| PART |
Description |
Maker |
| AN1235 |
FLIP-CHIP CSP: PACKAGE DESCRIPTION AND RECOMMENDATIONS FOR USE
|
SGS Thomson Microelectronics
|
| MFN5- QRDM-CSP01 |
Flip Chip CSP DIODE
|
Formosa MS
|
| FCRN303 FCRN3031003FA |
Percision thin film resistor CSP
0805 PRECISION THIN FILM RESISTOR CSP (CHIP SCALE PACKAGE)
|
CALMIRCO[California Micro Devices Corp]
|
| NP383-28804-N NP383-28804-P NP383-84107-N NP383-84 |
Chip Scale Package -TH (CSP, 0.50mm Pitch)
|
Yamaichi Electronics Co., Ltd.
|
| NP284-26409N NP284-26409P |
Chip Scale Package (CSP, 0.50mm Pitch)
|
Yamaichi Electronics Co., Ltd.
|
| CHF5KP30A CHF5KP50A CHF5KP110CA MSC0997 CHF5KP65A |
Patented Flip Chip Series
FLIP CHIP TVS DIODES
From old datasheet system
Transient Voltage Suppressor 瞬态电压抑制器
5000 W, BIDIRECTIONAL, SILICON, TVS DIODE FLIP CHIP-2
|
MICROSEMI[Microsemi Corporation]
Atmel, Corp.
Microsemi, Corp.
Vishay Intertechnology, Inc.
|
| CPL-WBF-00D3 |
Flip Chip package
|
STMicroelectronics
|
| CHF15KE10 CHF15KE10A CHF15KE12 CHF15KE12A CHF15KE1 |
FLIP CHIP TVS DIODES
Patented Flip Chip Series 专利倒装芯片系列
From old datasheet system
Transient Voltage Suppressor
FLIP CHIP TVS DIODES 1500 W, UNIDIRECTIONAL, SILICON, TVS DIODE
CAP,CERAMIC,470PF,5%,50V,BOX,0.120(3.1)HX0.100(2.5 )TX0.138(3.5)LX0.100(2.5)LSX0 倒装芯片TVS二极
|
Microsemi, Corp.
MICROSEMI[Microsemi Corporation]
|
| CSPESD303G CSPESD301 CSPESD301G CSPESD302 CSPESD30 |
1, 2 and 3-Channel ESD Arrays in Chip Scale Package
1,2 and 3-Channel ESD Arrays in CSP 1,23通道的ESD阵列的总警
|
CALMIRCO[California Micro Devices Corp]
California Micro Devices Corporation
|
| MP1400GC |
7V Input, 0.6A Peak, 1.5MHz Negative DCDC Power Converter In 8-ball CSP Package
|
Monolithic Power System...
|
| P6SMBJ8.0 P6SMBJ8.0A P6SMBJ8.0C P6SMBJ6.0 P6SMBJ6. |
3.3V ECL 4-Input OR/NOR; Package: TSSOP 8 3.0x3.0x0.95 mm; No of Pins: 8; Container: Rail; Qty per Container: 100
5V ECL Quint 2-Input XOR/XNOR Gate; Package: 28 LEAD PLCC; No of Pins: 28; Container: Tape and Reel; Qty per Container: 500
Quad 4-Input OR/NOR Gate; Package: 28 LEAD PLCC; No of Pins: 28; Container: Rail; Qty per Container: 37
5V ECL 1:9 Differential PECL/NECL RAMBus Clock Buffer; Package: 28 LEAD PLCC; No of Pins: 28; Container: Rail; Qty per Container: 37
3.3V ECL Differential Clock D Flip-Flop; Package: SOIC-8 Narrow Body; No of Pins: 8; Container: Tape and Reel; Qty per Container: 2500
5V ECL 2-Input Differential AND/NAND; Package: TSSOP 8 3.0x3.0x0.95 mm; No of Pins: 8; Container: Rail; Qty per Container: 100
5V ECL 2-Input XOR/XNOR; Package: SOIC-8 Narrow Body; No of Pins: 8; Container: Rail; Qty per Container: 98
3.3V ECL Differential Clock D Flip-Flop; Package: TSSOP 8 3.0x3.0x0.95 mm; No of Pins: 8; Container: Tape and Reel; Qty per Container: 2500
NECL OUTPUT TRANSLATOR; Package: SOIC-20 WB; No of Pins: 20; Container: Tape and Reel; Qty per Container: 1000
3.3V ECL ÷2 Divider; Package: TSSOP 8 3.0x3.0x0.95 mm; No of Pins: 8; Container: Rail; Qty per Container: 100
5V ECL Divide by 2 Divider; Package: SOIC-8 Narrow Body; No of Pins: 8; Container: Rail; Qty per Container: 98
5V ECL Divide by 2 Divider; Package: TSSOP 8 3.0x3.0x0.95 mm; No of Pins: 8; Container: Rail; Qty per Container: 100
3.3V ECL 1:5 Clock Distribution Chip; Package: SOIC-20 WB; No of Pins: 20; Container: Rail; Qty per Container: 38
3.3V / 5V ECL Dual Differential 2:1 Multiplexer; Package: SOIC-20 WB; No of Pins: 20; Container: Rail; Qty per Container: 38
3.3V ECL Triple D-Type Flip-Flop with Set and Reset; Package: SOIC-20 WB; No of Pins: 20; Container: Rail; Qty per Container: 38
3.3V Dual Differential LVPECL to LVTTL Translator; Package: SOIC-8 Narrow Body; No of Pins: 8; Container: Rail; Qty per Container: 98 表面贴装瞬态电压抑制器
SURFACE MOUNT TRANSIENT VOLTAGE SUPPRESSOR 表面贴装瞬态电压抑制器
ECL/TTL Clock Driver; Package: 28 LEAD PLCC; No of Pins: 28; Container: Rail; Qty per Container: 37 表面贴装瞬态电压抑制器
BBG ECL COUNTER 6BIT; Package: 28 LEAD PLCC; No of Pins: 28; Container: Tape and Reel; Qty per Container: 500 表面贴装瞬态电压抑制器
2.5V / 3.3V 1:5 Dual Differential ECL/PECL/HSTL Clock Driver; Package: 32 LEAD LQFP 7x7, 0.8P; No of Pins: 32; Container: Tray; Qty per Container: 250
2.5V / 3.3V ECL ÷2, ÷4, ÷8 Clock Generation Chip; Package: SOIC 16 LEAD; No of Pins: 16; Container: Rail; Qty per Container: 48
SURFACE MOUNT TRANSIENT VOLTAGE SUPPRESSOR
|
http://
TRSYS
Transys Electronics Ltd.
Transys Electronics, Ltd.
|
| K4M56163PE-RG K4M56163PE-R K4M56163PE-F90 K4M56163 |
4M x 16Bit x 4 Banks Mobile SDRAM in 54FBGA 4米16 × 4银行4FBGA移动SDRAM
16M X 16 SYNCHRONOUS DRAM, 7 ns, PBGA54 0.80 MM PITCH, CSP-54
16M X 16 SYNCHRONOUS DRAM, 7 ns, PBGA54 0.80 MM PITCH, LEAD FREE, CSP-54
|
Samsung Semiconductor Co., Ltd.
Omron Electronics, LLC
SAMSUNG SEMICONDUCTOR CO. LTD.
Samsung Electronic
SAMSUNG[Samsung semiconductor]
|
