| PART |
Description |
Maker |
| S10202-08 S10202-16 S10201-04 |
Back-thinned TDI-CCD Operating the back-thinned CCD in TDI mode delivers high sensitivity. 回到清淡TDI发动机，防治荒漠化工作的后台薄TDI的模式在防治荒漠化公约提供高灵敏度
|
Hamamatsu Photonics K.K.
|
| S7171-0909 S7170-0909 |
CCD area image sensor 512 × 512 pixels, Back-thinned FFT-CCD
CCD area image sensor 512 】 512 pixels, Back-thinned FFT-CCD
|
http://
Hamamatsu Corporation
|
| TEA5705 |
ADVANCED 4-HEAD PLAY-BACK AND RECORD AMPLIFIER FOR VCR
|
STMicroelectronics
|
| C8061-01 C755707 C8062-01 |
Multichannel detector head controller
|
Hamamatsu Corporation
|
| C596405 |
NMOS multichannel detector head
|
Hamamatsu Corporation
|
| C7041 C7020 C7021 C7025 |
Multichannel detector head controller
|
Hamamatsu Corporation
|
| C8940-01 |
PCI board for CCD multichannel detector head
|
Hamamatsu Photonics
|
| C7557-01 |
For control of multichannel detector head and data acquisition
|
Hamamatsu Corporation
|
| E3C-GE4 E3C-S20DW E3C-LS3R2M E3C-C E3C-A E3C-DS5W2 |
Compact Head Amplifier-separated Photoelectric Sensor
Thin, Compact Head Saves Space and Mounts Closely. Built-in Interference Protection Provided.
|
Omron Electronics LLC
|
| 312147-1 4-22430-8 408-6930 21041-7 6-22278-5 3121 |
Terminating Head 58247- 1 For MTA- 156 Receptacle Connectors Using Discrete Wire
Read these and all referenced instructions thoroughly before using the head.
|
Tyco Electronics
TE Connectivity Ltd
|
| MSS50-800 MSS40 MSS40-1200 MSS40-800 MSS50-1200 MS |
(MSS40 / MSS50) BACK TO BACK SCR MODULE
BACK TO BACK SCR MODULE
|
STMICROELECTRONICS[STMicroelectronics]
ST Microelectronics
|
| NTE1807 |
Integrated Circuit Head Amplifier Circuit for 2 Head VCR
|
NTE[NTE Electronics]
|
