| PART |
Description |
Maker |
| P2AM4 |
22 mm Thermoplastic Enclosure Mushroom Momentary Operator
|
Altech corporation
|
| P2AP8 P2APX P2AP2 P2AP3 P2AP6 P2AP4 |
22 mm Thermoplastic Enclosure Projecting Push Button P2APx
|
Altech corporation
|
| 4-001-Q-10 |
22 mm Thermoplastic Enclosure White/Black Operator Capacity 1
|
Altech corporation
|
| 3602 |
Enclosure; Enclosure Material:Aluminum; External Height:3"; External Width:2.63"; External Depth:1.65"; Enclosure Color:Blue; Leaded Process Compatible:Yes; Peak Reflow Compatible (260 C):Yes
|
POMONA ELECTRONICS
|
| SYM53C040 |
An Enclosure Services Processor With Programmable,Multipurpose IO (MPIO) pins For Enclosure Monitoring4 Programmable, Multipurpose IO pins For Visual LED Indicators(MPLED)(外围设备服务处理器（带可编程多功能接口引脚，24个可编程多功能可视LED指示引脚
|
LSI Corporation
|
| BGY887BO BGY887BO_FC1 BGY887BO/FC1 |
Optical receiver module
90 Series LCD Case; Enclosure Material:Plastic; External Height:1.25"; External Width:3.6"; External Depth:5.7"; Enclosure Color:Black; Battery Sizes Accepted:9V RoHS Compliant: Yes 光接收模
|
PHILIPS[Philips Semiconductors]
NXP Semiconductors N.V.
|
| 28LV011RPFB-25 28LV011RPFE-25 28LV011RT1FE-25 28LV |
3.3V 1 Megabit (128K x 8-Bit) EEPROM 3.3V兆位28K的8位）的EEPROM
PN Series Box Enclosure; NEMA Type:1, 2, 4, 4X, 12, 13; Enclosure Material:Polycarbonate; External Height:3.54"; External Width:6.3"; External Depth:9.45"; Enclosure Color:Gray 128K X 8 EEPROM 3V, 200 ns, DFP32
3.3V 1 Megabit (128K x 8-Bit) EEPROM 3.3V兆位28K的8位）EEPROM
3.3V 1 Megabit (128K x 8-Bit) EEPROM 128K X 8 EEPROM 3V, 200 ns, DFP32
|
Maxwell Technologies, Inc
|
| 4384 |
Thermoplastic Box With Card Guides
|
Pomona Electronics
|
| P-MUSB-E151-XX |
USB HOUSING: ENGINEERING THERMOPLASTIC
|
Amphenol Corporation
|
| 89885-850HLF 89885-802HLF 89885-350HLF 89885-450HL |
HOUSING MATERIAL: THERMOPLASTIC GLASS FILLED FLAME RETARDANT PER UL 94V-0
|
FCI connector
|
| 89891-302HLF 89891-350HLF 89891-402HLF 89891-450HL |
HOUSING MATERIAL: THERMOPLASTIC GLASS FILLED FLAME RETARDANT PER UL 94V-0
|
FCI connector
|
| STK12C68-IM STK12C68-L45IM STK12C68-L35IM STK12C68 |
NVRAM (EEPROM Based) NVRAM中（EEPROM的基础
Fuse Holder; Mounting Type:PC Board; Body Material:Thermoplastic; Contact Material:Beryllium Copper; Contact Plating:Tin; Current Rating:3.5A; Leaded Process Compatible:Yes; Peak Reflow Compatible (260 C):Yes; Series:154
Fuse Holder; Mounting Type:PC Board; Body Material:Thermoplastic; Contact Material:Beryllium Copper; Contact Plating:Tin; Current Rating:1.5A; Leaded Process Compatible:Yes; Peak Reflow Compatible (260 C):Yes; Series:154
Fuse Holder; Mounting Type:PC Board Surface Mount; Body Material:Thermoplastic; Contact Material:Beryllium Copper; Contact Plating:Tin; Current Rating:1.5A; Leaded Process Compatible:Yes; Peak Reflow Compatible (260 C):Yes
Fuse Holder; Body Material:Thermoplastic; Current Rating:3A; Leaded Process Compatible:Yes; Peak Reflow Compatible (260 C):Yes; Series:154; Contact Material:Beryllium Copper; Contact Plating:Tin; Mounting Type:PC Board RoHS Compliant: Yes
Fuse Holder; Body Material:Thermoplastic; Current Rating:5A; Leaded Process Compatible:Yes; Peak Reflow Compatible (260 C):Yes; Series:154; Contact Material:Beryllium Copper; Contact Plating:Tin; Mounting Type:PC Board RoHS Compliant: Yes
FUSE 5A LITTLEFUSE 154005
CMOS nvSRAM 8K x 8 AutoStore Nonvolatile Static RAM Industrial Temperature/Military Screen
|
N.A.
ETC[ETC]
List of Unclassifed Manufacturers
|
