PART |
Description |
Maker |
AT17LV010A AT17LV010A-10JC AT17LV010A-10JI AT17C01 |
FPGA Serial Configuration Memories 512K X 1 CONFIGURATION MEMORY, PQCC20 FPGA Configuration EEPROM Memory
|
Atmel, Corp. ATMEL[ATMEL Corporation]
|
AT17F04008 AT17F040-30VJI AT17F040-30VJC |
FPGA Configuration Flash Memory
|
ATMEL Corporation 聚兴科技股份有限公司 http://
|
AT17F080 AT17F080-30BJC AT17F080-30BJI AT17F080-30 |
FPGA CONFIGURATION FLASH MEMORY 4M X 1 CONFIGURATION MEMORY, PQCC20
|
Atmel, Corp. http:// Atmel Corp. ATMEL[ATMEL Corporation]
|
AT17LV010-10DP-SV AT17LV010-10DP AT17LV010-10DP-E |
Space FPGA Configuration EEPROM 1M X 1 CONFIGURATION MEMORY, DFP28
|
Atmel, Corp. PROM Atmel Corp. ATMEL[ATMEL Corporation]
|
XC1700E XC1701LPC20C XC1701LPC20I XC1701LPD8C XC17 |
Configuration PROM. XC1700E and XC1700L Series Configuration PROMs IC,EPROM,128KX1,CMOS,DIP,8PIN,PLASTIC From old datasheet system Configuration PROMs 4M X 1 CONFIGURATION MEMORY, PQFP44 Configuration PROMs 256K X 1 CONFIGURATION MEMORY, PQCC20
|
Xilinx Inc XILINX[Xilinx, Inc] Xilinx, Inc.
|
AT17N512-10SC AT17N512-10SI |
FPGA Configuration Memory
|
ATMEL Corporation
|
XCF128XFTG64C DS617 XCF32PV0G48C |
Platform Flash XL High-Density Configuration and Storage Device 8M X 16 FLASH 1.8V PROM, 85 ns, PBGA64 Platform Flash XL High-Density Configuration
|
Xilinx, Inc.
|
AM29LV800BT-80DTC2 AM29LV800BT-80DGI2 AM29LV800BT- |
25NS,OTP CERDIP,883C; LEV B FULLY CMPLNT(EPLD) 20NS, OTP, PLCC, COM TEMP(EPLD) 20NS, SOIC, IND TEMP(EPLD) 25NS, SOIC, COM TEMP(EPLD) 20NS,OTP LCC,883C; LEVEL B FULLY CMPLNT(EPLD) 10MHZ, 8 DIP, COM TEMP(FPGA) 10MHZ, 20 PLCC, IND TEMP(FPGA) 10MHZ, 32 TQFP, COM TEMP(FPGA) 10MHZ, 44 PLCC, COM TEMP(FPGA) 30MHZ, 3.3V, 20 PLCC, COM TEMP(FPGA) 8 TSSOP,PB/HALO FREE,IND,1.8V(SERIAL EE) DIE SALE, 1.8V, 11 MIL(SERIAL EE) 8 PDIP,PB/HALO FREE,IND TEMP,1.8V(SERIAL EE) 65K CONFIG MEM, 20 PLCC, IND TEMP(FPGA) 10MHZ, 20 SOIC, IND TEMP(FPGA) 128K CONFIG MEM, 20 PLCC, COM(FPGA) EEPROM EEPROM 10MHZ, 8 NSOIC, COM TEMP(FPGA) EEPROM 512K X 16 FLASH 3V PROM, 120 ns, UUC44 10MHZ, 8 LAP, 5K MOQ(FPGA) 10MHZ, 8 N-SOIC, COM TEMP(FPGA) 10MHZ, 20 PLCC, COM TEMP(FPGA) 512K X 16 FLASH 3V PROM, 80 ns, UUC44
|
ADVANCED MICRO DEVICES INC
|
XC3330A-6PQ100C XC3390A-3PQ208C XC3330L-8PC44I XC3 |
FPGA, PQFP100 FPGA, PQFP208 FPGA, PQCC44 FPGA, PQFP64
|
XILINX INC
|
XQ1701L-SERIES XQR1701L-SERIES XQ1701LCC44M XQR170 |
Cascadable for storing longer or multiple bitstreams QPro configuration PROM. Radiation-hardened. QPro configuration PROM. SMD number 5962-9951401NXB. QPro configuration PROM. SMD number 5962-9951401QYA QPro Series Configuration PROMs (XQ) including Radiation-Hardened Series (XQR) 1M X 1 CONFIGURATION MEMORY, PDSO20 1M X 1 CONFIGURATION MEMORY, CQCC44
|
Xilinx, Inc. XILINX INC
|
|