| PART |
Description |
Maker |
| FDG6322C |
Very small package outline SC70-6.
|
TY Semiconductor Co., L...
|
| TO263 |
Package Outline Drawing Transistor Outline 封装外形图晶体管外形
|
Electronic Theatre Controls, Inc.
ETC
List of Unclassifed Manufacturers
|
| ADM6384YKS26D3Z-R7 ADM6384YKS23D3Z-R7 |
Microprocessor Supervisory Circuit in 4-Lead SC70; Package: SC70; No of Pins: 4; Temperature Range: Automotive 1-CHANNEL POWER SUPPLY SUPPORT CKT, PDSO4
|
Analog Devices, Inc.
|
| 8SOIC |
8 PIN SOIC PACKAGE OUTLINE
8 PIN SOIC PACKAGE OUTLINE
|
SMSC[SMSC Corporation]
|
| AP2311GN-HF AP2311GN-HF-14 |
1.8 A, 60 V, 0.25 ohm, P-CHANNEL, Si, POWER, MOSFET HALOGEN FREE AND ROHS COMPLIANT PACKAGE-3
Simple Drive Requirement, Small Package Outline
|
Advanced Power Electronics, Corp.
Advanced Power Electronics Corp.
Advanced Power Electronics ...
|
| AP2317GN-HF |
4.2 A, 20 V, 0.052 ohm, P-CHANNEL, Si, POWER, MOSFET HALOGEN FREE AND ROHS COMPLIANT PACKAGE-3
Simple Drive Requirement, Small Package Outline
|
Advanced Power Electronics, Corp.
Advanced Power Electronics Corp.
|
| SC70-5 |
Package Outline
|
Global Mixed-mode Techn...
|
| TQFN4X4-28 |
Package Outline
|
Global Mixed-mode Techn...
|
| TQFN5X5-12 |
Package Outline
|
Global Mixed-mode Techn...
|
| TSSOP-16-EP |
Package Outline
|
Global Mixed-mode Techn...
|
| WLCSP4X5-20 |
Package Outline
|
Global Mixed-mode Techn...
|
