 Circuits, 2.50楼矛m (98.4楼矛) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
|
Molex Electronics Ltd.
|
0039299024 39-29-9024 5566-02B2GS |
4.20mm (.165) Pitch Mini-Fit Jr. Header, Dual Row, Vertical, with Snap-in Plastic 4.20mm (.165) Pitch Mini-Fit Jr. Header, Dual Row, Vertical, with Snap-in Plastic Selective Plating, with Drain Holes
|
Molex Electronics Ltd.
|
|