| PART |
Description |
Maker |
| WEDPS512K32-12BC WEDPS512K32-12BI WEDPS512K32-12BM |
512Kx32 SRAM MULTI-CHIP PACKAGE
|
WEDC[White Electronic Designs Corporation]
|
| WS512K32-45 WS512K32-20 WS512K32-25 WS512K32-17 WS |
512Kx32 SRAM Module(512Kx32静态RAM模块（存取时5ns
512Kx32 SRAM Module(512Kx32静态RAM模块（存取时0ns
512Kx32 SRAM Module(512Kx32静态RAM模块（存取时7ns
512Kx32 SRAM Module(512Kx32???RAM妯″?锛???????5ns锛?
|
White Electronic Designs Corporation
|
| WSF512K32-XXX WSF512K32-29H2C WSF512K32-29H2CA WSF |
512KX32 SRAM / FLASH MODULE
|
WEDC[White Electronic Designs Corporation]
|
| WS512K32-85G2TI WS512K32-100G2TI WS512K32-85G2TC W |
512Kx32 SRAM MODULE, SMD 5962-94611
|
WEDC[White Electronic Designs Corporation]
|
| PUMA2S16000M-025 PUMA77S16000M-020 PUMA2S16000I-02 |
15NS, 68 PLCC, IND TEMP(EPLD)
SRAM|512KX32|CMOS|PGA|66PIN|CERAMIC
15NS, 68 PLCC, COM TEMP(EPLD)
SRAM|512KX32|CMOS|QFP|68PIN|CERAMIC
20NS, 44 PLCC, IND TEMP(EPLD)
30MHZ, 20 PLCC, IND TEMP, GREEN(FPGA)
15NS, TQFP, COM TEMP, ROHS-A(EPLD)
20NS, 44 TQFP, COM TEMP(EPLD)
7NS, 44 TQFP, COM TEMP, GREEN(EPLD)
30MHZ, 3.3V, 20 PLCC, IND TEMP(FPGA) 静态存储器| 512KX32 |的CMOS |美巡赛| 66PIN |陶瓷
|
Intel, Corp.
|
| ACT-SF41632N-39P5Q ACT-SF41632N-39P5I ACT-SF41632N |
ACT-SF41632 High Speed 128Kx32 SRAM / 512Kx32 Flash Multichip Module
|
Aeroflex Circuit Techno...
|
| W82MV-NSBC W82MV-NSBI |
2Mx32 SRAM 3.3V MULTI-CHIP PACKAGE
|
http://
|
| TH50VSF3580AASB |
SRAM AND FLASH MEMORY MIXED MULTI-CHIP PACKAGE
|
TOSHIBA
|
| WF512K32-120G4TQ5A WF512K32-120G4TM5 WF512K32-120G |
EEPROM|FLASH|512KX32|HYBRID|QFL|68PIN|CERAMIC
EEPROM|FLASH|512KX32|HYBRID|QFP|68PIN|CERAMIC 的EEPROM | FLASH动画| 512KX32 |混合| QFP封装| 68PIN |陶瓷
|
SMSC, Corp.
|
| DS42515 AM29DL164D |
Stacked Multi-Chip Package (MCP) Flash Memory and SRAM
|
AMD[Advanced Micro Devices]
|
| AT68166FT-YM25-E AT68166FT-YM25-SCC AT68166FT-YS18 |
Rad Hard 16 MegaBit 3.3V 5V Tolerant SRAM Multi-Chip Module
|
ATMEL Corporation
|
