| PART |
Description |
Maker |
| 0402AU100BA2A 0603AU100BA2A 0805AU100BA2A 0402AU10 |
RF/Microwave C0G (NP0) Capacitors (RoHS)
|
AVX Corporation
|
| 08051U100JATJA 04022U100BA2A 04022U100BA4A 04022U1 |
RF/Microwave C0G (NP0) Capacitors (RoHS)
|
AVX Corporation
|
| 04023U0R8BAT2A 04023U100JAT2A 04023U1R0BAT2A 04023 |
Ultra Low ESR, “U Series, C0G (NP0) Chip Capacitors
Ultra Low ESR, U Series, C0G (NP0) Chip Capacitors
RF/Microwave C0G Capacitors
Ultra Low ESR, “U?Series, C0G (NP0) Chip Capacitors
Ultra Low ESR, “U?Series, C0G (NP0) Chip Capacitors
|
AVX Corporation
|
| MK05V7100JAT2A |
Ultra Low ESR, C0G (NP0) Chip Capacitors
|
AVX Corporation
|
| CDR35BX394AKYS CDR35BX394AMYS CDR31BP5R6BDUS CDR31 |
CAPACITOR, CERAMIC, MULTILAYER, 50 V, BX, 0.39 uF, SURFACE MOUNT, 1825 CHIP
CAP 5.6PF 100V .50 PF NP0(C0G) SMD-0805 BULK BASE/BARR/SOLDER S-M55681 CAPACITOR, CERAMIC, MULTILAYER, 100 V, BP, 0.0000056 uF, SURFACE MOUNT, 0805
CAP 5.6PF 100V .50 PF NP0(C0G) SMD-0805 BULK SOLDER-COAT M-M55681 CAPACITOR, CERAMIC, MULTILAYER, 100 V, BP, 0.0000056 uF, SURFACE MOUNT, 0805
CAP 2.7PF 100V .25 PF NP0(C0G) SMD-0805 BULK BASE/BARR/SOLDER M-M55681 CAPACITOR, CERAMIC, MULTILAYER, 100 V, BP, 0.0000027 uF, SURFACE MOUNT, 0805
CAP 7.5PF 100V .50 PF NP0(C0G) SMD-1206 BULK BASE/BARR/SOLDER M-M55681 CAPACITOR, CERAMIC, MULTILAYER, 100 V, BP, 0.0000075 uF, SURFACE MOUNT, 1206
CAP 7.5PF 100V .50 PF NP0(C0G) SMD-0805 BULK BASE/BARR/SOLDER M-M55681 CAPACITOR, CERAMIC, MULTILAYER, 100 V, BP, 0.0000075 uF, SURFACE MOUNT, 0805
CAP 4.7PF 100V .50 PF NP0(C0G) SMD-0805 BULK BASE/BARR/SOLDER M-M55681 CAPACITOR, CERAMIC, MULTILAYER, 100 V, BP, 0.0000047 uF, SURFACE MOUNT, 0805
CAP 1.6PF 100V .25 PF NP0(C0G) SMD-0805 BULK BASE/BARR/SOLDER M-M55681 CAPACITOR, CERAMIC, MULTILAYER, 100 V, BP, 0.0000016 uF, SURFACE MOUNT, 0805
CAP 5.6PF 100V .50 PF NP0(C0G) SMD-0805 BULK BASE/BARR/SOLDER M-M55681 CAPACITOR, CERAMIC, MULTILAYER, 100 V, BP, 0.0000056 uF, SURFACE MOUNT, 0805
CAP 7.5PF 100V .25 PF NP0(C0G) SMD-0805 BULK BASE/BARR/SOLDER M-M55681 CAPACITOR, CERAMIC, MULTILAYER, 100 V, BP, 0.0000075 uF, SURFACE MOUNT, 0805
CAP 1.6PF 100V .25 PF NP0(C0G) SMD-0805 BULK BASE/BARR/SOLDER S-M55681 CAPACITOR, CERAMIC, MULTILAYER, 100 V, BP, 0.0000016 uF, SURFACE MOUNT, 0805
CAP 0.22UF 50V 10% X7R SMD-1825 BULK SOLDER-COAT R-M55681 CAPACITOR, CERAMIC, MULTILAYER, 50 V, BX, 0.22 uF, SURFACE MOUNT, 1825
MIL-PRF-55681/Chips Part Number Example CDR31 thru CDR35
MIL-PRF-55681/Chips
MIL-PRF-55681/Chips Part Number Example CDR31 thru CDR35
|
AVX, Corp.
AVX Corporation
|
| CU1031100BAT4A CU0131100BAT2A CU0131100CAT2A CU013 |
Ultra Low ESR, “CU Series, C0G (NP0) Chip Capacitors
Ultra Low ESR, “CU?/a> Series, C0G (NP0) Chip Capacitors
|
AVX Corporation
|
| 04023U6R8CAT2A 04023U150JAT2A 04023U220JAT2A 04023 |
Ultra Low ESR, “U Series, C0G (NP0) Chip Capacitors
Ultra Low ESR, “U?Series, C0G (NP0) Chip Capacitors
|
AVX Corporation
|
| R1110N301B-TR R1110N501B-TR R1110N501A-TL R1110N40 |
CAP 15PF 200V 0.5PF C0H DIP-2 TUBE-PAK S-MIL-PRF-39014/22
CAP 0.47UF 50V 10% X7R DIP-2 TUBE-PAK R-MIL-PRF-39014/22 LONGLEAD
CAP 3900PF 50V 5% NP0(C0G) DIP-2 TUBE-PAK S-MIL-PRF-39014/22
CAP 0.18UF 50V 10% X7R DIP-2 TUBE-PAK R-MIL-PRF-39014/22
CAP 1000PF 200V 10% NP0(C0G) DIP-2 TUBE-PAK R-MIL-PRF-39014/22
LOW NOISE 150mA L.D.O REGULATOR FIXED POSITIVE LDO REGULATOR, PDSO5
CAP 4700PF 50V 5% NP0(C0G) DIP-2 TUBE-PAK S-MIL-PRF-39014/22 FIXED POSITIVE LDO REGULATOR, PDSO5
|
Ricoh Co., Ltd.
RICOH COMPANY LTD
RICOH electronics devices d...
|
| 24LC00T-EP 24LC00T-ESN 24LC00T-EOT 24LC00T-EST 24L |
CAP CER 100PF 100V 10% RADIAL 128位的I 2 C？总线串行EEPROM
CAP 100PF 100V 10% NP0(C0G) RAD.10 .15X.15 BULK TRIMMED-LEAD 128位的I 2 C？总线串行EEPROM
128 Bit I 2 C Bus Serial EEPROM 128位的I 2 C？总线串行EEPROM
CONNECTOR ACCESSORY
CAP 2700PF 50V 5% NP0(C0G) SMD-1206 TR-7
128 Bit I2C Bus Serial EEPROM
128 Bit I 2 C? Bus Serial EEPROM
|
HIROSE ELECTRIC Co., Ltd.
Microchip Technology, Inc.
Microchip Technology Inc.
MICROCHIP[Microchip Technology]
|
| FK10KM-12 |
CAP 4700PF 100V 1% NP0(C0G) AXIAL RAD.20 BULK R-MIL-PRF-20 STANDOFF 高速开关使
HIGH-SPEED SWITCHING USE
|
Mitsubishi Electric, Corp.
MITSUBISHI[Mitsubishi Electric Semiconductor]
|
| 1206GA150JAT1A 1808AA105JA11A 1808GC223JA11A 1808H |
CAP 15PF 2000V 5% NP0(C0G) SMD-1206 TR-7 PLATED-NI/SN CAPACITOR, CERAMIC, MULTILAYER, 2000 V, C0G, 0.000015 uF, SURFACE MOUNT, 1206
High Voltage MLC Chips For 600V to 5000V Application
High Voltage MLC Chips For 600V to 5000V Application
|
AVX, Corp.
AVX Corporation
|
| X28C010FI-20 X28C010FMB-15C7808 X28C010FMB-15C7619 |
CAP 6.8PF 100V .10 PF NP0(C0G) SMD-0603 TR-7 PLATED-NI/SN
Controller IC; Leaded Process Compatible:Yes; Peak Reflow Compatible (260 C):Yes
Controller IC; Leaded Process Compatible:No; Peak Reflow Compatible (260 C):No; Reel Quantity:2500
5 Volt, Byte Alterable EEPROM 128K X 8 EEPROM 5V, 120 ns, CDIP32
CAP 6.8PF 100V .25 PF NP0(C0G) SMD-0603 TR-13 PLATED-NI/SN 128K X 8 EEPROM 5V, 250 ns, CDFP32
5 Volt, Byte Alterable EEPROM 128K X 8 EEPROM 5V, 250 ns, CPGA36
5 Volt, Byte Alterable EEPROM 128K X 8 EEPROM 5V, 200 ns, CDSO32
|
Intersil Corporation
PROM
Intersil, Corp.
|
|
