| PART |
Description |
Maker |
| LFBGA-H FBGA |
Fine Pitch Ball Grid Array
|
STATSCHIP[STATS ChipPAC, Ltd.]
|
| FBGA-SD |
Fine Pitch Ball Grid Array - Stacked Die
|
STATSCHIP[STATS ChipPAC, Ltd.]
|
| BC-148 |
148-Lead Chip Scale Package Ball Grid Array
|
Analog Devices, Inc.
AD[Analog Devices]
|
| BGA-320P-M06 |
PLASTIC BALL GRID ARRAY PACKAGE 320 PIN PLASTIC
|
Fujitsu Component Limited.
FUJITSU[Fujitsu Media Devices Limited]
|
| ECG2351 ECG2352 ECG2353 ECG2355 ECG2356 ECG2357 EC |
FAN AC 60X30 230V BALL, 11cfm
FAN AC 80X38 120/230V BALL, 25cfm
FAN AC 80X38 120/230V BALL, 18cfm
FAN AC 80X35 115V BALL, 31cfm
FAN AC 80X38 115V BALL, 23cfm
FAN AC 80X38 115V BALL, 17cfm
FAN AC 80X38 220V BALL, 31cfm
FAN AC 60X30 115V BALL, 11cfm
FAN AC 80X38 120/230V BALL, 13cfm
FAN AC 254MM(10'') 230V, 700cfm
FAN AC 254MM(10'') 230V, 555cfm
FAN AC 254MM,10'' 230V BALL, 547cfm
FAN AC 254MM(10'') 230V, 600cfm
FAN AC 80X35 115V BALL, 23cfm 晶体管|晶体管|进步党| 50V五（巴西）总裁| 100mA的一（c）|2VAR
FAN AC 254MM(10") 115V, 600cfm
FAN AC 80X38 220V BALL, 17cfm
|
|
| ECG2331 ECG2326 ECG2322 ECG2328 ECG2332 ECG2333 |
FAN AC 176X89 220V BALL, 420cfm
TRANSISTOR | BJT | DARLINGTON | NPN | 100V V(BR)CEO | 8A I(C) | TO-220VAR
FAN AC 172X51 115V BALL, 106cfm
TRANSISTOR | BJT | NPN | 200V V(BR)CEO | 15A I(C) | TO-247VAR 晶体管|晶体管| npn型| 200伏五（巴西）总裁|5A一（c）|47VAR
FAN AC 180X65 115V BALL, 400cfm 晶体管|晶体管|达林顿|叩| 60V的五（巴西）总裁|甲一（c）|20
FAN AC 180X65 115V BALL, 340cfm 晶体管|晶体管|叩| 450V五（巴西）总裁| 8A条一c）| TO - 220AB现有
|
Vishay Intertechnology, Inc.
NEC, Corp.
|
| K4S56163PF K4S56163PF-F1L K4S56163PF-F90 K4S56163P |
16M X 16 SYNCHRONOUS DRAM, 6 ns, PBGA54 LEAD FREE, FBGA-54
16M X 16 SYNCHRONOUS DRAM, 7 ns, PBGA54 LEAD FREE, FBGA-54
16M X 16 SYNCHRONOUS DRAM, 6 ns, PBGA54 FBGA-54
4M x 16Bit x 4 Banks Mobile SDRAM in 54FBGA 4米16 × 4银行4FBGA移动SDRAM
CAP 47UF 350V ELECT EB SMD
|
Samsung Semiconductor Co., Ltd.
SAMSUNG SEMICONDUCTOR CO. LTD.
SAMSUNG[Samsung semiconductor]
Samsung Electronic
|
| K4M28163PF K4M28163PF-F75 K4M28163PF-R K4M28163PF- |
2M x 16Bit x 4 Banks Mobile SDRAM in 54FBGA 200万16 × 4银行4FBGA移动SDRAM
8M X 16 SYNCHRONOUS DRAM, 6 ns, PBGA54 0.80 MM PITCH, LEAD FREE, FBGA-54
8M X 16 SYNCHRONOUS DRAM, 7 ns, PBGA54 0.80 MM PITCH, LEAD FREE, FBGA-54
8M X 16 SYNCHRONOUS DRAM, 6 ns, PBGA54 0.80 MM PITCH, FBGA-54
|
Samsung Electronic
Samsung Semiconductor Co., Ltd.
Data Device, Corp.
SAMSUNG SEMICONDUCTOR CO. LTD.
SAMSUNG[Samsung semiconductor]
|
| K4M56323PG-FHE_G75 K4M56323PG-FE_G75 K4M56323PG-FC |
2M x 32Bit x 4 Banks Mobile SDRAM in 90FBGA
8M X 32 SYNCHRONOUS DRAM, 6 ns, PBGA90 LEAD FREE, FBGA-90
8M X 32 SYNCHRONOUS DRAM, 7 ns, PBGA90 FBGA-90
|
SAMSUNG SEMICONDUCTOR CO. LTD.
Elite Semiconductor Memory Technology, Inc.
Marvell Semiconductor, Inc.
|
| EP4SGX110DF29C4 EP4SGX110DF29I4N EP4SGX110DF29C2X |
FPGA, 4224 CLBS, 717 MHz, PBGA780 29 X 29 MM, FBGA-780
FPGA, 4224 CLBS, 717 MHz, PBGA780 29 X 29 MM, LEAD FREE, FBGA-780
FPGA, 4224 CLBS, 800 MHz, PBGA780 29 X 29 MM, FBGA-780
FPGA, 11648 CLBS, 800 MHz, PBGA1932 45 X 45 MM, FBGA-1932
FPGA, 11648 CLBS, 717 MHz, PBGA1932 45 X 45 MM, FBGA-1932
FPGA, 2904 CLBS, 717 MHz, PBGA780 29 X 29 MM, LEAD FREE, FBGA-780
FPGA, 7030 CLBS, 717 MHz, PBGA1152 35 X 35 MM, LEAD FREE, FBGA-1152
FPGA, 7030 CLBS, 717 MHz, PBGA1152 35 X 35 MM, FBGA-1152
|
Altera International Limited
|
| YPKG-BCCG-9287DC |
CCGA1152, 35.0 MM X 35.0 MM, 1.0 MM PITCH, 1152 SOLDER COLUMNS, CERAMIC COLUMN GRID ARRAY, DAISY CHAIN PACKAGE
|
Actel Corporation
|
|
