| PART |
Description |
Maker |
| FDG6322C |
Very small package outline SC70-6.
|
TY Semiconductor Co., L...
|
| TO263 |
Package Outline Drawing Transistor Outline 封装外形图晶体管外形
|
Electronic Theatre Controls, Inc.
ETC
List of Unclassifed Manufacturers
|
| 8SOIC |
8 PIN SOIC PACKAGE OUTLINE
8 PIN SOIC PACKAGE OUTLINE
|
SMSC[SMSC Corporation]
|
| AP2301BGN-HF AP2301BGN-HF-14 |
2.8 A, 20 V, 0.13 ohm, P-CHANNEL, Si, POWER, MOSFET HALOGEN FREE AND ROHS COMPLIANT PACKAGE-3
Simple Drive Requirement, Small Package Outline
|
Advanced Power Electronics, Corp.
Advanced Power Electronics Corp.
Advanced Power Electron...
|
| WDFN2X2-6 |
Package Outline
|
Global Mixed-mode Techn...
|
| SC70-5 |
Package Outline
|
Global Mixed-mode Techn...
|
| TQFN4X4-28 |
Package Outline
|
Global Mixed-mode Techn...
|
| TQFN4X4-20 |
Package Outline
|
Global Mixed-mode Techn...
|
| TQFN5X5-20 |
Package Outline
|
Global Mixed-mode Techn...
|
| TQFN2X2-12 |
Package Outline
|
Global Mixed-mode Techn...
|
| TQFN3X6-32 |
Package Outline
|
Global Mixed-mode Techn...
|
