| PART |
Description |
Maker |
| HSB88WA |
CMPAK package is suitable for high density surface mounting and high speed assembly
|
TY Semiconductor Co., Ltd
|
| LTV817 LTV827 LTV847 |
HIgh Density Mounting Type Photocoupler
|
TMT[Taiwan Memory Technology]
LITEON
|
| BL817 |
High Density Mounting Type Photocoupler
|
SeCoS
|
| LTV847M-V LTV847-V LTV847S-V LTV-817 LTV817-V LTV8 |
High Density Mounting Type Photocoupler
|
Shenzhen Tenand Technology Co., Ltd.
|
| BL817 |
High Density Mounting Type Photocoupler
|
SeCoS Halbleitertechnologie GmbH
|
| PC-815 |
High Sensitivity, High Density Mounting Type Photocoupler
|
N/A
|
| HCPL-817 |
Phototransistor Optocoupler High Density Mounting Type
|
AVAGO TECHNOLOGIES LIMITED
|
| LTV817 LTV817M |
High Density Mounting Type Photocoupler(484.19 k)
|
LITE-ON
|
| ISP321-1-88XSM |
HIGH DENSITY MOUNTING PHOTOTRANSISTOR OPTICALLY COUPLED ISOLATORS
|
ISOCOM
List of Unclassifed Manufacturers
|
| IS181 |
HIGH DENSITY MOUNTING PHOTOTRANSISTOR OPTICALLY COUPLED ISOLATORS
|
ISOCOM COMPONENTS
|
| LTV-355T |
Hybrid substrates that require high density mounting Programmable controllers
|
光宝科技股份有限公司
Lite-On Technology Corporation
|
