| PART |
Description |
Maker |
| X2-DFN0806-3 SOT89-5 U-DFN3030-14 TSOT25 U-DFN2020 |
SUGGESTED PAD LAYOUT
PACKAGE OUTLINE DIMENSIONS
SUGGESTED PAD LAYOUT
|
Diodes Incorporated
|
| PG-TO251-3-21 |
Package Outline / Marking Layout
|
Infineon
|
| P2NQ |
For suggested pad layout, see drawing: PAD-01
|
All Sensors Corporation
|
| 21-0109B |
PACKAGE OUTLINE, 10L uMAX, EXPOSED PAD
|
Maxim Integrated Products, Inc.
MAXIM - Dallas Semiconductor
|
| 21-0111 |
PACKAGE OUTLINE, 8L SOIC,150 EXPOSED PAD
|
Maxim Integrated Products
|
| 21-0108 |
PACKAGE OUTLINE, TSSOP 4.4MM BODY, EXPOSED PAD
|
Maxim Integrated Products
|
| ZTT-MT-20.000 ZTT-MX-20.000 ZTT-MG-20.000 ZTA ZTA- |
2 Pad and 3 Pad Ceramic Package, 5.5 mm x 10 mm
|
ILSI America LLC
|
| AP2305BGN-HF AP2305BGN-HF-14 |
4.2 A, 20 V, 0.053 ohm, P-CHANNEL, Si, POWER, MOSFET HALOGEN FREE AND ROHS COMPLIANT PACKAGE-3
Simple Drive Requirement, Small Package Outline
|
Advanced Power Electronics, Corp.
Advanced Power Electronics Corp.
Advanced Power Electron...
|
| TO92 |
Through hole, 3 pin package Package outline
|
Zetex Semiconductors
|
| J20.BPACKAGE |
20 PAD CERAMIC LEADLESS CHIP CARRIER PACKAGE
|
Intersil Corporation
|
