PART |
Description |
Maker |
BM-10EG58MD |
hi-eff red chips and green chips, the hi-eff red chips are made from GaAsP on GaP substrate, the green chips are made from GaP on GaP substrate.
|
BRIGHT LED ELECTRONICS CORP
|
BD-A304ND |
hi-eff red chips, GaAsP on GaP substrate
|
BRIGHT LED ELECTRONICS CORP
|
BD-A404ND |
hi-eff red chips, GaAsP on GaP substrate.
|
BRIGHT LED ELECTRONICS CORP
|
BD-E524RD |
hi-eff red chips, which are made from GaAsP on GaP substrate
|
BRIGHT LED ELECTRONICS CORP
|
BA-3E12UW |
hi-eff red chips, which are made from GaAsP on GaP substrate
|
BRIGHT LED ELECTRONICS CORP
|
BD-F304RD |
800mA Buck Converter for 3G RFPAs, WL-CSP-12, Tape & Reel hi-eff red chips, which are made from GaAsP on GaP substrate.
|
Bright LED Electronics Corp.
|
BR-B4534-15V |
GaAsP/GaP Hi-Eff Red For DC and pulse operation.
|
http://
|
BL-HE133A-TRB |
Hi-Eff Red Suitable for all SMT assembly methods.
|
Bright LED Electronics Corp.
|
BL-HE1G034B-TRB |
Hi-Eff Red and Suitable for all SMT assembly methods.
|
Bright LED Electronics Corp.
|
BR-B4534-05V |
GaAsP/GaP Hi-Eff Red For DC and pulse operation.
|
BRIGHT LED ELECTRONICS CORP
|
BL-R4530N |
GaAsP/GaP Hi-Eff Red Low power consumption.
|
BRIGHT LED ELECTRONICS CORP
|