| PART |
Description |
Maker |
| HN7G02FU |
Multi Chip Discrete Device Power Management Switch Application, Inverter Circuit Application, Driver Circuit Application and Interface Circuit Application.
|
TOSHIBA
|
| 2DU1 |
Typical UL508 Application
|
Altech corporation
|
| F-LBAND-TX F-LBAND-RX |
Typical L-BAND-Rx/Tx Application
|
THOR communications
|
| F-LAN |
Typical F-LAN Application
|
THOR communications
|
| H2PROT |
Typical application configuration for Micro RWD module
|
rfsolutions.ltd
|
| HN7G01FU |
Multi Chip Discrete Device Power Management Switch Application Driver Circuit Application Interface Circuit Application
TOSHIBA Multi Chip Discrete Device
|
TOSHIBA[Toshiba Semiconductor]
|
| BGA318 Q62702-G0043 |
From old datasheet system
Silicon Bipolar MMIC-Amplifier (Cascadable 50 W-gain block 16 dB typical gain at 1.0 GHz 12 dBm typical P-1dB at 1.0 GHz) 硅双极单片放大器（级0瓦，增益模块十六分贝典型增益.0 GHz2 dBm典型的P - 1dB的在1.0千兆赫）
Silicon Bipolar MMIC-Amplifier (Cascadable 50 W-gain block 16 dB typical gain at 1.0 GHz 12 dBm typical P-1dB at 1.0 GHz) 0 MHz - 1200 MHz RF/MICROWAVE WIDE BAND LOW POWER AMPLIFIER
|
SIEMENS[Siemens Semiconductor Group]
SIEMENS AG
|
| AN3014 |
Electrical Characterization of the MAAMSS0031 16 dB Gain Application Circuit
|
M/A-COM Technology Solutions, Inc.
|
| UPG2417T6M UPG2417T6M-E2 UPG2417T6M-E2-A |
GaAs Integrated Circuit SP6T Switch for NFC Application
|
Renesas Electronics Corporation
|
| FU-68SDF-V802M129B FU-68SDF-V802M130B FU-68SDF-V80 |
1.58 um (L-Band) DFB-LD MODULE WITH SINGLEMODE FIBER PIGTAIL (WAVELENGTH SELECTED/ BIAS CIRCUIT INTEGRATED/ DIGITAL APPLICATION)
1.58 um (L-Band) DFB-LD MODULE WITH SINGLEMODE FIBER PIGTAIL (WAVELENGTH SELECTED, BIAS CIRCUIT INTEGRATED, DIGITAL APPLICATION) 1.58微米（L波段）半导体激光器模块，单模光纤尾纤（波长选择，偏置电路集成，数字应用
1.58 um (L-Band) DFB-LD MODULE WITH SINGLEMODE FIBER PIGTAIL (WAVELENGTH SELECTED, BIAS CIRCUIT INTEGRATED, DIGITAL APPLICATION) 1.58微米L波段）半导体激光器模块，单模光纤尾纤（波长选择，偏置电路集成，数字应用
|
MITSUBISHI[Mitsubishi Electric Semiconductor]
Mitsubishi Electric Corporation
Mitsubishi Electric, Corp.
Mitsubishi Electric Sem...
|
| CWDSP1670 |
An OakDSPCore-based、Application-Specific Integrated Circuit (ASIC)(基于OakDSP内核芯片的特殊用途集成电
|
LSI Corporation
|
