| PART |
Description |
Maker |
| NHD-C12832A1Z-NSW-BBW-3V3 |
COG (Chip-On-Glass) Liquid Crystal Display Module
|
Newhaven Display International, Inc.
|
| NHD-C12864AZ-FSY-YBW-HT |
COG (Chip-On-Glass) Liquid Crystal Display Module
|
Newhaven Display International, Inc.
|
| NHD-C0220AZ-FSW-FTW |
COG (Chip-on-Glass) Liquid Crystal Display Module
|
Newhaven Display International, Inc.
|
| NHD-C12864AZ-FSY-YBW |
COG (Chip-On-Glass) Liquid Crystal Display Module
|
Newhaven Display International, Inc.
|
| DSF20060SF60 DSF20060SF DSF20060SF55 DSF20060SF56 |
Fast Recovery Diode
Chip-on-Glass (COG) Technology, 16 Characters x 2 Lines 620 A, 5500 V, SILICON, RECTIFIER DIODE
|
DYNEX SEMICONDUCTOR LTD
DYNEX[Dynex Semiconductor]
Dynex Semiconductor, Ltd.
|
| TB-39 |
HIGH FREQUENCY MINIATURE CRY STAL UNITS
|
RSG Electronic Components GmbH
|
| CPHS-FRM9D-6S-8P |
Liquid crystal polymer (LCP), glass reinforced, flame retardant in accordance with 隆掳UL 94V-0隆卤; UL file number E54705(M)
Liquid crystal polymer (LCP), glass reinforced, flame retardant in accordance with “UL 94V-0? UL file number E54705(M)
|
Ferroxcube International Holding B.V.
|
| THM362020S-10 THM362020S-80 THM362020SG-10 THM3620 |
2097152 WORDS x 36BIT DYNAMIC RAM MODULE
2,097,152 WORDS x 36BIT DYNAMIC RAM MODULE
2/097/152 WORDS x 36BIT DYNAMIC RAM MODULE
Chip-on-Glass (COG) Technology, 16 Characters x 2 Lines
|
TOSHIBA[Toshiba Semiconductor]
Toshiba Corporation
|
| ACM0802C ACM0802C-NLGS-T ACM0802C-RLGS-T ACM0802C- |
SPECIFICATIONS FOR LIQUID CRYSTAL DISPLAY
2.7-5.5V; 8characters x 2lines; dot size:0.56x0.66mm; liquid crystal display
|
AZDISPLAYS[AZ Displays]
|
| ACM1602T ACM1602T-NLTW-T ACM1602T-NLTH-T ACM1602T- |
2.7-5.5V; 16characters x 2lines; dot size:0.56x0.61mm; liquid crystal display
SPECIFICATIONS FOR LIQUID CRYSTAL DISPLAY
|
AZDISPLAYS[AZ Displays]
|
