| PART |
Description |
Maker |
| W981216BH W981216 W981216BH-75 W981216BH-75I W9812 |
2M x 4 Banks x 16 Bit SDRAM
Low Power SDRAM
Industrial SDRAM
2M x 4 BANKS x 16 BIT SDRAM
DRAM - Datasheet Reference
|
Winbond Electronics Corp
WINBOND[Winbond]
|
| M65KA128AE |
Low Power SDRAM
|
STMicroelectronics
|
| CMS3232LAF CMS3232LAG CMS3232LAH CMS3232LAX-75XX |
32M(1Mx32) Low Power SDRAM
|
FIDELIX
|
| MT46H64M16LFBF-6 |
Mobile Low-Power DDR SDRAM
|
Micron Technology
|
| CMS4A16LAX-75XX |
128M(8Mx16) Low Power SDRAM
|
FIDELIX
|
| CMS3232LAX-75EX |
32M(1Mx32) Low Power SDRAM
|
FIDELIX
|
| EP7312-IV-C EP7311-IV-C EP7311-EB-C EP7311-IB-C EP |
GT 3C 3#16S PIN PLUG 高性能，低功率系统，片上内存和增强的数字音频接
HIGH-PERFORMANCE, LOW-POWER SYSTEM-ON-CHIP WITH SDRAM AND ENHANCED DIGITAL AUDIO INTERFACE 32-BIT, 74 MHz, RISC MICROCONTROLLER, PQFP208
HIGH-PERFORMANCE, LOW-POWER SYSTEM-ON-CHIP WITH SDRAM AND ENHANCED DIGITAL AUDIO INTERFACE 高性能，低功率系统，片上内存和增强的数字音频接
|
Cirrus Logic, Inc.
|
| EM66932ABG-8G EM66932ABG-7.5G EM66932A EM66932ABG- |
4M x 32 Hand-Held Low Power SDRAM (LPSDRAM)
|
ETRON[Etron Technology, Inc.]
|
| V55C2128164V |
128Mbit LOW-POWER SDRAM 2.5 VOLT, TSOP II / BGA PACKAGE 8M X 16
|
Mosel Vitelic, Corp.
|
| EP7312-CV-C EP7311 EP7311-1 |
HIGH-PERFORMANCE LOW-POWER SYSTEM-ON-CHIP WITH SDRAM AND ENHANCED DIGITAL AUDIO INTERFACE
HIGH-PERFORMANCE/ LOW-POWER SYSTEM-ON-CHIP WITH SDRAM AND ENHANCED DIGITAL AUDIO INTERFACE
From old datasheet system
|
ETC[ETC]
|
| HY57V56820BT HY57V56820BLT-S HY57V56820BT-S HY57V5 |
32Mx8|3.3V|8K|K|SDR SDRAM - 256M
SDRAM|4X8MX8|CMOS|TSOP|54PIN|PLASTIC
4 Banks X 8M X 8Bit Synchronous DRAM
SDRAM - 256Mb
|
Hynix Semiconductor
|
| HYS64V4200GDL-7.5 HYS64V8220GDL HYS64V4200GDL-8-X |
x64 SDRAM Module
3.3 V SDRAM Modules(3.3 V 同步动态RAM模块)
3.3 V SDRAM Module(3.3 V SDRAM 模块)
4M X 64 SYNCHRONOUS DRAM MODULE, 6 ns, ZMA144
|
SIEMENS AG
INFINEON TECHNOLOGIES AG
|
