PART |
Description |
Maker |
KBC1100L KBC1100L-PE |
MOBILE KBC WITH SFI ADC AND DAC WITH SMSC SENTINELALERT
|
SMSC[SMSC Corporation]
|
UPC2745 UPC2745TB UPC2745TB-E3 UPC2746TB UPC2746TB |
3 V, SUPER MINIMOLD SILICON MMIC WIDEBAND AMPLIFIER FOR MOBILE COMMUNICATIONS
|
NEC[NEC]
|
W83977TF |
W83877TF plus KBC, GP I/O, Wake-Up
|
Winbond Electronics
|
UPC2771TB UPC2763TB-E3 UPC2771TB-E3 |
3 V/ SUPER MINIMOLD SILICON MMIC MEDIUM OUTPUT POWER AMPLIFIER FOR MOBILE COMMUNICATIONS 3 V, SUPER MINIMOLD SILICON MMIC MEDIUM OUTPUT POWER AMPLIFIER FOR MOBILE COMMUNICATIONS 3伏,超级MINIMOLD硅MMIC中功率放大器输出功率移动通信 3 V/ 2.9 GHz SILICON MMIC MEDIUM OUTPUT POWER AMPLIFIER FOR MOBILE COMMUNICATIONS
|
NEC, Corp.
|
UPC2762TB1 |
3 V, SUPER MINIMOLD SILICON MMIC MEDIUM OUTPUT POWER AMPLIFIER FOR MOBILE COMMUNICATIONS
|
NEC
|
SCH3114 SCH3116I-NU SCH3112 SCH3112_06 SCH3112I-NU |
LPC IO with 8042 KBC, Reset Generation, HWM and Multiple Serial Ports
|
SMSC[SMSC Corporation]
|
HYB18M512160BFX HYB18M512160BFX-7.5 |
DRAMs for Mobile Applications 512-Mbit DDR Mobile-RAM
|
Qimonda AG
|
DVS-355-ZU25E DVS-355-MU25E DVS-355-SU25E DVS-355M |
Embedded/Mobile Digital Video Platform with Intel Core Duo Mobile Processor
|
Advantech Co., Ltd.
|
HYB18L256160BCL-7.5 HYB18L256160BFL-7.5 |
DRAMs for Mobile Applications 256-Mbit Mobile-RAM
|
Qimonda AG
|
HYE18L256169BFX-7.5 HYB18L256169BFX HYB18L256169BF |
DRAMs for Mobile Applications 256-Mbit Mobile-RAM
|
Qimonda AG
|
HYB18M1G320BF HYE18M1G320BF-7.5 HYB18M1G320BF-7.5 |
DRAMs for Mobile Applications 1-Gbit x32 DDR Mobile-RAM 8M X 32 DDR DRAM, 6.5 ns, PBGA90
|
Qimonda AG http://
|
LPCTP-1 |
Mobile Mobile Phones Portable Radio Portable Satellite PDA
|
ITT Industries
|