| PART |
Description |
Maker |
| 87914-3616 0879143616 |
2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, 36 Circuits, 2.50μm (98.4μ) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole, Dual Row, Vertical, 36 Circuits, 2.50渭m (98.4渭) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
2.54mm (.100) Pitch C-Grid垄莽 Header, Through Hole, Dual Row, Vertical, 36 Circuits, 2.50楼矛m (98.4楼矛) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
|
Molex Electronics Ltd.
|
| D9224-46 D9924-46 D9224-01 D9724-46 D9240-46 D9922 |
2.54mm Pitch Dual Row Vertical Through Connect Header Assembly, tin (hi-temp mould), 24-way DIP24, IC SOCKET
2.54mm Pitch Dual Row Vertical Through Connect Header Assembly, tin, 24-way DIP24, IC SOCKET
2.54mm Pitch Dual Row Vertical Through Connect Header Assembly, tin (hi-temp mould), 40-way DIP40, IC SOCKET
DIP22, IC SOCKET
|
Harwin PLC
HARWIN INC
|
| 90142-0006 90142-0008 90142-0010 90142-0012 90142- |
Dual Row Vertical Header and Receptacle
|
MolexKits
|
| 0554011419 55401-1419 |
2.54mm (.100) Pitch QF-50 Flat Ribbon Cable Header, Dual Row, Vertical,Shrouded Header with Eject Levers, 14 Circuits, Lead-free
MOLEX Connector
|
Molex Electronics Ltd.
|
| 0353171020 35317-1020 |
4.20mm (.165") Pitch Mini-Fit庐 Header, Dual Row, Vertical, 10 Circuits, PA Polyamide
4.20mm (.165) Pitch Mini-Fit? Header, Dual Row, Vertical, 10 Circuits, PA Polyamide
|
Molex Electronics Ltd.
|
| 0015910680 015-91-0680 |
2.54mm (.100) Pitch C-Grid? Header, Surface Mount, Dual Row, Vertical, 68 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating
2.54mm (.100) Pitch C-Grid垄莽 Header, Surface Mount, Dual Row, Vertical, 68 Circuits, 0.38楼矛m (15楼矛) Gold (Au) Selective Plating
|
Molex Electronics Ltd.
|
| 015-91-3440 |
2.54mm (.100) Pitch C-Grid庐 Header, Surface Mount, Dual Row, Vertical, 44 Circuits, 0.76渭m (30渭) Gold (Au) Selective Plating
2.54mm (.100) Pitch C-Grid? Header, Surface Mount, Dual Row, Vertical, 44 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating
|
Molex Electronics Ltd.
|
| 0015910760 015-91-0760 |
2.54mm (.100) Pitch C-Grid? Header, Surface Mount, Dual Row, Vertical, 76 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating
2.54mm (.100) Pitch C-Grid垄莽 Header, Surface Mount, Dual Row, Vertical, 76 Circuits, 0.38楼矛m (15楼矛) Gold (Au) Selective Plating
|
Molex Electronics Ltd.
|
| 35317-2020 0353172020 |
4.20mm (.165) Pitch Mini-Fit? Header, Dual Row, Vertical, 20 Circuits, PA Polyamide(Nylon) 6/6 94V-2, White
4.20mm (.165") Pitch Mini-Fit庐 Header, Dual Row, Vertical, 20 Circuits, PA Polyamide(Nylon) 6/6 94V-2, White
4.20mm (.165") Pitch Mini-Fit垄莽 Header, Dual Row, Vertical, 20 Circuits, PA Polyamide(Nylon) 6/6 94V-2, White
|
Molex Electronics Ltd.
|
| 15-80-0081 A-70567-0002 0015800081 705670002 |
2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 8 Circuits, Tin (Sn) Plating
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 8 Circuits, Tin (Sn) Plating
2.54mm (.100) Pitch C-Grid垄莽 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 8 Circuits, Tin (Sn) Plating
Molex Electronics Ltd.
|
Molex Electronics Ltd.
|
| 15-80-0105 0015800105 A-70567-0139 |
2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 10 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 10 Circuits, 0.76渭m (30渭) Gold (Au) Selective Plat
Molex Electronics Ltd.
|
Molex Electronics Ltd.
|
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