| PART |
Description |
Maker |
| MF1ICS2005W7D MF1ICS2005 MF1ICS2005U7D |
Sawn bumped 120レm wafer addendum
Sawn bumped 120μm wafer addendum
|
NXP Semiconductors N.V.
NXP[NXP Semiconductors]
|
| MF1ICS5005 MF1ICS5005V1D MF1ICS5005W1D |
Standard Card IC Specification “bumped sawn wafer on UV-tape”
|
NXP Semiconductors
Philips Semiconductors
|
| MF0ICU1001W |
120 micro m Bumped sawn wafer on UV-tape contactless single-trip ticket ICs
|
NXP Semiconductors N.V.
|
| MASW-009276-000DIEV2 |
Bumped GaAs SP3T Switch for WLAN
|
M/A-COM Technology Solutions, Inc.
|
| IRLC1304 2299 |
HEXFET Power MOSFET Die in Wafer Form(晶圆形式的HEXFET 功率MOS场效应管)
From old datasheet system
HEXFET? Power MOSFET Die in Wafer Form
|
International Rectifier
|
| 10-16-8151 |
KK2.5/5 WAFER ASSY
|
MOLEX INC
|
| CSPNL |
Wafer Level Packaging
|
Amkor Technology
|
| HFA04SD60S |
Hexfred Die in Wafer Form
|
International Rectifier
|
| FD200H02A5B |
Fred Die in Wafer Form
|
International Rectifier
|
| 0535053071 |
1.25 DUAL W/B CONN WAFER ASSY
|
Molex Electronics Ltd.
|
