PART |
Description |
Maker |
LH532000BN-15 LH532000BTR-15 LH532000BT-12 |
x8 or x16 ROM (Mask Programmable) x8或x16光盘(掩模可编程
|
Samsung Semiconductor Co., Ltd.
|
HN62V454BCP-20 |
x8 or x16 ROM (Mask Programmable) x8或x16光盘(掩模可编程
|
TE Connectivity, Ltd.
|
UPD23C128000LGY-XXX-MJ UPD23C128000LGY-XXX-MK |
XWAY ADM5120 x8 or x16 ROM (Mask Programmable) x8或x16光盘(掩模可编程
|
NEC, Corp.
|
UPD23C32000AGY-XXX-MJH UPD23C32000AGY-XXX-MKH UPD2 |
x8 or x16 ROM (Mask Programmable) HITFET, TEMPFET - Smart Low-Side Switches x8或x16光盘(掩模可编程
|
NEC, Corp.
|
HN624116FB-25L HN624116FB-30L HN624116F-30L HN6241 |
x8 or x16 ROM (Mask Programmable) Bottom entry type connector, Two-piece connector; HRS No: 547-0370-4 02; Contact Mating Area Plating: Gold x8或x16光盘(掩模可编程
|
TE Connectivity, Ltd.
|
UPD23C64040ALGY-XXX-MK UPD23C64040ALGY-XXX-MJ |
HiRel Silicon Diodes; Package: --; Package: -; IF (max): -; VBR (min): -; rF (typ): -; CT (max): - x8 or x16 ROM (Mask Programmable) x8或x16光盘(掩模可编程
|
NEC, Corp.
|
MX23L6414XI-12G |
64M-BIT MASK ROM 4M X 16 MASK PROM, 120 ns, PBGA64
|
Macronix International Co., Ltd.
|
MX23L6422 MX23L6422MC-11 MX23L6422MC-12 MX23L6422Y |
3.3 Volt 64M-BIT (4M x 16 / 2M x 32) Mask ROM with Page Mode 2M X 32 MASK PROM, 120 ns, PDSO86
|
Macronix International Co., Ltd.
|
HT23C040 23C040 |
CMOS 512Kx8-Bit Mask ROM From old datasheet system CMOS 512K8-Bit Mask ROM
|
HOLTEK[Holtek Semiconductor Inc]
|
MX23L3213TI-90G MX23L3213TC-90G |
32M-BIT MASK ROM 2M X 16 MASK PROM, 90 ns, PDSO48
|
Macronix International Co., Ltd.
|
LC371000SM |
1M Mask Rom Internal Clocked Silicon Gate(1M带内部定时硅门的掩膜 ROM) 100万掩模ROM内部时钟硅门100万带内部定时硅门的掩膜光盘)
|
Sanyo Electric Co., Ltd.
|
MX23C2100 23C2100 MX23C2100PC-15 MX23C2100PC-12 |
2M-BIT 256K x 8/128K x 16 CMOS MASK ROM From old datasheet system 2M-BIT [256K x 8/128K x 16] CMOS MASK ROM
|
MCNIX[Macronix International] Macronix 旺宏
|