PART |
Description |
Maker |
PC825 PC845 PC815 PC835 |
(PC815 - PC845) High Sensitivity / High Density Mounting Type Photocoupler High Sensitivity, High Density Mounting Type Photocoupler
|
SHARP[Sharp Electrionic Components]
|
HSM88WA |
MPAK package is suitable for high density surface mounting and high speed assembly
|
TY Semiconductor Co., Ltd
|
HSM88ASR |
MPAK package is suitable for high density surface mounting and high speed assembly
|
TY Semiconductor Co., Ltd
|
LTV817 LTV827 LTV847 |
HIgh Density Mounting Type Photocoupler
|
TMT[Taiwan Memory Technology] LITEON
|
PC818 |
High Density Mounting Type Photocoupler
|
Sharp Electrionic Components
|
BL817 |
High Density Mounting Type Photocoupler
|
SeCoS Halbleitertechnologie GmbH
|
BL817S |
High Density Mounting Type Photocoupler
|
SeCoS
|
PC-815 |
High Sensitivity, High Density Mounting Type Photocoupler
|
N/A
|
LTV-354T |
Hybrid substrates that require high density mounting
|
光宝科技股份有限公司
|
LTV817 LTV817M |
High Density Mounting Type Photocoupler(484.19 k)
|
LITE-ON
|
LTV-355T |
Hybrid substrates that require high density mounting Programmable controllers
|
光宝科技股份有限公司 Lite-On Technology Corporation
|