| PART |
Description |
Maker |
| AGL250 M1AGL600 M1AGL250 AGL400 AGL015 M1AGL1000 |
IGLOO Low Power Flash FPGAs with Flash*Freeze Technology
|
http://
Microsemi Corporation
|
| AGLN010V2-CSG81 AGLN010V2-CS81 AGLN010V2-CS81YPP A |
IGLOO nano Low Power Flash FPGAs with Flash*Freeze Technology
IGLOO nano Low Power Flash FPGAs with Flash*Freeze Technology
|
Microsemi Corporation
|
| A3P1000-1FG144M M1A3P1000-1FG144M A3P1000-1FGG144M |
Military ProASIC3/EL Low-Power Flash FPGAs
|
Actel Corporation
|
| A3P1000-PQG208I A3P030-1CS100ES A3P030-1CS100PP A3 |
ProASIC3 Flash Family FPGAs with Optional Soft ARM Support
130-nm, 7-Layer Metal (6 Copper), Flash-Based CMOS Process
ProASIC3 Flash Family FPGAs with Optional Soft ARM Support
|
Microsemi Corporation
|
| APA1000-BG456I APA600 |
ProASICPLUS Flash Family FPGAs
ProASICPLUS Flash Family FPGAs
|
Actel Corporation
|
| HY29LV320BF-80 HY29LV320BF-80I HY29LV320BT-12I HY2 |
32 Mbit (2M x 16) Low Voltage Flash Memory 2M X 16 FLASH 3V PROM, 80 ns, PDSO48
32 Mbit (2M x 16) Low Voltage Flash Memory 2M X 16 FLASH 3V PROM, 70 ns, PDSO48
122 x 32 pixel format, LED Backlight available 2M X 16 FLASH 3V PROM, 120 ns, PBGA63
32 Mbit (2M x 16) Low Voltage Flash Memory 2M X 16 FLASH 3V PROM, 90 ns, PBGA63
150 x 32 pixel format, LED Backlight available
ECONOLINE: RKZ - Safety standards and approvals: EN 60950 certified, rated for 250VAC (LVD test report)- Custom Solutions Available- 3kVDC & 4kVDC Isolation- UL94V-0 Package Material- Power Sharing on Output- Efficiency to 84%
|
http://
Hynix Semiconductor, Inc.
Hynix Semiconductor Inc.
|
| EP3C40F324I7N EP3C120F484I7N EP3C16F484C6N EP3C16F |
Cyclone III low-cost FPGAs
Cyclone III low-cost FPGAs
|
Altera Corporation
|
| HY29LV160TT-12 HY29LV160TF-12 HY29LV160TT-70 HY29L |
16 Mbit (2M x 8/1M x 16) Low Voltage Flash Memory 1M X 16 FLASH 3V PROM, 70 ns, PBGA48
16 Mbit (2M x 8/1M x 16) Low Voltage Flash Memory 1M X 16 FLASH 2.7V PROM, 80 ns, PDSO48
16 Mbit (2M x 8/1M x 16) Low Voltage Flash Memory 1M X 16 FLASH 2.7V PROM, 80 ns, PBGA48
Circular Connector; No. of Contacts:55; Series:; Body Material:Aluminum; Connecting Termination:Solder; Connector Shell Size:22; Circular Contact Gender:Pin; Circular Shell Style:Wall Mount Receptacle; Insert Arrangement:22-55
|
http://
Hynix Semiconductor, Inc.
Hynix Semiconductor Inc.
|
| E28F002BL-T150 28F200BL-TB PA28F200BL-T150 E28F200 |
2-MBIT (128K x 16/ 256K x 8)LOW-POWER BOOT BLOCK FLASH MEMORY FAMILY
2-MBIT (128K x 16 / 256K x 8)LOW-POWER BOOT BLOCK FLASH MEMORY FAMILY
2-MBIT (128K x 16, 256K x 8)LOW-POWER BOOT BLOCK FLASH MEMORY FAMILY 256K X 8 FLASH 12V PROM, 150 ns, PDSO40
|
Intel Corporation
Intel Corp.
Intel, Corp.
|
| XC3090L XC3000L XC3020L XC3030L XC3042L XC3064L |
Part of the ZERO family of 3.3 V FPGAs
XC3000L Low Voltage Logic Cell Array Family
|
XILINX[Xilinx, Inc]
|
| DS123 XCF04SVOG20C XCF08PVOG48C XCF01SVOG20C XCF02 |
Platform Flash In-System Programmable Configuration PROMs
Low-Power Advanced CMOS NOR Flash Process
|
Xilinx, Inc
|
