| PART |
Description |
Maker |
| MICRF008 MICRF008BM |
QwikRadio?/a> Sweep-Mode Receiver
QwikRadio™ Sweep-Mode Receiver
QwikRadio Sweep-Mode Receiver
QwikRadio⑩ Sweep-Mode Receiver
QwikRadioSweep-Mode Receiver QwikRadio系列⑩扫描模式接收机
|
MICREL[Micrel Semiconductor]
Micrel Semiconductor,Inc.
Micrel Semiconductor, Inc.
|
| 90130-1216 0901301216 |
2.54mm (.100) Pitch C-Grid III Header, Dual Row, Vertical, Shrouded, Fully Loaded, 16 Circuits, Black, 0.38μm (15μ) Gold (Au) Selective Plating
2.54mm (.100") Pitch C-Grid III垄芒 Header, Dual Row, Vertical, Shrouded, Fully Loaded, 16 Circuits, Black, 0.38楼矛m (15楼矛") Gold (Au) Selective Plating
|
Molex Electronics Ltd.
|
| 90130-1214 0901301214 |
2.54mm (.100) Pitch C-Grid III Header, Dual Row, Vertical, Shrouded, Fully Loaded, 14 Circuits, Black, 0.38μm (15μ) Gold (Au) Selective Plating
2.54mm (.100) Pitch C-Grid III垄芒 Header, Dual Row, Vertical, Shrouded, Fully Loaded, 14 Circuits, Black, 0.38楼矛m (15楼矛) Gold (Au) Selective Plating
|
Molex Electronics Ltd.
|
| 90130-1224 0901301224 |
2.54mm (.100) Pitch C-Grid III Header, Dual Row, Vertical, Shrouded, Fully Loaded, 24 Circuits, Black, 0.38μm (15μ) Gold (Au) Selective Plating
2.54mm (.100) Pitch C-Grid III垄芒 Header, Dual Row, Vertical, Shrouded, Fully Loaded, 24 Circuits, Black, 0.38楼矛m (15楼矛) Gold (Au) Selective Plating
|
Molex Electronics Ltd.
|
| 87834-4419 |
2.54mm (.100) Pitch C-Grid? Header, Dual Row, Low Profile, Vertical, Shrouded, 44 Circuits, 0.13μm (5μ) Gold (Au) Plating, Black, without PCB Locator
2.54mm (.100) Pitch C-Grid垄莽 Header, Dual Row, Low Profile, Vertical, Shrouded, 44 Circuits, 0.13楼矛m (5楼矛) Gold (Au) Plating, Black, without PCB Locator
|
Molex Electronics Ltd.
|
| 34792-9040 |
Mini50 Unsealed, Single Row, Vertical Header, 4 Circuit, Polarization Option A, Black, Tube
|
Molex Electronics Ltd.
|
| 34792-0040 |
Mini50?Unsealed, Single Row, Vertical Header, 4 Circuit, Polarization Option A, Black, Tray
|
Molex Electronics Ltd.
|
| 0780790011 78079-0011 |
1.00mm (.039) Pitch DDR3 DIMM Socket, Vertical, Through Hole, with Beveled Metal Pins, Black Housing and Latches, 0.76渭m (30渭) Gold (Au) Plating
1.00mm (.039) Pitch DDR3 DIMM Socket, Vertical, Through Hole, with Beveled Metal Pins, Black Housing and Latches, 0.76μm (30μ) Gold (Au) Plating
|
Molex Electronics Ltd.
|
| 0908160004 90816-0004 |
1.27mm (.050) Pitch Picoflex SMT Latched Vertical Header, 4 Circuits, Tin (Sn) Plating, Black
|
Molex Electronics Ltd.
|
| 0908163512 90816-3512 |
1.27mm (.050) Pitch Picoflex SMT Latched Vertical Header, 12 Circuits, Gold (Au) Plating, Black
|
Molex Electronics Ltd.
|
|
