| PART |
Description |
Maker |
| HP333 |
Double-end type high-sensitivity photo diode mounted in a compact clear package
|
Kodenshi Corp
KODENSHI KOREA CORP.
|
| 0749934009 74993-4009 |
2.00mm (.079) Pitch HDM? Board-to-Board Stacking Header, High Rise Vertical, SMC, Double End Wall Option, Solder Tail, 72 Circuits, Lead Free
2.00mm (.079) Pitch HDM庐 Board-to-Board Stacking Header, High Rise Vertical, SMC, Double End Wall Option, Solder Tail, 72 Circuits, Lead Free
MOLEX Connector
|
Molex Electronics Ltd.
|
| SB23YR80BCARMYIB ST23YR80 |
ST23 Dual Interface Secure MCU with 80 KBytes of EEPROM, enhanced security and Nescrypt cryptoprocessor, RF Type B (Contactless High end ID-Passport/PKI)
|
ST Microelectronics
|
| NX3DV42GM NX3DV42GU |
Dual high-speed USB 2.0 double-pole double-throw analog
|
NXP Semiconductors
|
| W6662CF |
CCD(Correlated Double Sampler)/CIS(Contact Image Sensors) Analog Front End Signal Processor.(耦合采样器／接触图象传感器模拟前端信号处理器)
|
Winbond Electronics Corp
|
| 73810-1206 0738101206 |
2.00mm (.079) Pitch HDM? Board-to-Board Midplane Header, Vertical SMC, PressFit, Double End Option, Slide On Housing, 144 Circuits
2.00mm (.079") Pitch HDM庐 Board-to-Board Midplane Header, Vertical SMC, PressFit, Double End Option, Slide On Housing, 144 Circuits
|
Molex Electronics Ltd.
|
| 73810-1202 0738101202 |
2.00mm (.079) Pitch HDM? Board-to-Board Midplane Header, Vertical SMC, PressFit, Double End Option, Slide On Housing, 144 Circuits
2.00mm (.079") Pitch HDM庐 Board-to-Board Midplane Header, Vertical SMC, PressFit, Double End Option, Slide On Housing, 144 Circuits
|
Molex Electronics Ltd.
|
| 73810-1207 0738101207 |
2.00mm (.079) Pitch HDM? Board-to-Board Midplane Header, Vertical SMC, Press-Fit, Double End Option, Slide On Housing, 144 Circuits
2.00mm (.079) Pitch HDM庐 Board-to-Board Midplane Header, Vertical SMC, Press-Fit, Double End Option, Slide On Housing, 144 Circuits
|
Molex Electronics Ltd.
|
| NNCD5.1F NNCD5.6F NNCD6.2F NNCD6.8F NNCD4.3F NNCD4 |
ELECTROSTATIC DISCHARGE NOISE CLIPPING DIODES DOUBLE TYPE, ANODE COMMON 3PIN MINI MOLD 静电放电二极管双噪音裁剪式，阳极通用3针迷你模
RES 309-OHM 0.5% 0.10W 25PPM THIN-FILM SMD-0805 TR-7-PA ROHS
ELECTROSTATIC DISCHARGE NOISE CLIPPING DIODES DOUBLE TYPE / ANODE COMMON 3PIN MINI MOLD
ELECTROSTATIC DISCHARGE NOISE CLIPPING DIODES DOUBLE TYPE ANODE COMMON 3PIN MINI MOLD
|
NEC, Corp.
NEC Corp.
NEC[NEC]
|
| K4S643232F-TL45 K4S643232F-TL55 K4S643232F-TL70 K4 |
IR LED 950NM 18 DEG DOUBLE END
2M x 32 SDRAM 512K x 32bit x 4 Banks Synchronous DRAM LVTTL 200万32内存12k × 32 × 4银行同步DRAM LVTTL
|
Samsung Electronic
SAMSUNG[Samsung semiconductor]
SAMSUNG SEMICONDUCTOR CO. LTD.
Samsung Semiconductor Co., Ltd.
|
| 2-1123309-2 2-1123309-3 |
DOUBLE RW HEADER ASSY 4P
DOUBLE ROW HEADER ASSY 4P(H TYPE) <DYNAMIC D-5200 D>
|
Tyco Electronics
|
|
