| PART |
Description |
Maker |
| A-70280-0115 0010897720 010-89-7720 |
2.54mm (.100) Pitch C-Grid? Breakaway Header, Dual Row, Vertical, High Temperature, 72 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating, 2.72mm (.107) PC Tail
2.54mm (.100") Pitch C-Grid垄莽 Breakaway Header, Dual Row
|
Molex Electronics Ltd.
|
| 0556382019 55638-2019 |
2.54mm (.100) Pitch QF-50 Flat Ribbon Cable Header, Dual Row, Right AngleShrouded Header with Eject Levers, 20 Circuits, Lead-free
|
Molex Electronics Ltd.
|
| 0015910360 015-91-0360 71308-0136N |
2.54mm (.100) Pitch C-Grid? Header, Surface Mount, Dual Row, Vertical, 36 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating
2.54mm (.100) Pitch C-Grid垄莽 Header, Surface Mount, Dual Row, Vertical, 36 Circuits, 0.38楼矛m (15楼矛) Gold (Au) Selective Plating
MOLEX Connector
|
Molex Electronics Ltd.
|
| 0015910580 015-91-0580 |
2.54mm (.100) Pitch C-Grid? Header, Surface Mount, Dual Row, Vertical, 58 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating
2.54mm (.100) Pitch C-Grid庐 Header, Surface Mount, Dual Row, Vertical, 58 Circuits, 0.38渭m (15渭) Gold (Au) Selective Plating
MOLEX Connector
|
Molex Electronics Ltd.
|
| 0015910080 015-91-0080 71308-0108N |
2.54mm (.100) Pitch C-Grid? Header, Surface Mount, Dual Row, Vertical, 8 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating
2.54mm (.100) Pitch C-Grid庐 Header, Surface Mount, Dual Row, Vertical, 8 Circuits, 0.38渭m (15渭) Gold (Au) Selective Plating
MOLEX Connector
|
Molex Electronics Ltd.
|
| D9224-46 D9924-46 D9224-01 D9724-46 D9240-46 D9922 |
2.54mm Pitch Dual Row Vertical Through Connect Header Assembly, tin (hi-temp mould), 24-way DIP24, IC SOCKET
2.54mm Pitch Dual Row Vertical Through Connect Header Assembly, tin, 24-way DIP24, IC SOCKET
2.54mm Pitch Dual Row Vertical Through Connect Header Assembly, tin (hi-temp mould), 40-way DIP40, IC SOCKET
DIP22, IC SOCKET
|
Harwin PLC
HARWIN INC
|
| 0015910740 |
2.54mm (.100) Pitch C-Grid? Header, Surface Mount, Dual Row, Vertical, 74 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating
2.54mm (.100) Pitch C-Grid垄莽 Header, Surface Mount, Dual Row, Vertical, 74 Circuits, 0.38楼矛m (15楼矛) Gold (Au) Selective Plating
|
Molex Electronics Ltd.
|
| 0554014019 55401-4019 |
2.54mm (.100) Pitch QF-50 Flat Ribbon Cable Header, Dual Row, Vertical,Shrouded Header with Eject Levers, 40 Circuits, Lead-free
MOLEX Connector
|
Molex Electronics Ltd.
|
| 55638-5019 0556385019 |
2.54mm (.100) Pitch QF-50 Flat Ribbon Cable Header, Dual Row, Right Angle,Shrouded Header with Eject Levers, 50 Circuits, Side MatingKeys, Lead-free
|
Molex Electronics Ltd.
|
| 15-80-0081 A-70567-0002 0015800081 705670002 |
2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 8 Circuits, Tin (Sn) Plating
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 8 Circuits, Tin (Sn) Plating
2.54mm (.100) Pitch C-Grid垄莽 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 8 Circuits, Tin (Sn) Plating
Molex Electronics Ltd.
|
Molex Electronics Ltd.
|
| 15-80-0143 0015800143 |
2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 14 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 14 Circuits, 0.38渭m (15渭) Gold (Au) Selective Plat
Molex Electronics Ltd.
|
Molex Electronics Ltd.
|
|
