| PART |
Description |
Maker |
| PS7122A-2A PS7122A-1A PS7122AL-1A PS7122AL-1A-E4 P |
OCMOS FET
High Voltage and High Speed power MOSFET and IGBT Half Bridge Driver in a 8-pin DIP package; A IR2308 packaged in a 8-Lead SOIC
Dual Low Side Driver, Inverting Input in a 8-pin DIP package; A IR4426 packaged in a 8-Lead SOIC
1200V Half Bridge Driver IC for Power Switching Applications in a 24 Lead SSOP package; A IR2214 packaged in a Lead-Free 24 Lead SSOP
FET-OUTPUT OPTOCOUPLER
Single High Side Driver, Current Limiting, Programmable Shutdown Error Pin in a 8-pin DIP package; A IR2125 packaged in a Lead-Free 16-Lead SOIC shipped on Tape and Reel
Half Bridge Driver, Single Input Plus Inverting Shutdown Pin, Fixed 520ns Deadtime in a 8-pin DIP package; A IR2104 packaged in a Lead-Free 8-Lead PDIP
OCMOS场效应管
Optical Coupled MOS FET photocoupler(MOS 场效应管输出光光隔离器) 光纤耦合场效应晶体管光电耦合器（简称MOS场效应管输出光光隔离器
|
NEC, Corp.
|
| TGA4915-EPU-CP |
Ka-Band 7 W Packaged Amplifier
7 W Ka Band Packaged Power Amplifier
|
TRIQUINT[TriQuint Semiconductor]
|
| AM29707DC AM29707LC AM29707PC AM29705/BXA AM29705A |
Dual Low Side Driver in a 8-pin DIP package; A IR4427 packaged in a 8-Lead PDIP
High and Low Side Driver, SoftTurn-On, Noninverting Inputs, Separate High and Low Side Inputs in a 8-pin DIP package; A IR2181 packaged in a Lead-Free 8-Lead SOIC
Half Bridge Driver, Soft Turn-On, Single Input Plus Shut-Down, All high Voltage Pins on One Side, Programmable 540-5000ns Deadtime in a 14-pin DIP package; A IRS21094 packaged in a Lead-Free 14-Lead SOIC
High voltage, high speed power MOSFET and IGBT driver with dependent high side and low side referenced output channels packaged in a 8-Pin SOIC; A IRS2609DSPBF with Standard Packaging
x4 SRAM
Half Bridge Driver, Soft Turn-On, Single Input Plus Shut-Down, All high Voltage Pins on One Side, Programmable 540-5000ns Deadtime in a 14-pin DIP package; A IRS21094 packaged in a Lead-Free 14-Lead PDIP
High and Low Side Driver, SoftTurn-On, Noninverting Inputs, Separate High and Low Side Inputs in a 8-pin DIP package; A IR2181 packaged in a 8-Lead SOIC
x4SRAM
|
|
| PD25 PD26 PD24 PS56 PS85 PS88 PS58 PS87 PS560 PS58 |
3 Phase Driver, Soft Turn-on, Inverting Input Separate High and Low Side Inputs, 200ns Deadtime.; A IR21363 packaged in a Lead-Free 28-Lead PDIP
3 Phase Driver, Separate High and Low Side Inputs, 200ns Deadtime in a 28-pin DIP package; A IR2135 packaged in a Lead-Free 28-Lead SOIC
High and Low Side Driver, All High Voltage Pins On One Side, Separate Logic and Power Ground, Shut-Down in a 14-pin DIP package; A IR2110 packaged
Half Bridge Driver, SoftTurn-On, Low Side Inverting Input, Separate High and Low Side Input, 500ns Deadtime in a 8-pin DIP package; A IR2183 packaged
3 Phase Driver, Soft Turn-on, Inverting Input Separate High and Low Side Inputs, 200ns Deadtime.; A IR21363 packaged in a Lead-Free 28-Lead SOIC
3 Phase Driver, Soft Turn-on, Inverting Input Separate High and Low Side Inputs, 200ns Deadtime.; A IR21367 packaged in a 28-Lead PDIP
Half Bridge Driver, Soft Turn-On, Single Input Plus Shut-Down, Fixed 500ns Deadtime in a 8-pin DIP package; A IR2109 packaged in a Lead-Free 8-Lead
Single High Side Driver, Noninverting Input in a 8-pin DIP package; A IR2117 packaged in a 8-Lead SOIC
High and Low Side Driver in a 14-pin DIP package; A IR2010 packaged in a Lead-Free 16-Lead SOIC
Half Bridge Driver, Soft Turn-On, Single Input Plus Shut-Down, Fixed 500ns Deadtime in a 8-pin DIP package; A IR2109 packaged in a 8-Lead SOIC
and Power Ground, Programmable Deadtime in a 14-pin DIP package; A IR21834 packaged in a 14-Lead PDIP
Single High Side Driver, Noninverting Input in a 8-pin DIP package; A IR2117 packaged in a 8-Lead PDIP
High voltage, high speed power MOSFET and IGBT driver with three independent high side and low side referenced output channels and with DC Bus
Single High Side Driver, Noninverting Inputs, Current Sensing, Overcurent Detection and Shutdown Fault Output in a 8-pin DIP package; A IR2127
Analog IC 模拟IC
3 Phase Driver, Separate High and Low Side Inputs, 200ns Deadtime in a 28-pin DIP package; A IR2135 packaged in a 28-Lead SOIC shipped on Tape and Reel 模拟IC
High and Low Side Driver, All High Voltage Pins On One Side, Separate Logic and Power Ground, Shut-Down in a 14-pin DIP package; A IR2110 packaged in a 16-Lead SOIC shipped on Tape and Reel
|
Lattice Semiconductor, Corp.
|
| ESD5Z7.0T1G ESD5Z7.0T1 ESD5Z12T1 ESD5Z12T1G ESD5Z2 |
TRANSIENT VOLTAGE SUPPRESSORS MICRO−PACKAGED DIODES FOR ESD PROTECTION
Transient Voltage Suppressors Micro−Packaged Diodes for ESD Protection 174 W, UNIDIRECTIONAL, SILICON, TVS DIODE
Transient Voltage Suppressors Micro−Packaged Diodes for ESD Protection 181 W, UNIDIRECTIONAL, SILICON, TVS DIODE
Transient Voltage Suppressors Micro−Packaged Diodes for ESD Protection 200 W, UNIDIRECTIONAL, SILICON, TVS DIODE
Transient Voltage Suppressors Micro−Packaged Diodes for ESD Protection 158 W, UNIDIRECTIONAL, SILICON, TVS DIODE
|
http://
ONSEMI[ON Semiconductor]
|
| PB-CGB7015-SP-0000 CGB7015-BD CGB7015-SC CGB7015-S |
DC-8.0 GHz InGaP HBT, MMIC or Packaged, Matched Gain Block Amplifier 0 MHz - 8000 MHz RF/MICROWAVE WIDE BAND LOW POWER AMPLIFIER
DC-8.0 GHz InGaP HBT, MMIC or Packaged Matched Gain Block Amplifier
|
Mimix Broadband, Inc.
MIMIX[Mimix Broadband]
|
| APD0520-210 APD0805-219 APD0810-203 APD0505-210 AP |
Silicon PIN Diodes, Hermetic Ceramic Packaged and Bondable for Switching Applications
Silicon PIN Diodes, Hermetic Ceramic Packaged and Bondable for Attenuator Applications
|
Skyworks Solutions
|
| FPD1500P100 |
1W PACKAGED POWER PHEMT
|
Filtronic Compound Semiconductors
|
| TGC4405-SM |
17 - 27 GHz Packaged Upconverter
|
TriQuint Semiconductor, Inc.
|
| LP3000P100 |
PACKAGED 2W POWER PHEMT
|
Filtronic Compound Semi...
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