PART |
Description |
Maker |
TPCP8J0107 |
TOSHIBA Multi-chip Device Silicon P Channel MOS Type (U-MOSIV) /Silicon NPN Epitaxial Type
|
Toshiba Semiconductor
|
TH50VSF3582AASB TH50VSF3583AASB |
TOSHIBA MULTI-CHIP INTEGRATED CIRCUIT SILICON GATE CMOS
|
TOSHIBA[Toshiba Semiconductor]
|
TH50VSF3582AASB |
MULTI-CHIP INTEGRATED CIRCUIT SILICON GATE CMOS SRAM AND FLASH MEMORY MIXED MULTI-CHIP PACKAGE
|
TOSHIBA
|
TH50VPN564 TH50VPN5640EBSB |
MULTI-CHIP INTEGRATED CIRCUIT SILICON GATE CMOS PSEUDO SRAM AND NAND E2PROM MEMORY MIXED MULTI-CHIP PACKAGE
|
TOSHIBA
|
SSM6G18NU |
Silicon P Channel MOS Type / Silicon Epitaxial Schottky Barrier Diode Multi-chip discrete device (P-ch SBD)
|
Toshiba Semiconductor
|
585-2325 585-2225 585-2211 585-2413 585-2415 585-2 |
Multi-Chip BASED LED T 1 3/4 Wedge BASED LEDs-MULTI-CHIP SINGLE COLOR DISPLAY CLUSTER, RED, 5.9 mm
|
Dialight Corporation Dialight PLC
|
TPC6D03 |
Multi-Chip Device Silicon PNP Epitaxial Type, Schottky Barrier Diode High-Speed Switching Applications DC-DC Converter Applications
|
TOSHIBA
|
ISD1100P ISD1100X ISD1112 ISD1110 ISD1120 ISD1110P |
Single-Chip Voice Record/Playback Device(Single-chip Durations of 12 seconds)(单片的录录音重放一片信息存储持续时12秒)) 单芯片语音记播放设备(单芯片的持续时12秒)(单片的录音/录音重放器(一片信息存储持续时12秒) Single-Chip Voice Record/Playback Devices 10- and 12-Second Durations(单片声音录音/回放芯片(单片信息存储持续时间12秒钟)) Single-Chip Voice Record/Playback Device(Single-chip Durations of 10 seconds)(单片的录录音重放一片信息存储持续时0秒)) Single-Chip Voice Record/Playback Device(Single-chip Durations of 12 seconds)(单片的录录音重放一片信息存储持续时2秒)) SINGLE CHIP VOICE RECORD / PLAYBACK DEVICES RES POWER .360 OHM 1W 5% SMT
|
List of Unclassifed Manufacturers Winbond Electronics, Corp. Winbond Electronics Corp ETC Electronic Theatre Controls, Inc.
|
WS512K8L-20CM WS512K8L-20CQA WS512K8-XCX WS512K8-2 |
512K X 8 MULTI DEVICE SRAM MODULE, 45 ns, CDIP32 512K X 8 MULTI DEVICE SRAM MODULE, 35 ns, CDIP32 512K X 8 MULTI DEVICE SRAM MODULE, 25 ns, CDIP32 512Kx8 SRAM MODULE, SMD 5962-92078
|
WEDC[White Electronic Designs Corporation]
|
CYM1821PZ-12C CYM1821PM-12C |
16K X 32 MULTI DEVICE SRAM MODULE, 12 ns, ZMA64 16K X 32 MULTI DEVICE SRAM MODULE, 12 ns, SMA64
|
Cypress Semiconductor, Corp.
|
SYS32512ZK-010 SYS32512ZK-012 SYS32512ZK-015 SYS32 |
512 K x 32 Static RAM 512K X 32 MULTI DEVICE SRAM MODULE, 12 ns, PZMA72 PLASTIC, ZIP-72 512K X 32 MULTI DEVICE SRAM MODULE, 10 ns, PZMA72 PLASTIC, ZIP-72 512K X 32 MULTI DEVICE SRAM MODULE, 12 ns, PSMA72 PLASTIC, SIMM-72 512K X 32 MULTI DEVICE SRAM MODULE, 10 ns, PSMA72 PLASTIC, SIMM-72 512 K x 32 Static RAM 512亩32静态RAM
|
Amphenol, Corp. MOSAIC http:// Fujitsu, Ltd. NXP Semiconductors N.V.
|