PART |
Description |
Maker |
CMLM2205 |
MULTI DISCRETE MODULE SURFACE MOUNT SILICON SWITCHING NPN TRANSISTOR AND LOW VF SILICON SCHOTTKY DIODE MULTI DISCRETE MODULE⑩ SURFACE MOUNT SILICON SWITCHING NPN TRANSISTOR AND LOW VF SILICON SCHOTTKY DIODE MULTI DISCRETE MODULE??SURFACE MOUNT SILICON SWITCHING NPN TRANSISTOR AND LOW VF SILICON SCHOTTKY DIODE
|
CENTRAL[Central Semiconductor Corp]
|
HN7G02FU |
TOSHIBA Multi Chip Discrete Device
|
TOSHIBA[Toshiba Semiconductor]
|
HN2E05J |
MULTI CHIP DISCRETE DEVICE Super High Speed Switching Application
|
Toshiba Corporation Toshiba Semiconductor
|
SKY77604 |
Multi-Mode / Multi-Band Power Amplifier Module for Next Generation GGE and HSPA Handsets
|
Skyworks Solutions Inc.
|
SYS321000LK-012 SYS321000LK-015 SYS321000ZK-015 SY |
1M X 32 MULTI DEVICE SRAM MODULE, 15 ns, PSMA72 PLASTIC, SIMM-72 1M X 32 MULTI DEVICE SRAM MODULE, 15 ns, PZIP72 PLASTIC, ZIP-72 1M X 32 MULTI DEVICE SRAM MODULE, 20 ns, PSMA72 PLASTIC, SIMM-72 1M X 32 MULTI DEVICE SRAM MODULE, 12 ns, PZIP72 PLASTIC, ZIP-72 x32 SRAM Module X32号的SRAM模块 1M X 32 MULTI DEVICE SRAM MODULE, 20 ns, PZIP72 PLASTIC, ZIP-72
|
Sumida, Corp. TE Connectivity, Ltd.
|
CYM1841BPZ-20C CYM1841BPZ-45C CYM1841BP7-15C CYM18 |
256K X 32 MULTI DEVICE SRAM MODULE, 35 ns, SMA64 PLASTIC, SIMM-64 256K X 32 MULTI DEVICE SRAM MODULE, 45 ns, SMA64 PLASTIC, SIMM-64 256K X 32 MULTI DEVICE SRAM MODULE, 15 ns, SMA64 PLASTIC, SIMM-64 256K X 32 MULTI DEVICE SRAM MODULE, 25 ns, SMA64 PLASTIC, SIMM-64 256K X 32 MULTI DEVICE SRAM MODULE, 20 ns, SMA72 PLASTIC, SIMM-72 256K x 32 Static RAM Module
|
Cypress Semiconductor, Corp.
|
WED2ZL361MSJ-BC WED2ZL361MSJ26BI WED2ZL361MSJ42BC |
NBL SSRAM MCP 1M X 36 MULTI DEVICE SRAM MODULE, 2.6 ns, PBGA119 1M X 36 MULTI DEVICE SRAM MODULE, 4.2 ns, PBGA119
|
WHITE ELECTRONIC DESIGNS CORP
|
MCM321024 MCM321024SG20 MCM321024SG25 |
1M x 32 Bit Fast Static RAM Module 4M X 8 MULTI DEVICE SRAM MODULE, 20 ns, SMA72
|
Motorola Mobility Holdings, Inc. MOTOROLA[Motorola, Inc]
|
ET-16DI2 ET-16DI2-M ET-16DI2-H |
Ethernet I/O Module ?Discrete Inputs
|
Red Lion Controls. Inc
|
EDS11-166A |
PUM Series Multi-loop module type Temperature controller Enhanced communication Module (CC-Link) [PUMCL]
|
Fuji Electric
|
EDS11-167A |
PUM Series Multi-loop module type Temperature controller Event input/output module [PUME]
|
Fuji Electric
|
CYM1846V33PZ-35C CYM1846V33 CYM1846V33P8-12C CYM18 |
Memory 内存 512K x 32 3.3V Static RAM Module 512K X 32 MULTI DEVICE SRAM MODULE, 25 ns, PZMA72 512K x 32 3.3V Static RAM Module 512K X 32 MULTI DEVICE SRAM MODULE, 25 ns, PSMA72 512K x 32 3.3V Static RAM Module 512K X 32 MULTI DEVICE SRAM MODULE, 12 ns, PSMA72 512K x 32 3.3V Static RAM Module 512K X 32 MULTI DEVICE SRAM MODULE, 12 ns, PZMA72 512K x 32 3.3V Static RAM Module 512K X 32 MULTI DEVICE SRAM MODULE, 20 ns, PSMA72 512K x 32 3.3V Static RAM Module 512K X 32 MULTI DEVICE SRAM MODULE, 15 ns, PZMA72
|
CYPRESS[Cypress Semiconductor] Cypress Semiconductor Corp. Cypress Semiconductor, Corp.
|