| PART |
Description |
Maker |
| 3C92 |
Material specification
|
Ferroxcube International Holding B.V.
|
| 3E27 |
Material specification
|
Ferroxcube International Holding B.V.
|
| 4A20 |
Material specification
|
Ferroxcube International Holding B.V.
|
| 3C91 |
Material specification
|
Ferroxcube International Holding B.V.
|
| 4D2 |
Material specification
|
Ferroxcube International Holding B.V.
|
| 12C671 12C672 PIC12C672-04/SM PIC12C672-04I/MF PIC |
EPROM Memory Programming Specification EPROM存储器编程规
Test Prod Wire; Conductor Size AWG:18; No. Strands x Strand Size:65 x 36; Jacket Color:White; Conductor Material:Copper; Jacket Material:Rubber; Leaded Process Compatible:Yes; Number of Conductors:1 RoHS Compliant: Yes
Multiconductor Cable; Number of Conductors:4; Conductor Size AWG:22; No. Strands x Strand Size:7 x 30; Jacket Material:Polyvinylchloride (PVC); Leaded Process Compatible:Yes; Capacitance:25pF/ft; Conductor Material:Copper RoHS Compliant: Yes
SWITCH SPDT BASIC 40GF NON-SHORT
|
Microchip Technology, Inc.
Microchip Technology Inc.
|
| XC95144XV XC95144XV-5TQ100C XC95144XV-5TQ100I DS05 |
From old datasheet system
High-Performance CPLD
Advance Product Specification
Metal Connector Backshell; Enclosure Material:Steel; Connector Type:Right-Angle; No. of Positions:25 RoHS Compliant: Yes
DB24659
144 macrocells with 3,200 usable gates
|
XILINX[Xilinx, Inc]
Xilinx, Inc.
|
| EE16-K-H-10P-SW-AW |
BOBBIN MATERIAL: PHENOLIC PIN MATERIAL: CP WIRE UL REC. UL 94V-0
|
FERYSTER Inductive Components Manufacturer
|
| EF32-K-H-14P-SW |
BOBBIN MATERIAL: PHENOLIC PIN MATERIAL: CP WIRE UL REC. UL 94V-0
|
FERYSTER Inductive Components Manufacturer
|
| EE13-K-H-8P-SW EE13-KH-8P-SW |
BOBBIN MATERIAL: PHENOLIC PIN MATERIAL: CP WIRE UL REC. UL 94V-0
|
FERYSTER Inductive Components Manufacturer
FERYSTER Inductive Comp...
|
| K4S641632H-UC60 K4S641632H-UC70 K4S641632H-UC75 K4 |
64Mb H-die SDRAM Specification 54 TSOP-II with Pb-Free (RoHS compliant) 64芯片与内存规格铅54 TSOP-II免费（符合RoHS
D-Subminiature Connector; Gender:Female; No. of Contacts:50; Contact Termination:IDC; D Sub Shell Size:DB50; Body Material:Steel; Contact Plating:Gold Over Nickel RoHS Compliant: Yes 64芯片与内存规格铅54 TSOP-II免费（符合RoHS
64Mb H-die SDRAM Specification 54 TSOP-II with Pb-Free 64芯片与内存规格铅54 TSOP-II免费
DELTA CONN 14POS PLUG W/O INSERT
DELTA CONN 14 POS PLUG BAIL LOCK
|
Samsung Semiconductor Co., Ltd.
SAMSUNG SEMICONDUCTOR CO. LTD.
SAMSUNG[Samsung semiconductor]
|
| MPC7450RXPXPND MPC7450RXPXPNS MPC7450PXPNS |
MPC7450 Specification for the XPC7450RXnnnPx Series part number specification pns
Part Number Specification for the XPC7450RXnnnPx Series
Part Number Specification for the XPC7451RXnnnPx Series
|
Motorola
|
