| PART |
Description |
Maker |
| MX23C1100PC-15 |
x8 or x16 ROM (Mask Programmable) x8或x16光盘（掩模可编程
|
IDEC, Corp.
|
| LH534Y00U |
x16 ROM (Mask Programmable) x16光盘（掩模可编程
|
Intersil, Corp.
|
| UPD23C64040BLGY-XXX-MK UPD23C64040BLGY-XXX-MJ |
x8 or x16 ROM (Mask Programmable) x8或x16光盘（掩模可编程
|
NEC, Corp.
|
| GM23C4100A-15 |
x8 or x16 ROM (Mask Programmable) x8或x16光盘（掩模可编程
|
Macronix International Co., Ltd.
|
| HN62V454BCP-20 |
x8 or x16 ROM (Mask Programmable) x8或x16光盘（掩模可编程
|
TE Connectivity, Ltd.
|
| AM27X4096-200PC AM27X4096-150PI AM27X4096-125PC AM |
x16 ROM (Mask Programmable) x16光盘（掩模可编程
|
Rochester Electronics, LLC
Advanced Micro Devices, Inc.
|
| UPD23C32000AGY-XXX-MJH UPD23C32000AGY-XXX-MKH UPD2 |
x8 or x16 ROM (Mask Programmable)
HITFET, TEMPFET - Smart Low-Side Switches x8或x16光盘（掩模可编程
|
NEC, Corp.
|
| UPD703100AGJ-33-UEN UPD703100GJ-33-UEN UPD703101AG |
ROM-less version; Internal RAM: 4K bytes
Mask ROM version; Mask ROM: 96K bytes; Internal RAM: 4K bytes
Mask ROM version; Mask ROM: 128K bytes; Internal RAM: 4K bytes
Flash version; Internal flash: 128K bytes; Internal RAM: 4K bytes
32-bit RISC microcontroller (V850E/MS2:ROMless,Internal RAM: 4 KB)
|
NEC
|
| A23W9308 A23W9308L A23W9308M |
524.288 X 8 BIT CMOS MASK ROM 524.288 × 8位CMOS掩膜ROM
524,288 X 8 BIT CMOS MASK ROM
120ns/5.0V; 150ns/3.0V 254,288 x 8bit CMOS MASK ROM
|
Stancor
AMIC Technology
|
| MX23C4000 MX23C4000MC-10 MX23C4000MC-12 MX23C4000M |
4M-BIT MASK ROM (8 BIT OUTPUT) 512K X 8 MASK PROM, 150 ns, PDSO32
4M-BIT MASK ROM (8 BIT OUTPUT) 512K X 8 MASK PROM, 90 ns, PDIP32
|
Macronix International Co., Ltd.
|
| MX23L1610 MX23L1610MC-10 MX23L1610MC-12 MX23L1610M |
3.3 Volt 16-Mbit (2M x 8 / 1M x 16) Mask ROM 1M X 16 MASK PROM, 150 ns, PDSO44
|
PROM
Macronix International Co., Ltd.
|
| MX23L8103TC-70 MX23L8103TC-90 |
8M-BIT MASK ROM 512K X 16 MASK PROM, 70 ns, PDSO48
8M-BIT MASK ROM 512K X 16 MASK PROM, 90 ns, PDSO48
|
Fujitsu, Ltd.
Macronix International Co., Ltd.
|
