| PART |
Description |
Maker |
| 21-0108 |
PACKAGE OUTLINE, TSSOP 4.4MM BODY, EXPOSED PAD
|
Maxim Integrated Products
|
| ZTACV ZTACV-MX-20.000 ZTTCV-MX-20.000 |
2 Pad and 3 Pad Ceramic Package, 3.1 mm x 3.7 mm
|
ILSI America LLC
|
| MK2761ASTR MK2761A MK2761AS MK2761ASLF MK2761ASLFT |
Package Outline and Package Dimensions (16-pin SOIC, 150 Mil. Narrow Body)
|
ICST[Integrated Circuit Systems]
|
| 8SOIC |
8 PIN SOIC PACKAGE OUTLINE
8 PIN SOIC PACKAGE OUTLINE
|
SMSC[SMSC Corporation]
|
| WCSMCFC-32.768KHZ- WCSMCF-32.768KHZ-6 WCSMCC-32.76 |
4 Pad Ceramic SMD Package
|
MMD Components
http://
|
| AP2301BGN-HF AP2301BGN-HF-14 |
2.8 A, 20 V, 0.13 ohm, P-CHANNEL, Si, POWER, MOSFET HALOGEN FREE AND ROHS COMPLIANT PACKAGE-3
Simple Drive Requirement, Small Package Outline
|
Advanced Power Electronics, Corp.
Advanced Power Electronics Corp.
Advanced Power Electron...
|
| IL3Y-HX5F6.0-32.768 IL3Y-HX5F12.5-32.768 |
2 Pad Glass Package Quartz Crystal, 1.5 mm x 4.1 mm
|
ILSI America LLC
|
| ILCX20-FJ0F18-20.000 ILCX20-FJ2F18-20.000 ILCX20-F |
4 Pad Ceramic Package Quartz Crystal, 1.2 mm x 1.6 mm
|
ILSI America LLC
|
| TO92 |
Through hole, 3 pin package Package outline
|
Zetex Semiconductors
|
| J20.BPACKAGE |
20 PAD CERAMIC LEADLESS CHIP CARRIER PACKAGE
|
Intersil Corporation
|
