| PART |
Description |
Maker |
| AP2301EN-HF-14 |
Small Package Outline
|
Advanced Power Electron...
|
| AP2305AGN-HF |
3.2 A, 30 V, 0.06 ohm, P-CHANNEL, Si, POWER, MOSFET HALOGEN FREE AND ROHS COMPLIANT PACKAGE-3
Simple Drive Requirement, Small Package Outline
|
Advanced Power Electronics, Corp.
Advanced Power Electronics Corp.
|
| SO-8 |
8-LEAD SMALL OUTLINE PACKAGE
|
STMicroelectronics
|
| MSA20 |
20-Lead Shrink Small Outline Package (SSOP), EIAJ TYPE II, 5.3mm Wide Package Number MSA20 20 -铅收缩小型封装（SSOP封装），EIAJ型二.3mm宽包MSA20
|
Fairchild Semiconductor, Corp.
Fairchild Semiconductor Corporation
|
| AP2328GN-HF |
Capable of 2.5V Gate Drive, Small Outline Package
|
Advanced Power Electronics Corp.
|
| AP2327GN-HF |
Simple Drive Requirement, Small Package Outline
|
Advanced Power Electronics Corp.
|
| AP2321GN-HF AP2321GN-HF14 |
Simple Drive Requirement, Small Package Outline
|
Advanced Power Electronics Corp.
|
| LC33832M-70 LC33832P-70 LC33832M-10 LC33832PL-10 L |
Small outline package version of the LC33832SL
x8 Pseudo-Static RAM
|
Sanyo Semiconductor
|
| AP2310GN-HF |
Simple Drive Requirement, Small Package Outline, Surface Mount Device
|
Advanced Power Electronics Corp.
|
| R-8 |
8-Lead Standard Small Outline Package [SOIC_N] Narrow Body Dimensions
|
Analog Devices
|
| SOT765-1 |
plastic very thin shrink small outline package; 8 leads; body width 2.3 mm
|
NXP Semiconductors
PHILIPS[Philips Semiconductors]
|
| MT2LDT432HG-6X MT2LDT432HG-5X MT4LDT832HG-5XS MT2L |
SMALL-OUTLINE DRAM MODULE 小外形DRAM模块
Silver Mica Capacitor; Capacitance:1200pF; Capacitance Tolerance: 5%; Series:CDV30; Voltage Rating:1500VDC; Capacitor Dielectric Material:Mica; Termination:Radial Leaded; Lead Pitch:11.1mm; Leaded Process Compatible:No RoHS Compliant: No 小外形DRAM模块
|
Micron Technology, Inc.
|
