| PART |
Description |
Maker |
| 3E27 |
Material specification
|
Ferroxcube International Holding B.V.
|
| 3F4 |
Material specification
|
Ferroxcube International Holding B.V.
|
| 4M2 |
Material specification
|
Ferroxcube International Holding B.V.
|
| 3C93 |
Material specification
|
Ferroxcube International Holding B.V.
|
| 3E55 |
Material specification
|
Electronic Theatre Controls, Inc.
|
| 3E6 |
Material specification
|
Ferroxcube International Holding B.V.
|
| 3C30 |
Material specification
|
Ferroxcube International Holding B.V.
|
| 4A15 |
Material specification
|
Ferroxcube International Holding B.V.
|
| 4A11 |
Material specification
|
Ferroxcube International Holding B.V.
|
| 8C11 |
Material specification
|
Ferroxcube International Holding B.V.
|
| EE16-K-H-10P-SW-AW |
BOBBIN MATERIAL: PHENOLIC PIN MATERIAL: CP WIRE UL REC. UL 94V-0
|
FERYSTER Inductive Components Manufacturer
|
| K4S641632H-UC60 K4S641632H-UC70 K4S641632H-UC75 K4 |
64Mb H-die SDRAM Specification 54 TSOP-II with Pb-Free (RoHS compliant) 64芯片与内存规格铅54 TSOP-II免费（符合RoHS
D-Subminiature Connector; Gender:Female; No. of Contacts:50; Contact Termination:IDC; D Sub Shell Size:DB50; Body Material:Steel; Contact Plating:Gold Over Nickel RoHS Compliant: Yes 64芯片与内存规格铅54 TSOP-II免费（符合RoHS
64Mb H-die SDRAM Specification 54 TSOP-II with Pb-Free 64芯片与内存规格铅54 TSOP-II免费
DELTA CONN 14POS PLUG W/O INSERT
DELTA CONN 14 POS PLUG BAIL LOCK
|
Samsung Semiconductor Co., Ltd.
SAMSUNG SEMICONDUCTOR CO. LTD.
SAMSUNG[Samsung semiconductor]
|
