PART |
Description |
Maker |
73K224L-28IH 73K224L-IP 73K224L-IH 73K224L-IGT 73K |
V.22bis/V.22/V.21/ Bell 212A/Bell 103 Single-Chip Modem V.22bis/V.22/V.21 /贝尔212A/Bell 103单芯片调制解调器
|
http:// TDK, Corp. TDK Corporation ETC
|
73K222BL-IGT 73K222BL-IH 73K224AL 73K224BL |
V.22, V.21, Bell 212A, Bell 103 Single-Chip Modem with Integrated Hybrid
|
http://
|
CMX624D2 CMX624D5 CMX624P4 |
V.23 / Bell 202 Modem
|
CML Microcircuits
|
CMX644AD2 CMX644AD5 |
V.22 and Bell 212A Modem
|
CML Microcircuits
|
HT-2811 |
Ding Dong Door Bell
|
Holtek
|
XR2129 XR2128 XR2126 XR2127 XR-2126 XR-2127 XR-212 |
Bell 212A / CCITT V.22 Modem Filters
|
Exar
|
M1D-95 |
DUAL TONE WIRELESS DOOR BELL
|
Electronic Theatre Controls, Inc. List of Unclassifed Manufacturers ETC[ETC] MOSDESIGN SEMICONDUCTOR CORP
|
73K222AL 73K222AL-IGT 73K222AL-IH 73K222AL-IP |
V.22/ V.21/ Bell 212A/ 103 Single-Chip Modem V.22, V.21, Bell 212A, 103 Single-Chip Modem
|
ETC TDK Corporation
|
73K222AL 73K222AL-IGT 73K222AL-IH 73K222AL-IP 73K2 |
V.22, V.21, Bell 212A, 103 Single-Chip Modem
|
TDK Electronics ETC TDK Semiconductor
|
KA2411 KA2410 |
THE KA2410/KA2411 IS A BIPOLAR INTEGRATED CIRCUIT DESIGNED FOR TELEPHONE BELL REPLACEMENT
|
SAMSUNG[Samsung semiconductor]
|
0585500002 |
HMC?/a> Rectangular Industrial End Bell Cap Assembly, PG29, 20.00 to 25.00 dia. WireSize, Orange Bush, for External Threaded Hoods
|
Molex Electronics Ltd.
|
0585500003 |
HMC?/a> Rectangular Industrial End Bell Cap Assembly, PG29, 24.00 to 28.00 dia. WireSize, Yellow Bush, for External Threaded Hoods
|
Molex Electronics Ltd.
|