| PART |
Description |
Maker |
| 408-8737 |
The die assembly consists of an indenter die and nest die. Each die is held in the tool by a single screw
|
Tyco Electronics
|
| BUY25CS45B-01 |
Bare Die IGBT
|
Infineon Technologies AG
|
| 907-0010 912-0120 914-0040 914-0070 914-0140 912-0 |
PUNCH&DIE SET 3-12MM
PUNCH&DIE 10.0MM CIRCULAR
PUNCH&DIE 16.5MM CIRCULAR
PUNCH&DIE 25.0MM CIRCULAR
PUNCH&DIE 12.0MM CIRCULAR
PUNCH&DIE 9.0MM CIRCULAR
PUNCH&DIE 20.0MM CIRCULAR
PUNCH&DIE 12.5MM CIRCULAR
STRIPPER 37.0 X 13.7 D CON
STRIPPER 31.75MM DIAMETER 低产31.75MM直径
LOUVRE TOOL 卢浮宫工
PUNCH&DIE 10.0MM CIRCULAR
STRIPPER 67.2 X 16.5 D CON
|
Peregrine Semiconductor, Corp.
Molex, Inc.
|
| IRG4CC40KB |
IRG4CC40KB IGBT Die in Wafer Form
|
International Rectifier
|
| IRG4CC40UB |
IRG4CC30UB IGBT Die in Wafer Form
|
International Rectifier
|
| IRG4CH50UB |
IRG4CH50UB IGBT Die in Wafer Form
|
Fairchild Semiconductor, Corp.
International Rectifier
|
| IRG4CH40UB |
IRG4CH40UB IGBT Die in Wafer Form
|
International Rectifier
|
| IRG4CC58KB |
IRG4CC58KB IGBT Die in Wafer Form
|
International Rectifier
|
| IRG4CC70UB |
IRG4CC70UB IGBT Die in Wafer Form
|
International Rectifier
|
| IRG4CC88KB |
IRG4CC88KB IGBT Die in Wafer Form
|
International Rectifier
|
| IRG4CC40FB |
IRG4CC40FB IGBT Die in Wafer Form
|
International Rectifier
|
| IRG4CC30KB |
IRG4CC30KB IGBT Die in Wafer Form
|
International Rectifier
|
